Patents by Inventor Keita KITAZAWA

Keita KITAZAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220380548
    Abstract: A thermally conductive silicone composition that has high thermal conductivity and excellent workability and misalignment resistance, and contains, in specific ratios: a silicone gel cross-linked product (A); a silicone oil (B) not containing either aliphatic unsaturated bonds or SiH groups and being used as a surface treatment agent for components (C) and (D); an aluminum powder (C) including (C-1)-(C-3), (C-1) being an aluminum powder having an average particle diameter of 40-100 ?m, (C-2) being an aluminum powder having an average particle diameter of at least 6 ?m and less than 40 ?m, and (C-3) being an aluminum powder having an average particle diameter of at least 0.4 ?m and less than 6 ?m; a zinc oxide powder (D) having an average particle diameter of 0.1-10 ?m; and a volatile solvent (E).
    Type: Application
    Filed: October 1, 2020
    Publication date: December 1, 2022
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Kunihiro YAMADA, Kenichi TSUJI, Keita KITAZAWA
  • Publication number: 20220162447
    Abstract: A thermal-conductive silicone composition containing: (A) a hydrolysable organopolysiloxane having an alkoxysilyl group; and (B) aluminum nitride particles having an average particle size of 0.5 ?m or more and 2.0 ?m or less and contained in an amount of 50 to 70 volume %. A content of coarse particles in the aluminum nitride particles is 1.0 volume % or less relative to the entire aluminum nitride particles, the coarse particles having particle sizes of 10 ?m or more according to a particle size distribution measurement method by laser diffraction. The thermal-conductive silicone composition has a heat conductivity of 1.3 W/mK or more according to a hot disc method. The present invention provides: a thermal-conductive silicone composition having high heat conductivity and being compressible to 10 ?m or less; and a production method of the thermal-conductive silicone composition.
    Type: Application
    Filed: February 10, 2020
    Publication date: May 26, 2022
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Wataru TOYA, Keita KITAZAWA, Takahiro YAMAGUCHI
  • Publication number: 20220135799
    Abstract: A non-curable thermal-conductive silicone composition contains essential components of: (A) an organopolysiloxane having a kinematic viscosity at 25° C. of 1,000,000 mm2/s or more in an amount of 5 to 20 mass % relative to a sum of the component (A) and a component (B); (B) a hydrolysable organopolysiloxane compound shown by the following general formula (1) in an amount of 80 to 95 mass % relative to the sum of the components (A) and (B); and (C) a heat conductive filler in an amount of 10 to 95 mass % relative to a total amount of the composition. A mixture of the components (A) and (B) has a molecular weight distribution Mw/Mn of 10 or more. R1 represents a monovalent hydrocarbon group having 1 to 10 carbon atoms optionally having a substituent. “m” represents an integer of 5 to 100.
    Type: Application
    Filed: February 4, 2020
    Publication date: May 5, 2022
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Keita KITAZAWA, Wataru TOYA
  • Publication number: 20210388207
    Abstract: This addition curing silicone composition in which an organopolysiloxane containing an aliphatic unsaturated hydrocarbon group, a heat-conductive filler, an organohydrodiene polysiloxane having a specific structure, an organic peroxide, a hydrolyzable organosilane compound, a platinum group metal catalyst, and, as needed, a silicone resin having an aliphatic unsaturated hydrocarbon group are blended in specific amounts can provide a silicone thermal grease that has high thermal conductivity in comparison with the conventional silicone thermal grease, and that has good adhesion to various adherends.
