Patents by Inventor Keith A. Miller

Keith A. Miller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200303172
    Abstract: Embodiments described herein relate to shields for use in target assemblies in semiconductor process chambers. The shields can be used to shield exposed surfaces and chamber components within the process chambers such that unwanted redeposits are prevented from forming on the exposed surfaces and other chamber components. In some embodiments, the shields are electrically floating and are configured to cover the ends of the target. The target assembly has a target support secured to a mounting plate and a plurality of pins extending therefrom. Each of the shields has a shield body with an opening. The shield body has alignment features configured to align with the plurality pins such that the shield connects with the target support. Shields as described herein can be made of smooth edges, helping to minimize particle generation and to prevent arcing at least partially caused by sharp edges of shields.
    Type: Application
    Filed: March 22, 2019
    Publication date: September 24, 2020
    Inventors: William R. Johanson, JR., Keith A. Miller
  • Patent number: 10727092
    Abstract: Embodiments of substrate support rings are provided herein. In some embodiments, an apparatus for processing substrates includes, a ring configured to be disposed about a peripheral edge of a substrate support to support at least a portion of a substrate disposed atop the substrate support, wherein the ring comprises a heater; and a power supply coupled to the heater to provide power to the heater.
    Type: Grant
    Filed: October 17, 2013
    Date of Patent: July 28, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventor: Keith A. Miller
  • Patent number: 10697057
    Abstract: Embodiments of collimators and process chambers incorporating same are provided herein. In some embodiments, a collimator for use in a substrate processing chamber includes a ring; an adapter surrounding the ring and having an inner annular wall; and a plurality of spokes extending from the inner annular wall and intersecting at a central axis of the collimator.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: June 30, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Goichi Yoshidome, Keith A. Miller, Hamid Tavassoli, Andrew Tomko
  • Publication number: 20200201136
    Abstract: This system and method of for providing a tunable orbital angular momentum system for providing higher order Bessel beams comprising: an acousto-optical deflector configured to receive an input beam, deflect a first portion of the input beam a first deflection angle relative to an axis of propagation and along an optical axis and deflect a second portion of the input beam a second deflection angle relative to the optical axis; a line generator disposed along the optical angle for receiving the first portion and the second portion of the input beam and provide an elliptical Gaussian mean; a log-polar optics assembly disposed along the optical angle for receiving the elliptical Gaussian beam and wrapping the elliptical Gaussian beam with an asymmetric ring; and, a Fourier lens configured to receive the wrapped elliptical Gaussian beam.
    Type: Application
    Filed: December 23, 2019
    Publication date: June 25, 2020
    Applicant: Clemson University Research Foundation
    Inventors: Eric G. Johnson, Jerome Keith Miller, Richard Watkins, Kaitlyn Morgan, Wenzhe Li, Yuan Li
  • Publication number: 20200090914
    Abstract: Methods and apparatus for producing a uniform deposition layer for a selective plasma vapor deposition (PVD) chamber. Flux generated by a cylindrical target is adjusted using a magnetron assembly that controls the amount of flux that passes through a slit in the selective PVD chamber. In some embodiments, a magnetron assembly disposed within the cylindrical has a magnetic field strength that varies along a length of the magnetron assembly. The magnetron assembly disposed within the cylindrical target may have a center height greater than either end such that flux generated during processing for a center region of the cylindrical target is directed away from the opening. In some embodiments, a magnetron assembly disposed within the cylindrical target is rotatable such that flux generated during processing for a center region of the cylindrical target is directed away from the opening or towards the opening.
    Type: Application
    Filed: August 19, 2019
    Publication date: March 19, 2020
    Inventor: KEITH A MILLER
  • Publication number: 20190353919
    Abstract: Multi-zone collimators and process chambers including multi-zone collimators for use with a multi-zone magnetron source are provided herein. In some embodiments, a multi-zone collimator for use with a multi-zone magnetron source, comprising a first collimator plate, a second collimator plate, wherein a first collimator zone having a first width is formed between the first collimator plate and the second collimator plate; and a third collimator plate, wherein a second collimator zone having a second width is formed between the second first collimator plate and the third collimator plate, wherein a length of each of the first, second and third collimator plates are different from each other.
    Type: Application
    Filed: May 17, 2019
    Publication date: November 21, 2019
    Inventors: BENCHERKI MEBARKI, JOUNG JOO LEE, FARZAD HOUSHMAND, ANANTHA SUBRAMANI, KEITH MILLER, XIANMIN TANG, PRASHANTH KOTHNUR
  • Publication number: 20190287772
    Abstract: Methods and apparatus for physical vapor deposition (PVD) are provided herein. In some embodiments, a method for PVD includes providing a first stream of a first material from a first PVD source towards a surface of a substrate at a first non-perpendicular angle to the plane of the substrate surface and rotating and linearly scanning the substrate through the stream of first material to deposit the first material on all features formed on the substrate, providing a second stream of an ionized dopant species from a dopant source towards the surface of the substrate at a second non-perpendicular angle to the plane of the substrate surface, and implanting the ionized dopant species in the first material deposited only on a top portion and a portion of the first and second sidewalls of all the features on the substrate by rotating and linearly scanning the substrate via the substrate support.
