Patents by Inventor Keisuke Horiuchi
Keisuke Horiuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9078376Abstract: A power conversion device includes: a cooling base 5 in which a flow passage 51 through which a cooling medium flows is formed and an opening portion 50 which is communicated with the flow passage 51 is formed; a power module 1; and a flow passage control portion 16b. The power module 1 has a bottomed cylindrical portion 13a in which a power semiconductor element is housed and which is inserted into the flow passage 51 through the opening portion 50, a flange portion 13b which is formed on an opening of the cylindrical portion 13a and is fixed to the cooling base 5 so as to close the opening portion 50, and a group of radiator fins 144 which are mounted on an outer peripheral surface of the cylindrical portion 13a with a gap of a predetermined distance formed between the flange portion 13b and the group of radiator fins 144.Type: GrantFiled: July 25, 2011Date of Patent: July 7, 2015Assignee: Hitachi Automotive Systems, Ltd.Inventors: Atsuo Nishihara, Kenichiro Nakajima, Keisuke Horiuchi
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Patent number: 9042101Abstract: An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.Type: GrantFiled: November 18, 2014Date of Patent: May 26, 2015Assignee: Hitachi, Ltd.Inventors: Takeshi Tokuyama, Kinya Nakatsu, Ryuichi Saito, Keisuke Horiuchi, Toshiya Satoh, Hideki Miyazaki
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Patent number: 9013877Abstract: The purpose of the present invention is to provide a power semiconductor device which has a light weight, high heat dissipation efficiency, and high rigidity. The power semiconductor device including a base 1, semiconductor circuits 2 which are arranged on the base 1, and a cooling fin 3 which cools each of the semiconductor circuits 2, in which one or more protruding portions 1a, 1b are formed on the base 1, widths of the protruding portions 1a, 1b in a direction parallel to the base 1 surface being longer than a thickness of the base 1, thereby providing power semiconductor devices 100, 200, 300, 400 which have a light weight, high heat dissipation efficiency, and high rigidity.Type: GrantFiled: November 29, 2012Date of Patent: April 21, 2015Assignee: Hitachi Power Semiconductor Device, Ltd.Inventors: Yu Harubeppu, Takayuki Kushima, Yasuhiro Nemoto, Keisuke Horiuchi, Hisashi Tanie
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Publication number: 20150070955Abstract: An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.Type: ApplicationFiled: November 18, 2014Publication date: March 12, 2015Applicant: HITACHI, LTD.Inventors: Takeshi TOKUYAMA, Kinya NAKATSU, Ryuichi SAITO, Keisuke HORIUCHI, Toshiya SATOH, Hideki MIYAZAKI
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Patent number: 8917509Abstract: An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.Type: GrantFiled: March 7, 2013Date of Patent: December 23, 2014Assignee: Hitachi, Ltd.Inventors: Takeshi Tokuyama, Kinya Nakatsu, Ryuichi Saito, Keisuke Horiuchi, Toshiya Satoh, Hideki Miyazaki
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Patent number: 8879259Abstract: A cooling system for an onboard electrical power converter in which a heat dissipation surface extends parallel to a flow of cooling air draft includes: a coolant tank containing coolant that includes a bottom surface being in thermal contact with the heat dissipation surface; a first conduit provided connecting to an upper surface of the coolant tank, the coolant flowing into the first conduit; a heat exchanger that comprises second conduits arranged with opposing the upper surface, and conducts the coolant to upstream; and a return unit that returns the coolant to the coolant tank; wherein the heat exchanger comprises heat dissipation fins through which the cooling air draft passes from a first to a second side, the heat dissipation fins being provided on surfaces of the second conduits, the first side not facing the coolant tank and the second side facing the coolant tank.Type: GrantFiled: August 19, 2011Date of Patent: November 4, 2014Assignee: Hitachi, Ltd.Inventors: Osamu Suzuki, Yosuke Yasuda, Keisuke Horiuchi, Tomoo Hayashi, Atsuo Nishihara, Sunao Funakoshi
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Patent number: 8564953Abstract: In order to achieve reduction in loss, a semiconductor power module comprises DC terminals to be connected to a condenser module and the semiconductor power module is used in combination with a cooling jacket for cooling, and the DC terminals protrude toward the condenser module beyond the cooling jacket.Type: GrantFiled: January 26, 2011Date of Patent: October 22, 2013Assignee: Hitachi, Ltd.Inventors: Keisuke Horiuchi, Michiaki Hiyoshi, Koji Sasaki
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Patent number: 8472188Abstract: A semiconductor power module includes an insulated substrate with a plurality of power semiconductor devices mounted thereon and a heat sink for radiating heat generated from the plurality of power semiconductor devices, wherein the heat sink is integrally molded with a plurality of radiation fins on one surface of a planate base by forging work such that a metallic material filled into a female die of a predetermined shape is pressed by a male die of a predetermined shape, and the insulated substrate is bonded by metallic bonding to another surface of the base of the heat sink opposite the one surface of the base of the heat sink on which the radiation fins are formed.Type: GrantFiled: February 17, 2010Date of Patent: June 25, 2013Assignee: Hitachi, Ltd.Inventors: Keisuke Horiuchi, Atsuo Nishihara, Hiroshi Hozoji, Michiaki Hiyoshi, Takehide Yokozuka