    Type: Application
    Filed: August 29, 2019
    Publication date: December 16, 2021
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventor: Keita KITAZAWA
  • Patent number: 11041072
    Abstract: Provided are a one-pack addition curable silicone composition compatible with both a good long-term storage property at room temperature under conditions whereby air is blocked to a constant level and the advance of an addition curing reaction at room temperature by being applied in a thin film of 1500 ?m or less and exposed to air, which could not be obtained by conventional curable heat-dissipating grease, and a method for storing the same, and a method for curing this composition.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: June 22, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Keita Kitazawa, Kohei Masuda
  • Patent number: 11041064
    Abstract: This addition-cure silicone composition comprises (A) an organopolysiloxane that has two or more aliphatic unsaturated hydrocarbon groups per molecule and has a kinematic viscosity of 60-100,000 mm2/s at 25° C., (B) an organohydrogen polysiloxane that has two or more silicon atom-bonded hydrogen atoms per molecule, and (C) hydrosilylation catalyst particles that have a microcapsule structure in which a platinum group metal catalyst-containing organic compound or polymer compound (C?) serves as a core substance, while a three-dimensional crosslinked polymer compound obtained by polymerizing at least one type of a polyfunctional monomer (C?) serves as a wall substance, wherein [solubility parameter of (C?)]?[solubility parameter of (C?)] is at least 1.0.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: June 22, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventor: Keita Kitazawa
  • Patent number: 11028234
    Abstract: This addition-curable silicone composition contains (A) an organopolysiloxane having at least two unsaturated aliphatic hydrocarbon groups in each molecule, (B) an organohydrogenpolysiloxane in an amount that provides a value of 0.5-5 for the ratio of the number of SiH groups to the total number of unsaturated aliphatic hydrocarbon groups in the component (A), and (C) an effective amount of hydrosilylation catalyst microparticles that have a microcapsule structure containing a platinum-group metal catalyst-containing organic compound or polymer compound as a core material and a three-dimensional crosslinked polymer compound obtained by polymerizing at least one polyfunctional monomer as a wall material, the platinum-group metal catalyst-containing organic compound or polymer compound having a dynamic viscosity of 10-100,000 mm2/s at 25° C.
    Type: Grant
    Filed: March 19, 2018
    Date of Patent: June 8, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventor: Keita Kitazawa
  • Publication number: 20210079221
    Abstract: Provided is a silicone composition that has high thermal conductivity and favorable adhesion. A silicone composition that contains (A) 50-99.9 parts by mass of an organopolysiloxane that has at least two aliphatic unsaturated hydrocarbon groups per molecule thereof and has a kinematic viscosity of 60-100,000 mm2/s at 25° C., (B) 0.1-50 parts by mass of a silicone resin that has at least one aliphatic unsaturated hydrocarbon group per molecule thereof (provided that the total of components (A) and (B) is 100 parts by mass), (C) an organohydrogen polysiloxane, (D) 0.01-10.0 parts by mass of an organic peroxide that has a ten-hour half-life temperature of at least 40° C. per 100 total parts by mass of components (A) and (B), and (E) 100-3,000 parts by mass of a thermally conductive filler that has a thermal conductivity of at least 10 W/(m·° C.) per 100 total parts by mass of components (A) and (B).
    Type: Application
    Filed: January 8, 2019
    Publication date: March 18, 2021
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Wataru TOYA, Keita KITAZAWA
  • Patent number: 10689515
    Abstract: Provided is a thermally conductive silicone composition which need not be stored with cooling or freezing and needs neither a heating nor a cooling step during mounting to bring about a high production efficiency and which gives cured objects that, during heating or cold/heat cycling, can be inhibited from suffering a change in hardness or a deterioration caused by cracking or dislocation. The composition includes a conventional condensation-curable silicone composition, and is cured by a combination of the condensation and curing with an organic peroxide.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: June 23, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventor: Keita Kitazawa
  • Publication number: 20200071526
    Abstract: Provided are a one-pack addition curable silicone composition compatible with both a good long-term storage property at room temperature under conditions whereby air is blocked to a constant level and the advance of an addition curing reaction at room temperature by being applied in a thin film of 1500 ?m or less and exposed to air, which could not be obtained by conventional curable heat-dissipating grease, and a method for storing the same, and a method for curing this composition.
    Type: Application
    Filed: November 8, 2019
    Publication date: March 5, 2020
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Keita KITAZAWA, Kohei MASUDA
  • Publication number: 20200032000
    Abstract: This addition-curable silicone composition contains (A) an organopolysiloxane having at least two unsaturated aliphatic hydrocarbon groups in each molecule, (B) an organohydrogenpolysiloxane in an amount that provides a value of 0.5-5 for the ratio of the number of SiH groups to the total number of unsaturated aliphatic hydrocarbon groups in the component (A), and (C) an effective amount of hydrosilylation catalyst microparticles that have a microcapsule structure containing a platinum-group metal catalyst-containing organic compound or polymer compound as a core material and a three-dimensional crosslinked polymer compound obtained by polymerizing at least one polyfunctional monomer as a wall material, the platinum-group metal catalyst-containing organic compound or polymer compound having a dynamic viscosity of 10-100,000 mm2/s at 25° C.
