Patents by Inventor Keisuke Fujito

Keisuke Fujito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11545277
    Abstract: Bendability of a copper alloy wire is improved without decrease in an electrical conductivity of the copper alloy wire made of copper alloy containing zirconium. A cable includes: a two-core stranded wire formed by intertwining two electrical wires made of a conductor and an insulating layer covering the conductor; a filler formed around the two-core stranded wire; and a sheath formed around the filler and the electrical wire. The conductor is a copper alloy wire in which a precipitate containing the zirconium disperses, and has a crystal gain diameter that is equal to or smaller than 1 ?m, an electrical conductivity that is equal to or higher than 87% IACS, and a tensile stress that is equal to or larger than 545 MPa.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: January 3, 2023
    Assignee: Hitachi Metals, Ltd.
    Inventors: Kazuhisa Takahashi, Shohei Hata, Hiromitsu Kuroda, Toru Sumi, Kazuya Nishi, Keisuke Fujito, Takayuki Tuji
  • Patent number: 11476024
    Abstract: An insulated electric wire is composed of a conductor composed of a copper material, and an electrical insulating layer provided on an outer periphery of the conductor. For the constituent conductor of the insulated electric wire, in an orientation intensity ratio obtained by X-ray diffraction of a transverse cross section of the conductor, an intensity in a [200] crystal orientation is higher than an intensity in a [111] crystal orientation.
    Type: Grant
    Filed: May 14, 2020
    Date of Patent: October 18, 2022
    Assignee: Hitachi Metals, Ltd.
    Inventors: Keisuke Fujito, Shohei Hata, Hiromitsu Kuroda, Takayuki Tuji
  • Publication number: 20220203433
    Abstract: A manufacturing efficiency of the wire rod made of the cast alloy including the additive element having the high activity to the oxygen is improved. An apparatus of manufacturing a wire rod includes: a tundish storing a molten metal; a mold for use in continuously casting the molten metal fed from the tundish; and an additive-element feeding unit continuously feeding an additive element (wire) to a feeding port of the mold.
    Type: Application
    Filed: December 7, 2021
    Publication date: June 30, 2022
    Inventors: Keisuke Fujito, Takayuki Tsuji, Shohei Hata
  • Publication number: 20220084723
    Abstract: A coaxial cable is composed of a conductor, an insulator around the conductor, a shield layer around the insulator, and a sheath around the shield layer. The shield layer includes a lateral winding shielding portion with metal wires helically wrapped around the insulator, and a batch plating portion covering the lateral winding shielding portion. The shield layer includes a joining portion where adjacent metal wires are joined with each other with the batch plating portion at a gap between the adjacent metal wires, and inner peripheral portions where the metal wires are not being covered with the batch plating portion and plating layers are exposed. The joining portion is provided between adjacent inner peripheral portions. When an elemental analysis is performed in any analysis region having an area of 0.015 mm2 or more and 0.
    Type: Application
    Filed: August 24, 2021
    Publication date: March 17, 2022
    Inventors: Hiromitsu KURODA, Tamotsu SAKURAI, Keisuke FUJITO, Yoshiki NAKADE, Detian HUANG, Hideki NONEN
  • Patent number: 11094434
    Abstract: An insulated wire includes a conductor including a copper material, and an insulation layer that is formed on an outer periphery of the conductor. A restoring temperature TB of the conductor is not more than 130° C. The restoring temperature TB is a temperature that is needed to restore a conductivity of the conductor after a coil processing to a conductivity of the conductor before the coil processing.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: August 17, 2021
    Assignee: HITACHI METALS, LTD.
    Inventors: Hiromitsu Kuroda, Shohei Hata, Takayuki Tsuji, Keisuke Fujito
  • Patent number: 11053569
    Abstract: An alloying-element additive for adding an alloy element to a copper melt formed by melting a base material including a copper in manufacturing a copper alloy. The alloying-element additive includes a wire-shaped or plate-shaped core including an alloy element, and an outer layer material including a copper and covering the core. A weight ratio of the copper in the outer layer material and the alloy element in the core is in a range of weight ratio where the alloying-element additive has a liquid phase in a temperature range of not more than a melting point of the copper in a copper-alloy element phase diagram.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: July 6, 2021
    Assignee: HITACHI METALS, LTD.
