Abstract: Disclosed is a gate valve that opens/closes a plurality of vertically arranged openings by a plurality of valve bodies when conveying a plurality of vertically arranged substrates to an inside of a vacuum container. The gate valve includes: a housing including the plurality of openings formed therein; a supporting member configured to support the plurality of valve bodies; a driving mechanism configured to move the plurality of valve bodies via the supporting member such that the plurality of openings is opened/closed; and a plurality of guide mechanisms arranged to correspond to the plurality of valve bodies, respectively. Each of the plurality of guide mechanisms includes: a vertically stretchable bellows fixed to the housing; and a guide member contained in the bellows and configured to guide the supporting member inside the bellows.

Abstract: A connecting mechanism includes a mounting unit, a substrate transfer port, a door closing or opening the substrate transfer port, a coupling mechanism coupling a cover of the substrate container mounted on the mounting unit with the door, and a gas exhaust/purge unit. First, second and third seal members respectively seal a first space between a peripheral portion of the substrate transfer port and the door, a second space between the door and the cover of the substrate container, and a space between the peripheral portion of the substrate transfer port and the main body. The gas exhaust unit exhausts the first space and a second space. The purge gas, which has been supplied into the substrate container by the gas exhaust/purge unit, is supplied into the first and the second space by allowing the gas exhaust unit to exhaust the first and the second space.

Abstract: A substrate transfer chamber for unloading the substrates from the containers includes a housing-shaped main body and a plurality of container connecting mechanisms to which the containers are connected. In the main body, some of the container connecting mechanisms are arranged on top of one another in a height direction of the main body.

Abstract: A loader module of a substrate processing system includes a transportation arm configured to move towards a wafer accommodated in a carrier and receive the wafer, and a control unit configured to confirm a delivery position of the wafer based on an upward movement amount of an end effector of the transportation arm, and a contact sound generated when the end effector comes in contact with the wafer. The control unit confirms the delivery position of the wafer based on an average height of the end effector when the contact sound of each pad of the end effector comes in contact with the wafer to generate a contact sound a plurality of times.

Abstract: In a method for detecting a position of a substrate transfer device including a substrate supporting unit, the light-transmitting optical sensor is moved with respect to a detection target provided at a predetermined relative position with respect to a position where a substrate is to be transferred by the substrate transfer device, and a vertical dimension of the detection target that blocks the optical axis is measured by setting the substrate supporting unit in a first orientation and relatively moving up or down the optical sensor with respect to the detection target. A vertical dimension of the detection target that blocks the optical axis is measured by setting the substrate supporting unit in a second orientation and relatively moving the optical sensor with respect to the detection target. Horizontal coordinates of a reference position of the detection target are obtained based on the measured vertical dimensions in the respective orientations.

Abstract: Disclosed is a cover opening/closing apparatus including a plurality of placement tables provided in a vertical direction. Each placement table is configured to place thereon a substrate accommodation container including a takeout port in one side surface and a cover that covers the takeout port. The apparatus includes a cover opening/closing mechanism provided to face the cover of the substrate accommodation container placed on each of the placement tables. At least the cover opening/closing mechanism at a placement table side of an upper stage includes: a latch key driven at a time of mounting/removing the cover; a suction port configured to suck gas within a space between the cover opening/closing mechanism and the cover; a cover holding unit configured to suck and hold the cover; and a packing provided at a more outer periphery side than the latch key and the suction port.

Abstract: Disclosed is a gate valve that opens/closes a plurality of vertically arranged openings by a plurality of valve bodies when conveying a plurality of vertically arranged substrates to an inside of a vacuum container. The gate valve includes: a housing including the plurality of openings formed therein; a supporting member configured to support the plurality of valve bodies; a driving mechanism configured to move the plurality of valve bodies via the supporting member such that the plurality of openings is opened/closed; and a plurality of guide mechanisms arranged to correspond to the plurality of valve bodies, respectively. Each of the plurality of guide mechanisms includes: a vertically stretchable bellows fixed to the housing; and a guide member contained in the bellows and configured to guide the supporting member inside the bellows.

Abstract: In a method for detecting a position of a substrate transfer device including a substrate supporting unit, the light-transmitting optical sensor is moved with respect to a detection target provided at a predetermined relative position with respect to a position where a substrate is to be transferred by the substrate transfer device, and a vertical dimension of the detection target that blocks the optical axis is measured by setting the substrate supporting unit in a first orientation and relatively moving up or down the optical sensor with respect to the detection target. A vertical dimension of the detection target that blocks the optical axis is measured by setting the substrate supporting unit in a second orientation and relatively moving the optical sensor with respect to the detection target. Horizontal coordinates of a reference position of the detection target are obtained based on the measured vertical dimensions in the respective orientations.

Abstract: A substrate transfer chamber for unloading the substrates from the containers includes a housing-shaped main body and a plurality of container connecting mechanisms to which the containers are connected. In the main body, some of the container connecting mechanisms are arranged on top of one another in a height direction of the main body.

Abstract: A loader module of a substrate processing system includes a transportation arm configured to move towards a wafer accommodated in a carrier and receive the wafer, and a control unit configured to confirm a delivery position of the wafer based on an upward movement amount of an end effector of the transportation arm, and a contact sound generated when the end effector comes in contact with the wafer. The control unit confirms the delivery position of the wafer based on an average height of the end effector when the contact sound of each pad of the end effector comes in contact with the wafer to generate a contact sound a plurality of times.