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Publication number: 20130128646Abstract: A power conversion device includes: a cooling base 5 in which a flow passage 51 through which a cooling medium flows is formed and an opening portion 50 which is communicated with the flow passage 51 is formed; a power module 1; and a flow passage control portion 16b. The power module 1 has a bottomed cylindrical portion 13a in which a power semiconductor element is housed and which is inserted into the flow passage 51 through the opening portion 50, a flange portion 13b which is formed on an opening of the cylindrical portion 13a and is fixed to the cooling base 5 so as to close the opening portion 50, and a group of radiator fins 144 which are mounted on an outer peripheral surface of the cylindrical portion 13a with a gap of a predetermined distance formed between the flange portion 13b and the group of radiator fins 144.Type: ApplicationFiled: July 25, 2011Publication date: May 23, 2013Applicant: Hitachi Automotive Systems, Ltd.Inventors: Atsuo Nishihara, Kenichiro Nakajima, Keisuke Horiuchi
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Patent number: 8416574Abstract: An electric power conversion apparatus includes: a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that comprises an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module comprises a first and a second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further comprises a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.Type: GrantFiled: June 3, 2011Date of Patent: April 9, 2013Assignee: Hitachi, Ltd.Inventors: Takeshi Tokuyama, Kinya Nakatsu, Ryuichi Saito, Keisuke Horiuchi, Toshiya Satoh, Hideki Miyazaki
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Publication number: 20120050993Abstract: A cooling system for an onboard electrical power converter in which a heat dissipation surface extends parallel to a flow of cooling air draft includes: a coolant tank containing coolant that includes a bottom surface being in thermal contact with the heat dissipation surface; a first conduit provided connecting to an upper surface of the coolant tank, the coolant flowing into the first conduit; a heat exchanger that comprises second conduits arranged with opposing the upper surface, and conducts the coolant to upstream; and a return unit that returns the coolant to the coolant tank; wherein the heat exchanger comprises heat dissipation fins through which the cooling air draft passes from a first to a second side, the heat dissipation fins being provided on surfaces of the second conduits, the first side not facing the coolant tank and the second side facing the coolant tank.Type: ApplicationFiled: August 19, 2011Publication date: March 1, 2012Applicant: Hitachi, Ltd.Inventors: Osamu SUZUKI, Yosuke Yasuda, Keisuke Horiuchi, Tomoo Hayashi, Atsuo Nishihara, Sunao Funakoshi
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Publication number: 20110228479Abstract: An electric power conversion apparatus includes: a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that comprises an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module comprises a first and a second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further comprises a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.Type: ApplicationFiled: June 3, 2011Publication date: September 22, 2011Applicant: Hitachi, Ltd.Inventors: Takeshi TOKUYAMA, Kinya NAKATSU, Ryuichi SAITO, Keisuke HORIUCHI, Toshiya SATOH, Hideki MIYAZAKI
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Publication number: 20110188204Abstract: In order to achieve reduction in loss, a semiconductor power module comprises DC terminals to be connected to a condenser module and the semiconductor power module is used in combination with a cooling jacket for cooling, and the DC terminals protrude toward the condenser module beyond the cooling jacket.Type: ApplicationFiled: January 26, 2011Publication date: August 4, 2011Applicant: Hitachi, Ltd.Inventors: Keisuke HORIUCHI, Michiaki Hiyoshi, Koji Sasaki
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Patent number: 7978471Abstract: An electric power conversion apparatus includes: a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that comprises an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module comprises a first and a second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further comprises a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.Type: GrantFiled: February 19, 2009Date of Patent: July 12, 2011Assignee: Hitachi, Ltd.Inventors: Takeshi Tokuyama, Kinya Nakatsu, Ryuichi Saito, Keisuke Horiuchi, Toshiya Satoh, Hideki Miyazaki
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Patent number: 7965510Abstract: A power conversion apparatus includes a power module, four corners of which are fastened to a cooling jacket from its front surface by a front surface side fastening apparatus that includes nuts which are screwed with bolts projecting from the rear face of the cooling jacket to fasten the power module. An AC terminal of the power module, a DC positive electrode terminal connection portion, and a DC negative electrode terminal are arranged on the top surface of the cooling jacket facing the bolts.Type: GrantFiled: May 28, 2009Date of Patent: June 21, 2011Assignee: Hitachi, Ltd.Inventors: Hideyo Suzuki, Keisuke Horiuchi, Fusanori Nishikimi, Atsushi Yukita