    Type: Application
    Filed: March 19, 2018
    Publication date: January 30, 2020
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventor: Keita Kitazawa
  • Publication number: 20190359874
    Abstract: This addition-cure silicone composition comprises (A) an organopolysiloxane that has two or more aliphatic unsaturated hydrocarbon groups per molecule and has a kinematic viscosity of 60-100,000 mm2/s at 25° C., (B) an organohydrogen polysiloxane that has two or more silicon atom-bonded hydrogen atoms per molecule, and (C) hydrosilylation catalyst particles that have a microcapsule structure in which a platinum group metal catalyst-containing organic compound or polymer compound (C?) serves as a core substance, while a three-dimensional crosslinked polymer compound obtained by polymerizing at least one type of a polyfunctional monomer (C?) serves as a wall substance, wherein [solubility parameter of (C?)]?[solubility parameter of (C?)] is at least 1.0.
    Type: Application
    Filed: February 9, 2018
    Publication date: November 28, 2019
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventor: Keita KITAZAWA
  • Patent number: 10202529
    Abstract: A silicone composition that contains an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, a filler containing an aluminum powder and a zinc oxide powder, an organohydrogenpolysiloxane having two or more SiH groups per molecule, and a platinum group metal catalyst, in which when a storage and loss elastic modulus G? of the silicone composition is measured by means a viscoelasticity measurement apparatus capable of measuring shear modulus, the silicone composition can provide a cured product wherein G? after 3,000 seconds from the start of holding is 10,000 Pa or less, G? after 7,200 seconds from the start of holding is 100,000 Pa or less, and G? exceeds G? after 800 seconds or more from the start of holding. As a result, there is provided a silicone composition excellent in crushability, spreadability, and heat conductivity.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: February 12, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Keita Kitazawa, Kunihiro Yamada
  • Publication number: 20190010294
    Abstract: Provided is a thermally conductive silicone composition which need not be stored with cooling or freezing and needs neither a heating nor a cooling step during mounting to bring about a high production efficiency and which gives cured objects that, during heating or cold/heat cycling, can be inhibited from suffering a change in hardness or a deterioration caused by cracking or dislocation. The composition includes a conventional condensation-curable silicone composition, and is cured by a combination of the condensation and curing with an organic peroxide.
    Type: Application
    Filed: December 20, 2016
    Publication date: January 10, 2019
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventor: Keita KITAZAWA
  • Patent number: 10023741
    Abstract: A silicone composition that contains (A) an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, (B) a filler containing an aluminum powder and a zinc oxide powder, (C) an organohydrogenpolysiloxane having two or more silicon-bonded hydrogen atoms per molecule, and (D) a platinum group metal catalyst, in which a cured product of the silicone composition exhibits a ratio of a storage elastic modulus after 3,600 seconds from the start of measurement to a storage elastic modulus after 7,200 seconds from the start of measurement of 0.7 or less, the storage elastic modulus G? being measured by constructing a program for holding a sample at 150° C. for 7,200 seconds after the sample is heated from 25° C. to 125° C. at a temperature increase rate of 10° C./min, from 125° C. to 145° C. at a temperature increase rate of 2° C./min, and from 145° C. to 150° C. at a temperature increase rate of 0.5° C./min.
    Type: Grant
    Filed: May 2, 2014
    Date of Patent: July 17, 2018
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Keita Kitazawa, Kunihiro Yamada
  • Patent number: 9976032
    Abstract: A silicone composition that contains (A) an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, (B) a filler containing an aluminum powder and a zinc oxide powder, (C) an organohydrogenpolysiloxane having two or more silicon-bonded hydrogen atoms per molecule, and (D) a platinum group metal catalyst, in which a cured product of the silicone composition exhibits a ratio of a storage elastic modulus after 3,600 seconds from the start of measurement to a storage elastic modulus after 7,200 seconds from the start of measurement of 0.7 or less, the storage elastic modulus G? being measured by constructing a program for holding a sample at 150° C. for 7,200 seconds after the sample is heated from 25° C. to 125° C. at a temperature increase rate of 10° C./min, from 125° C. to 145° C. at a temperature increase rate of 2° C./min, and from 145° C. to 150° C. at a temperature increase rate of 0.5° C./min.
