Abstract: A composition of the present invention contains the following components A to C: A. a linear terminal-reactive polydimethylsiloxane; B. a thermally conductive filler including the following B1, B2, and B3 in an amount of 800 to 2500 parts by mass with respect to 100 parts by mass of the component A; and C. a curing catalyst in a catalytic amount. The component B includes the following: B1. a thermally conductive filler that has an average particle size of 0.1 to 1.0 ?m and is surface treated with a surface treatment agent containing a reactive group having no unsaturated bond; B2. a thermally conductive filler that has an average particle size of 1.0 to 10 ?m and is surface treated with a surface treatment agent containing a reactive group having an unsaturated bond; and B3.

Abstract: An inductor 1 includes a wire 2, and a magnetic layer 3 covering the wire 2. The wire 2 includes a conducting line 6, and an insulating layer 7 covering the conducting line 6. The magnetic layer 3 includes a magnetic particle and a binder 9. In a peripheral region 4 of the wire 2, a filling rate of the magnetic particle is 40% by volume or more. The peripheral region 4 is a region of the magnetic layer 3 traveling outwardly from an outer peripheral surface of the wire 2 by 1.5 times an average of the longest length and the shortest length from the center of gravity C of the wire 2 to an outer surface of the wire 2 in a cross-sectional view.

Abstract: An inductor includes a wire, and a magnetic layer covering the wire. The wire includes a conducting line, and an insulating layer. The magnetic layer contains an anisotropic magnetic particle and a binder. In a peripheral region of the wire, the magnetic layer includes an orientated region in which the anisotropic magnetic particle is orientated along the periphery of the wire. The peripheral region is, in a cross-sectional view, a region from an outer surface of the wire to an outward distance of 1.5 times an average of the longest length and the shortest length from the center of gravity of the wire to the outer surface of the wire. An upper surface and a lower surface of the inductor are flat.

Abstract: An inductor includes a wire, and a magnetic layer having a sheet shape and for embedding the wire. The wire includes a conducting wire, and an insulating film disposed on a conducting wire circumferential surface of the conducting wire. The magnetic layer contains an anisotropic magnetic particle at a ratio of 40% by volume or more. Of a first plane section, a second plane section, and a third plane section along a plane direction of the magnetic layer described below, when viewed in at least each of the two plane sections, in a first direction perpendicular to a flow direction and a thickness direction, an orientated region in which the anisotropic magnetic particle is orientated in the flow direction is observed in a vicinity region within 50 ?m from a first directional outer end edge of the insulating film outwardly.

Abstract: An inductor includes a wire, and a magnetic layer covering the wire. The wire includes a conducting line and an insulating layer. The magnetic layer contains an anisotropic magnetic particle and a binder. In a peripheral region of the wire, the magnetic layer includes an orientated region. The peripheral region is, in a cross-sectional view, a region from an outer surface of the wire to an outward distance of 1.5 times an average of the longest length and the shortest length from the center of gravity of the wire to the outer surface of the wire. The upper surface of the inductor has a protruding portion caused by the wire.

Abstract: An inductor includes a wire including a conducting line, and an insulating film disposed on an entire circumferential surface of the conducting line, and a magnetic layer embedding the wire. The magnetic layer contains a magnetic particle. The magnetic layer includes a first layer in contact with a first surface of an outer peripheral surface of the wire, and a second layer in contact with a second surface of the outer peripheral surface of the wire and the surface of the first layer. The relative magnetic permeability of the first layer is higher than the relative magnetic permeability of the second layer.

Abstract: An inductor includes a wire including a conducting line, and an insulating film disposed on an entire circumferential surface of the conducting line, and a magnetic layer embedding the wire. The magnetic layer contains a magnetic particle. The magnetic layer includes a first layer in contact with the circumferential surface of the wire, a second layer in contact with the surface of the first layer, . . . and the n-th layer (n is a positive number of 3 or more) in contact with the surface of the (n?1)th layer. In the two layers adjacent to each other in the magnetic layer, the relative magnetic permeability of the layer closer to the wire is lower than the relative magnetic permeability of the layer farther from the wire.

Abstract: An inductor includes a wire and a magnetic layer which has a via, having an inner peripheral surface. On a cross-section across the via, a first point and a second point are located at one side and the other side in a direction in which the first principal surface extends and are kept 50 ?m away from a first edge on one side of the inner peripheral surface in the thickness direction, and a third point and a fourth point are located at one side and the other side in the extending direction and are kept 50 ?m away from a second edge on the other side of the inner peripheral surface in the thickness direction. An area of a quadrangle having all four points as vertices and an area of the molten solid inside the quadrangle are obtained, along with a percent (S1/S0×100) of the area.