    Inventors: Keisuke Fujito, Takashi Hayasaka, Takeshi Usami, Toru Sumi
  • Publication number: 20200373049
    Abstract: An insulated electric wire is composed of a conductor composed of a copper material, and an electrical insulating layer provided on an outer periphery of the conductor. For the constituent conductor of the insulated electric wire, in an orientation intensity ratio obtained by X-ray diffraction of a transverse cross section of the conductor, an intensity in a [200] crystal orientation is higher than an intensity in a [111] crystal orientation.
    Type: Application
    Filed: May 14, 2020
    Publication date: November 26, 2020
    Applicant: Hitachi Metals, Ltd.
    Inventors: Keisuke FUJITO, Shohei HATA, Hiromitsu KURODA, Takayuki TUJI
  • Patent number: 10799944
    Abstract: A copper alloy material manufacturing equipment for manufacturing a copper alloy material by continuously casting molten copper. The equipment includes an element adding means for adding a metal element to the molten copper, a tundish for holding the molten copper containing the metal element, a pouring nozzle connected to the tundish to feed the molten copper from the tundish, and a trapping member arranged inside the tundish and including a same type of material as at least one of an oxide of the metal element, a nitride of the metal element, a carbide of the metal element and a sulfide of the metal element.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: October 13, 2020
    Assignee: HITACHI METALS, LTD.
    Inventors: Keisuke Fujito, Shohei Hata, Takayuki Tsuji, Hiromitsu Kuroda
  • Patent number: 10718037
    Abstract: A copper alloy material production method is provided. A copper raw material including not higher than 30 ppm by mass of oxygen is melted to form a molten copper. Not lower than 4 ppm by mass and not higher than 55 ppm by mass of titanium is added to the molten copper. After the adding of the titanium, not lower than 100 ppm by mass and not higher than 7000 ppm by mass of magnesium is added.
    Type: Grant
    Filed: February 24, 2016
    Date of Patent: July 21, 2020
    Assignee: HITACHI METALS, LTD.
    Inventors: Shohei Hata, Takayuki Tsuji, Hiromitsu Kuroda, Keisuke Fujito
  • Publication number: 20200075193
    Abstract: Bendability of a copper alloy wire is improved without decrease in an electrical conductivity of the copper alloy wire made of copper alloy containing zirconium. A cable includes: a two-core stranded wire formed by intertwining two electrical wires made of a conductor and an insulating layer covering the conductor; a filler formed around the two-core stranded wire; and a sheath formed around the filler and the electrical wire. The conductor is a copper alloy wire in which a precipitate containing the zirconium disperses, and has a crystal gain diameter that is equal to or smaller than 1 ?m, an electrical conductivity that is equal to or higher than 87% IACS, and a tensile stress that is equal to or larger than 545 MPa.
    Type: Application
    Filed: August 12, 2019
    Publication date: March 5, 2020
    Inventors: Kazuhisa TAKAHASHI, Shohei HATA, Hiromitsu KURODA, Toru SUMI, Kazuya NISHI, Keisuke FUJITO, Takayuki TUJI
  • Publication number: 20190272932
    Abstract: An insulated wire includes a conductor including a copper material, and an insulation layer that is formed on an outer periphery of the conductor. A restoring temperature TB of the conductor is not more than 130° C. The restoring temperature TB is a temperature that is needed to restore a conductivity of the conductor after a coil processing to a conductivity of the conductor before the coil processing.
    Type: Application
    Filed: September 27, 2018
    Publication date: September 5, 2019
    Inventors: Hiromitsu KURODA, Shohei HATA, Takayuki TSUJI, Keisuke FUJITO
  • Patent number: 10006138
    Abstract: A copper foil includes a copper-based metal sheet including mainly a copper, and a surface-treated layer that is provided on the copper-based metal sheet and includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper. A total thickness of the copper-based metal sheet and the surface-treated layer is less than 0.55 mm.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: June 26, 2018
    Assignee: HITACHI METALS, LTD.
    Inventors: Hideyuki Sagawa, Keisuke Fujito, Takumi Sato, Hiromitsu Kuroda
  • Patent number: 9960289
    Abstract: A solder joint material includes a copper-based metal material including mainly a copper, a surface-treated layer that is provided on the copper-based metal material and includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper, and a Sn-based solder plating layer provided on the surface-treated layer.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: May 1, 2018
    Assignee: HITACHI METALS, LTD.