    Type: Grant
    Filed: May 2, 2014
    Date of Patent: May 22, 2018
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Keita Kitazawa, Kunihiro Yamada
  • Patent number: 9969919
    Abstract: A silicone composition that contains an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, a filler containing an aluminum powder and a zinc oxide powder, an organohydrogenpolysiloxane having two or more SiH groups per molecule, and a platinum group metal catalyst, in which when a storage and loss elastic modulus G? of the silicone composition is measured by means a viscoelasticity measurement apparatus capable of measuring shear modulus, the silicone composition can provide a cured product wherein G? after 3,000 seconds from the start of holding is 10,000 Pa or less, G? after 7,200 seconds from the start of holding is 100,000 Pa or less, and G? exceeds G? after 800 seconds or more from the start of holding. As a result, there is provided a silicone composition excellent in crushability, spreadability, and heat conductivity, and further provided a method for manufacturing a heat-conductive silicone composition.
    Type: Grant
    Filed: June 13, 2014
    Date of Patent: May 15, 2018
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Keita Kitazawa, Kunihiro Yamada
  • Patent number: 9932508
    Abstract: A silicone composition that contains an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, a filler containing an aluminum powder and a zinc oxide powder, an organohydrogenpolysiloxane having two or more SiH groups per molecule, and a platinum group metal catalyst, in which when a storage and loss elastic modulus G? of the silicone composition is measured by means a viscoelasticity measurement apparatus capable of measuring shear modulus, the silicone composition can provide a cured product wherein G? after 3,000 seconds from the start of holding is 10,000 Pa or less, G? after 7,200 seconds from the start of holding is 100,000 Pa or less, and G? exceeds G? after 800 seconds or more from the start of holding. As a result, there is provided a silicone composition excellent in crushability, spreadability, and heat conductivity, and further provided a method for manufacturing a heat-conductive silicone composition.
    Type: Grant
    Filed: June 13, 2014
    Date of Patent: April 3, 2018
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Keita Kitazawa, Kunihiro Yamada
  • Publication number: 20180086960
    Abstract: A silicone composition that contains an organopolysiloxane having at least two aliphatic unsaturated hydrocarbon groups per molecule, a filler containing an aluminum powder and a zinc oxide powder, an organohydrogenpolysiloxane having two or more SiH groups per molecule, and a platinum group metal catalyst, in which when a storage and loss elastic modulus G? of the silicone composition is measured by means a viscoelasticity measurement apparatus capable of measuring shear modulus, the silicone composition can provide a cured product wherein G? after 3,000 seconds from the start of holding is 10,000 Pa or less, G? after 7,200 seconds from the start of holding is 100,000 Pa or less, and G? exceeds G? after 800 seconds or more from the start of holding. As a result, there is provided a silicone composition excellent in crushability, spreadability, and heat conductivity.
    Type: Application
    Filed: November 22, 2017
    Publication date: March 29, 2018
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Keita KITAZAWA, Kunihiro YAMADA
  • Patent number: 9840594
    Abstract: Provided are: a novel organopolysiloxane compound containing a vinylene group, which can be used as a base polymer for an addition-curable silicone composition, particularly an organopolysiloxane compound containing a terminal vinylene group; and a method for producing the organopolysiloxane compound. An organopolysiloxane compound characterized by having at least one unit represented by formula (1) as a partial structure, and also characterized by being linear or branched. [R1's independently represent a hydrogen atom or a monovalent hydrocarbon group having 1 to 20 carbon atoms; R2's independently represent a hydrogen atom, a monovalent hydrocarbon group having 1 to 20 carbon atoms, or a group represented by formula (a); x represents an integer of 0 to 1,998; R3's independently represent a group represented by formula (a); R4's independently represent a monovalent hydrocarbon group having 1 to 20 carbon atoms; a represents an integer of 1 to 2,000; and b represents an integer of 0 to 1,999.
    Type: Grant
    Filed: December 2, 2014
    Date of Patent: December 12, 2017
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Keita Kitazawa, Takahiro Yamaguchi