Abstract: A management method of a patch for managing a sticking state of a patch with respect to an individual having a body temperature includes a step (1) of sticking the patch to the individual, a step (2) of detecting a temperature change caused by sticking the patch to the individual, and a step (3) of judging whether or not the patch is stuck to the individual based on a presence or absence of the temperature change.

Abstract: An inductor includes a wire having a generally circular shape in cross section, and the magnetic layer covering the wire, wherein the wire includes a conductive wire and an insulating layer covering the conductive wire, the magnetic layer contains anisotropic magnetic particles and a binder, and includes in a surrounding region of the wire within 1.5 times the radius of the wire, a first region in which the anisotropic magnetic particles are oriented along the circumferential direction of the wire, and a second region in which the anisotropic magnetic particles are oriented along the crossing direction that crosses the circumferential direction, or in which the anisotropic magnetic particles are not oriented.

Abstract: A mark-including inductor includes a sheet-shaped inductor including a plurality of wirings and a magnetic layer embedding the plurality of wirings, and a mark disposed at one side in a thickness direction of the inductor and/or formed in the magnetic layer.

Abstract: A frame member-including inductor includes an inductor including a plurality of wirings, and a magnetic layer embedding the plurality of wirings, and a frame member in which the inductor is set.

Abstract: A laminated sheet includes a sheet-shaped inductor including a plurality of wirings and a magnetic layer embedding the plurality of wirings, and a mark formable layer disposed on one surface in a thickness direction of the inductor.

Abstract: A laminated sheet includes a sheet-shaped inductor including a plurality of wirings and a magnetic layer embedding the plurality of wirings, and a processing stability layer disposed on at least one surface 6 in a thickness direction of the inductor. The magnetic layer includes a binder and a magnetic particle having a generally flat shape and whose material is a metal. The processing stability layer includes a cured product of a thermosetting resin composition. The thermosetting resin composition includes a thermosetting resin as an essential component. The thermosetting resin composition includes at least one kind of particle, as an optical component, selected from the group consisting of a first particle having a generally spherical shape and a second particle having a generally flat shape and whose material is an inorganic compound.

Abstract: A magnetic wiring circuit board includes an insulating layer; a wire disposed on a one-side surface in a thickness direction of the insulating layer and having a one-side surface in the thickness direction disposed to face the one-side surface in the thickness direction of the insulting layer at spaced intervals thereto, an other-side surface in the thickness direction in contact with the one-side surface in the thickness direction of the insulating layer, and side surfaces each connecting an end edge of the one-side surface in the thickness direction to an end edge of the other-side surface in the thickness direction; and a magnetic layer containing a magnetic particle having a shape of an aspect ratio of 2 or more and embedding the wire.

Abstract: A temperature sensor includes a solar cell, and a thermochromic resin covering the solar cell and having a light transmittance changeable according to a temperature change.

Abstract: A method for producing a wired circuit board includes a step (1) of forming a seed layer on one surface in a thickness direction of a peeling layer, a step (2) of forming a conductive pattern on one surface in the thickness direction of the seed layer, a step (3) of covering the seed layer and the conductive pattern with an insulating layer, a step (4) of peeling the peeling layer from the seed layer, and a step (5) of removing the seed layer. The insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.

Abstract: A magnetic wiring circuit board includes an insulating layer, a plurality of wiring portions spaced from each other, a magnetic layer disposed so as to embed the plurality of wiring portions on the insulating layer, and a suppressing portion for suppressing magnetic coupling of at least the two wiring portions.

Abstract: Provided is a semiconductor device manufacturing method which can suppress the occurrence of positional deviation or inclination of a semiconductor element when the semiconductor element is fixed so as to be sandwiched-between two insulating substrates. The semiconductor device manufacturing method includes: obtaining a laminated body in which a semiconductor element is temporarily adhered on a first electrode formed on a first insulating substrate with a first pre-sintering layer sandwiched therebetween; temporarily adhering the semiconductor element on a second electrode formed on a second insulating substrate with a second pre-sintering layer sandwiched therebetween, the second pre-sintering layer being provided on a side opposite to the first pre-sintering layer, to obtain a semiconductor device precursor; and simultaneously heating the first pre-sintering layer and the second pre-sintering layer, to bond the semiconductor element to the first electrode and the second electrode.

Abstract: A magnetic wiring circuit board includes an insulating layer, a plurality of wiring portions spaced from each other, a magnetic layer disposed so as to embed the plurality of wiring portions on the, and a suppressing portion for suppressing magnetic coupling of at least the two wiring portions.