Patents by Inventor Keisuke KUSHIDA

Keisuke KUSHIDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210079172
    Abstract: The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 ?m or less.
    Type: Application
    Filed: December 2, 2020
    Publication date: March 18, 2021
    Inventors: Yuya HIRAYAMA, Takayo KITAJIMA, Kenichi TOMIOKA, Keisuke KUSHIDA, Minoru KAKITANI, Hiroshi SHIMIZU
  • Patent number: 10940674
    Abstract: The present invention provides a resin varnish, a prepreg, a laminate and a printed wiring board, using a thermosetting resin composition having high heat resistance, low relative permittivity, high metal foil adhesion, high glass transition temperature and low thermal expansion and excellent in moldability and platability. Specifically, the resin varnish contains (A) a maleimide compound, (B) an epoxy resin, (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a maleic anhydride, (D) a silica treated with an aminosilane coupling agent, and (G) an organic solvent.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: March 9, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Yoshikatsu Shiraokawa, Minoru Kakitani, Hiroshi Shimizu, Keisuke Kushida, Tatsunori Kaneko
  • Publication number: 20210024741
    Abstract: To provide a thermosetting resin composition that has low elasticity, high heat resistance, high elongation under an ordinary temperature environment and a high temperature environment, high electric insulation reliability, and high adhesion strength to a metal foil, and is capable of providing a prepreg that is excellent in crack resistance; a prepreg including the thermosetting resin composition; a metal foil with a resin including the thermosetting resin composition and a metal foil laminated on each other; a laminate including the prepreg or the metal foil with a resin; a printed wiring board including the laminate; and a semiconductor package including the printed wiring board. Specifically, the thermosetting resin composition contains (A) a phenol-based resin, and the component (A) contains (A-1) a phenol-based resin having an aliphatic hydrocarbon group having 10 to 25 carbon atoms.
    Type: Application
    Filed: March 29, 2019
    Publication date: January 28, 2021
    Inventors: Yuya HIRAYAMA, Keisuke KUSHIDA, Kenichi TOMIOKA, Hiroshi SHIMIZU
  • Publication number: 20210015208
    Abstract: A sole structure includes: a base having a plate-like shape, and disposed near a ground; a plurality of pillars protruding upward from the base, and spaced apart from each other, the pillars being elastically deformable; and an upper plate portion disposed above the base. The pillars are disposed between the base and the upper plate portion with lower end portions of the pillars fixed to the base and with upper end portions of the pillars fixed to the upper plate portion.
    Type: Application
    Filed: January 22, 2019
    Publication date: January 21, 2021
    Inventors: Kentaro Yahata, Keisuke Kushida, Yohei Yoshida, Akira Morita
  • Publication number: 20200002526
    Abstract: The present invention provides a thermosetting resin composition containing (A) a maleimide compound, (B) an epoxy resin having at least two epoxy groups in one molecule, (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a maleic anhydride, (D) a silica treated with an aminosilane coupling agent, and (E) a flame retardant dispersion.
    Type: Application
    Filed: December 7, 2016
    Publication date: January 2, 2020
    Inventors: Keisuke KUSHIDA, Hiroshi SHIMIZU, Minoru KAKITANI, Yoshikatsu SHIRAOKAWA, Tatsunori KANEKO
  • Publication number: 20190338093
    Abstract: The present invention provides a resin varnish, a prepreg, a laminate and a printed wiring board, using a thermosetting resin composition having high heat resistance, low relative permittivity, high metal foil adhesion, high glass transition temperature and low thermal expansion and excellent in moldability and platability. Specifically, the resin varnish contains (A) a maleimide compound, (B) an epoxy resin, (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a maleic anhydride, (D) a silica treated with an aminosilane coupling agent, and (G) an organic solvent.
    Type: Application
    Filed: December 7, 2016
    Publication date: November 7, 2019
    Inventors: Yoshikatsu SHIRAOKAWA, Minoru KAKITANI, Hiroshi SHIMIZU, Keisuke KUSHIDA, Tatsunori KANEKO
  • Publication number: 20190161586
    Abstract: The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 ?m or less.
    Type: Application
    Filed: May 15, 2017
    Publication date: May 30, 2019
    Inventors: Yuya HIRAYAMA, Takayo KITAJIMA, Kenichi TOMIOKA, Keisuke KUSHIDA, Minoru KAKITANI, Hiroshi SHIMIZU