Patents by Inventor Keisuke Uenishi

Keisuke Uenishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component and electronic device
    Patent number: 10062658
    Abstract: A surface of at least one of a connection terminal of an electronic component and a connection terminal of a circuit board is covered with a protection layer made of a AgSn alloy. The connection terminal of the electronic component is soldered to the connection terminal of the circuit board.
    Type: Grant
    Filed: July 6, 2015
    Date of Patent: August 28, 2018
    Assignee: FUJITSU LIMITED
    Inventors: Seiki Sakuyama, Toshiya Akamatsu, Nobuhiro Imaizumi, Keisuke Uenishi, Kenichi Yasaka, Toru Sakai
  • Electronic component and electronic device
    Patent number: 10056342
    Abstract: A surface of at least one of a connection terminal of an electronic component and a connection terminal of a circuit board is covered with a protection layer made of a AgSn alloy. The connection terminal of the electronic component is soldered to the connection terminal of the circuit board.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: August 21, 2018
    Assignee: FUJITSU LIMITED
    Inventors: Seiki Sakuyama, Toshiya Akamatsu, Nobuhiro Imaizumi, Keisuke Uenishi, Kenichi Yasaka, Toru Sakai
  • ELECTRONIC COMPONENT AND ELECTRONIC DEVICE
    Publication number: 20150311171
    Abstract: A surface of a connection terminal of an electronic component is covered with a protection layer made of a AgSn alloy. The electronic component is soldered to a connection terminal of a circuit board.
    Type: Application
    Filed: July 6, 2015
    Publication date: October 29, 2015
    Applicant: FUJITSU LIMITED
    Inventors: Seiki SAKUYAMA, Toshiya Akamatsu, Nobuhiro Imaizumi, Keisuke Uenishi, Kenichi Yasaka, Toru Sakai
  • Solder, soldering method, and semiconductor device
    Patent number: 8673762
    Abstract: A solder includes Sn (tin), Bi (bismuth) and Zn (zinc), wherein the solder has a Zn content of 0.01% by weight to 0.1% by weight.
    Type: Grant
    Filed: December 7, 2011
    Date of Patent: March 18, 2014
    Assignee: Fujitsu Limited
    Inventors: Toshiya Akamatsu, Nobuhiro Imaizumi, Seiki Sakuyama, Keisuke Uenishi, Tetsuhiro Nakanishi
  • SOLDER, SOLDERING METHOD, AND SEMICONDUCTOR DEVICE
    Publication number: 20120193800
    Abstract: A solder includes Sn (tin), Bi (bismuth) and Zn (zinc), wherein the solder has a Zn content of 0.01% by weight to 0.1% by weight.
    Type: Application
    Filed: December 7, 2011
    Publication date: August 2, 2012
    Applicant: FUJITSU LIMITED
    Inventors: Toshiya Akamatsu, Nobuhiro Imaizumi, Seiki Sakuyama, Keisuke Uenishi, Tetsuhiro Nakanishi