Abstract: In a vacuum transfer chamber, a position detecting mechanism for detecting the positions of semiconductor wafers is arranged. The semiconductor wafers disposed at predetermined positions in a load lock chamber and vacuum processing chambers are transferred to the position detecting mechanism by a vacuum transfer mechanism and the positions of the wafers are detected. Then, based on the detection results, aligning between the load lock chamber and the vacuum processing chambers is performed.

Abstract: In a positional deviation detection apparatus provided with a transfer mechanism where plural arm portions are connected pivotably and in series with each other, the transfer mechanism being adapted to hold and transfer an object to be processed with a distal end arm portion, there are provided an edge detection unit that detects at least an edge of the object to be detected held by the distal end arm portion, the edge detection unit being provided in an arm portion among the plural arm portions, except for the distal end arm portion; and a positional deviation detection portion that obtains positional deviation of the object to be processed, in accordance with a detected value of the edge detection unit.

Abstract: A substrate processing apparatus is disclosed for bringing a substrate from a carrier, by a substrate transfer portion inside a transfer chamber, into a processing module to perform a process therein. The substrate processing apparatus includes a substrate storing chamber coupled to an exterior of the transfer chamber via a transfer opening to be in communications with the transfer chamber; a first storing shelf in the substrate storing chamber to store substrates for a first storing purpose; a second storing shelf in the substrate storing chamber to store substrates for a second storing purpose different from the first storing purpose; and a shifting mechanism that shifts the first and the second storing shelves to position a substrate storing area of one of the first and the second storing shelves so that substrate transferring is enabled between the substrate storing area and the substrate transfer portion via the transfer opening.

Abstract: A gate valve cleaning method that can clean a gate valve that brings an atmospheric transfer chamber and an internal pressure variable transfer chamber that transfer a substrate into communication with each other or shuts them off from each other without bringing about a decrease in the throughput of a substrate processing system. Before the gate valve brings the atmospheric transfer chamber and the internal pressure variable transfer chamber into communication with each other, the pressure in the internal pressure variable transfer chamber is increased so that the pressure in the internal pressure variable transfer chamber can become higher than the pressure in the atmospheric transfer chamber.

Abstract: Disclosed is a substrate transfer apparatus including a transfer arm of a joint type having an arm portion rotatably connected with a holding portion for holding a substrate, the apparatus including: a heating unit for heating the arm portion; a temperature detection unit for detecting a temperature of the arm portion; and a control unit for heating the arm portion by the heating unit prior to a start of a transfer of the substrate, allowing the transfer of the substrate after a temperature detection value obtained by the temperature detection unit reaches a preset temperature range, and then controlling the heating unit so as to maintain the temperature detection value within the preset temperature range.

Abstract: A vacuum processing apparatus transfers a wafer between a first transfer arm and a second transfer arm via a rotary stage; acquires position data of a peripheral portion of the wafer by using a line sensor while rotating the rotary stage sustaining the wafer before a vacuum process thereon; calculates a center position and a direction of the wafer based on the position data; controls a rotation of the rotary stage to adjust the direction of the wafer based on the calculation result; and controls the second transfer arm such that the second transfer arm conveys the wafer to a wafer mounting member inside a vacuum processing chamber while allowing a center of the wafer to be aligned to a center of the mounting member based on the calculation result.

Abstract: An intermediate transfer chamber that can prevent formation of defects in substrates. The intermediate transfer chamber is provided between a loader module being in a first environment where the interior thereof is at a first pressure and contains moisture, and a chamber of a process module being in a second environment where the interior thereof is at a second pressure lower than the first pressure. The intermediate transfer chamber comprises a transfer arm comprising a pick that bidirectionally transfers a substrate between the loader module and the chamber and supports the substrate, a load-lock module exhaust system that exhausts the interior of the intermediate transfer chamber so as to reduce pressure in the intermediate transfer chamber from the first pressure to the second pressure, and a plate-like member that controls the conductance of exhaust on at least a principal surface of the substrate opposite to the pick when the interior of the intermediate transfer chamber is exhausted.

Abstract: A gate valve cleaning method that can clean a gate valve that brings an atmospheric transfer chamber and an internal pressure variable transfer chamber that transfer a substrate into communication with each other or shuts them off from each other without bringing about a decrease in the throughput of a substrate processing system. Before the gate valve brings the atmospheric transfer chamber and the internal pressure variable transfer chamber into communication with each other, the pressure in the internal pressure variable transfer chamber is increased so that the pressure in the internal pressure variable transfer chamber can become higher than the pressure in the atmospheric transfer chamber.

Abstract: A gate valve cleaning method that can clean a gate valve that brings an atmospheric transfer chamber and an internal pressure variable transfer chamber that transfer a substrate into communication with each other or shuts them off from each other without bringing about a decrease in the throughput of a substrate processing system. Before the gate valve brings the atmospheric transfer chamber and the internal pressure variable transfer chamber into communication with each other, the pressure in the internal pressure variable transfer chamber is increased so that the pressure in the internal pressure variable transfer chamber can become higher than the pressure in the atmospheric transfer chamber.

Abstract: In a vacuum transfer chamber, a position detecting mechanism for detecting the positions of semiconductor wafers is arranged. The semiconductor wafers disposed at predetermined positions in a load lock chamber and vacuum processing chambers are transferred to the position detecting mechanism by a vacuum transfer mechanism and the positions of the wafers are detected. Then, based on the detection results, aligning between the load lock chamber and the vacuum processing chambers is performed.