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Patent number: 7957145Abstract: An electric power converter for a vehicle, including a semiconductor element from which a motor drive current is output, a drive circuit that drives the semiconductor element, a control circuit that controls the drive circuit, a capacitor that smooths a DC current to be input to the semiconductor element, a container housing the semiconductor element, the drive circuit, the control circuit and the capacitor, a refrigerant retained in a state of vapor-liquid two-phase equilibrium within the container, and a heat exchanger unit that condenses the refrigerant in a vapor phase to be a liquid phase and exchanges heat with outside, wherein the semiconductor element, the drive circuit, the control circuit and the capacitor are disposed in a positional arrangement that will leave the semiconductor element, the drive circuit, the control circuit and the capacitor immersed in the refrigerant as the electric power converter is installed in the vehicle, and the heat exchanger unit is disposed at a side of a wall of the cType: GrantFiled: August 17, 2010Date of Patent: June 7, 2011Assignee: Hitachi, Ltd.Inventors: Osamu Suzuki, Sunao Funakoshi, Keisuke Horiuchi, Atsuo Nishihara, Yosuke Yasuda
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Publication number: 20110049976Abstract: An electric power converter for a vehicle, including a semiconductor element from which a motor drive current is output, a drive circuit that drives the semiconductor element, a control circuit that controls the drive circuit, a capacitor that smooths a DC current to be input to the semiconductor element, a container housing the semiconductor element, the drive circuit, the control circuit and the capacitor, a refrigerant retained in a state of vapor-liquid two-phase equilibrium within the container, and a heat exchanger unit that condenses the refrigerant in a vapor phase to be a liquid phase and exchanges heat with outside, wherein the semiconductor element, the drive circuit, the control circuit and the capacitor are disposed in a positional arrangement that will leave the semiconductor element, the drive circuit, the control circuit and the capacitor immersed in the refrigerant as the electric power converter is installed in the vehicle, and the heat exchanger unit is disposed at a side of a wall of the cType: ApplicationFiled: August 17, 2010Publication date: March 3, 2011Applicant: Hitachi, Ltd.Inventors: Osamu SUZUKI, Sunao Funakoshi, Keisuke Horiuchi, Atsuo Nishihara, Yosuke Yasuda
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Publication number: 20100208427Abstract: A semiconductor power module includes an insulated substrate mounting with a plurality of power semiconductor devices and a heat sink for radiating a heat generated from the plurality of power semiconductor devices, wherein the heat sink is integrally molded with a plurality of radiation fins on one surface of a planate base by forging work such that a metallic material filled into a female die of a predetermined shape is pressed by a male die of a predetermined shape, and the heat sink and the insulated substrate are bonded in metallic bonding with another surface opposite of one surface on which the radiation fins are formed with the base of the heat sink.Type: ApplicationFiled: February 17, 2010Publication date: August 19, 2010Inventors: Keisuke Horiuchi, Atsuo Nishihara, Hiroshi Hozoji, Michiaki Hiyoshi, Takehide Yokozuka
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Publication number: 20100097765Abstract: Disclosed are a power conversion apparatus and a power module that can be downsized. Four corners of a power module are fastened to a cooling jacket from its front surface by a front surface side fastening apparatus. Thereafter, a top and a bottom of the housing are reversed, and nuts are screwed with bolts projecting from the rear face of the cooling jacket to fasten the power module. That is, on the top surface of the cooling jacket facing the bolts are arranged an AC terminal of the power module, a DC positive electrode terminal connection portion, and a DC negative electrode terminal. Accordingly, the power module can be downsized.Type: ApplicationFiled: May 28, 2009Publication date: April 22, 2010Applicant: Hitachi, Ltd.Inventors: Hideyo Suzuki, Keisuke Horiuchi, Fusanori Nishikimi, Atsushi Yukita
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Publication number: 20090231811Abstract: An electric power conversion apparatus includes: a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that comprises an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module comprises a first and a second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further comprises a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.Type: ApplicationFiled: February 19, 2009Publication date: September 17, 2009Applicant: Hitachi. Ltd.Inventors: Takeshi Tokuyama, Kinya Nakatsu, Ryuichi Saito, Keisuke Horiuchi, Toshiya Satoh, Hideki Miyazaki