    Inventors: Hideyuki Sagawa, Keisuke Fujito, Takayuki Tsuji, Hiromitsu Kuroda
  • Patent number: 9884467
    Abstract: A copper-based material includes a base comprising copper and a surface treatment layer disposed on a surface of the base, the surface treatment layer including an amorphous layer containing a metal element that has a greater affinity for oxygen than for copper, oxygen, and, optionally, copper diffused from the base.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: February 6, 2018
    Assignee: HITACHI CABLE, LTD.
    Inventors: Seigi Aoyama, Hideyuki Sagawa, Toru Sumi, Keisuke Fujito, Hiromitsu Kuroda
  • Publication number: 20170368599
    Abstract: A copper alloy material manufacturing equipment for manufacturing a copper alloy material by continuously casting molten copper. The equipment includes an element adding means for adding a metal element to the molten copper, a tundish for holding the molten copper containing the metal element, a pouring nozzle connected to the tundish to feed the molten copper from the tundish, and a trapping member arranged inside the tundish and including a same type of material as at least one of an oxide of the metal element, a nitride of the metal element, a carbide of the metal element and a sulfide of the metal element.
    Type: Application
    Filed: June 14, 2017
    Publication date: December 28, 2017
    Inventors: Keisuke Fujito, Shohei Hata, Takayuki Tsuji, Hiromitsu Kuroda
  • Patent number: 9769933
    Abstract: A printed circuit board includes a substrate, and a wiring provided on the substrate. The wiring includes a copper-based metal wire provided on the substrate and a surface-treated layer provided on the copper-based metal wire. The copper-based metal wire includes mainly a copper. The surface-treated layer includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than the copper.
    Type: Grant
    Filed: October 15, 2014
    Date of Patent: September 19, 2017
    Assignee: HITACHI METALS, LTD.
    Inventors: Hideyuki Sagawa, Keisuke Fujito, Takayuki Tsuji, Kotaro Tanaka, Hiromitsu Kuroda
  • Publication number: 20170261265
    Abstract: There is provide an apparatus for manufacturing a copper alloy metal material, including: a tundish in which molten copper is stored; a pouring nozzle through which the molten copper passes, the molten copper being flowed out from the tundish; a pressure variation device that varies a pressure applied to the pouring nozzle by the molten copper; and a controller that controls the pressure variation device so as to remove inclusions adhered to the pouring nozzle, by increasing the pressure applied to the pouring nozzle by the molten copper.
    Type: Application
    Filed: March 2, 2017
    Publication date: September 14, 2017
    Inventors: Keisuke FUJITO, Shohei Hata, Takayuki Tsuji, Hiromitsu Kuroda
  • Patent number: 9564255
    Abstract: A high-speed transmission cable conductor includes a core material includes mainly copper, and a surface treated layer formed around a surface of the core material. The surface treated layer includes an amorphous layer including a metal element having a higher affinity for oxygen than the copper, and oxygen.
    Type: Grant
    Filed: November 27, 2013
    Date of Patent: February 7, 2017
    Assignee: HITACHI METALS, LTD.
    Inventors: Hideyuki Sagawa, Seigi Aoyama, Toru Sumi, Keisuke Fujito, Detian Huang
  • Publication number: 20170016090
    Abstract: A copper alloy material production method is provided. A copper raw material including not higher than 30 ppm by mass of oxygen is melted to form a molten copper. Not lower than 4 ppm by mass and not higher than 55 ppm by mass of titanium is added to the molten copper. After the adding of the titanium, not lower than 100 ppm by mass and not higher than 7000 ppm by mass of magnesium is added.
    Type: Application
    Filed: February 24, 2016
    Publication date: January 19, 2017
    Inventors: Shohei HATA, Takayuki TSUJI, Hiromitsu KURODA, Keisuke FUJITO
  • Publication number: 20160298212
    Abstract: An alloying-element additive for adding an alloy element to a copper melt formed by melting a base material including a copper in manufacturing a copper alloy. The alloying-element additive includes a wire-shaped or plate-shaped core including an alloy element, and an outer layer material including a copper and covering the core. A weight ratio of the copper in the outer layer material and the alloy element in the core is in a range of weight ratio where the alloying-element additive has a liquid phase in a temperature range of not more than a melting point of the copper in a copper-alloy element phase diagram.
    Type: Application
    Filed: January 29, 2016
    Publication date: October 13, 2016
    Inventors: Keisuke FUJITO, Takashi HAYASAKA, Takeshi USAMI, Toru SUMI