    Type: Application
    Filed: March 13, 2019
    Publication date: September 19, 2019
    Inventors: JOUNG JOO LEE, Bencherki Mebarki, Xianmin Tang, KEITH MILLER, SREE RANGASAI KESAPRAGADA, Sudarsan Srinivasan
  • Publication number: 20190276926
    Abstract: Methods and apparatus for asymmetric selective physical vapor deposition (PVD) are provided herein. In some embodiments, a method for physical vapor deposition (PVD) includes providing a stream of a first material from a first PVD source towards a surface of a substrate at a first non-perpendicular angle to the plane of the substrate surface, directing the stream of the first material through a first collimator having at least one opening to limit an angular range of first material passing through the at least one opening; depositing the first material only on a top portion and a first sidewall of at least one feature formed on the substrate surface, and linearly scan the substrate through the stream of first material via the substrate support to deposit the first material only on a top portion and a first sidewall of all features formed on the substrate.
    Type: Application
    Filed: March 7, 2019
    Publication date: September 12, 2019
    Inventors: Joung Joo Lee, Bencherki Mebarki, Xianmin Tang, Keith Miller, Sree Rangasai Kesapragada, Sudarsan Srinivasan
  • Publication number: 20190189465
    Abstract: Methods and apparatus for physical vapor deposition are provided herein. In some embodiments, an apparatus for physical vapor deposition (PVD) includes: a linear PVD source to provide a stream of material flux comprising material to be deposited on a substrate; and a substrate support having a support surface to support the substrate at a non-perpendicular angle to the stream of material flux, wherein at least one of the substrate support or the linear PVD source are movable in a direction parallel to a plane of the support surface of the substrate support sufficiently to cause the stream of material flux to move completely over a surface of the substrate, when disposed on the substrate support during operation.
    Type: Application
    Filed: December 17, 2018
    Publication date: June 20, 2019
    Inventors: KEITH A. MILLER, BENCHERKI MEBARKI, JOUNG JOO LEE, XIANMIN TANG
  • Patent number: 10312065
    Abstract: A method, apparatus and system for controlling the processing of a substrate within a process chamber are described herein. In some embodiments, a method of controlling a substrate process within a process chamber includes determining a position of a moveable magnetron in the process chamber relative to a reference location on a surface of the substrate and modulating a power parameter of at least one power supply affecting substrate processing based on the determined position of the magnetron to control, for example, at least one of a deposition rate or an etching rate of the substrate processing. In one embodiment, the modulated power parameter is a power set point of at least one of a direct current (DC) source power, a radio frequency (RF) bias power, a DC shield bias voltage, or an electromagnetic coil current of the at least one power supply.
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: June 4, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Keith A. Miller, Shreekant Gayaka, Carl R. Johnson
  • Patent number: 10283331
    Abstract: Apparatus for providing a magnetic field within a process chamber are provided herein. In some embodiments, an apparatus for providing a magnetic field within a process chamber includes: an inner rotating mechanism including a first plate having a central axis, wherein the first plate includes and a first plurality of magnets and is rotatable about the central axis; and an outer lifting mechanism including a ring disposed proximate the first plate, the ring having a second plurality of magnets coupled to a bottom surface of the ring proximate the peripheral edge of the ring, wherein the ring is movable in a direction perpendicular to the first plate.
    Type: Grant
    Filed: August 13, 2014
    Date of Patent: May 7, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventor: Keith A. Miller
  • Publication number: 20190096638
    Abstract: Embodiments of process chambers are provided herein. In some embodiments, a process chamber includes: a chamber wall defining an inner volume within the process chamber; a substrate support disposed in the inner volume having a support surface to support a substrate, wherein the inner volume includes a processing volume disposed above the support surface and a non-processing volume disposed at least partially below the support surface; a gas supply plenum fluidly coupled to the processing volume via a gas supply channel disposed above the support surface; a pumping plenum fluidly coupled to the processing volume via an exhaust channel disposed above the support surface; and a sealing apparatus configured to fluidly isolate the processing volume from the non-processing volume when the substrate support is in a processing position, wherein the processing volume and the non-processing volume are fluidly coupled when the substrate support is in a non-processing position.
    Type: Application
    Filed: September 17, 2018
    Publication date: March 28, 2019
    Inventors: ILYA LAVITSKY, KEITH A. MILLER, JOHN MAZZOCCO
  • Publication number: 20180174873
    Abstract: Processing methods and apparatus for thin substrates are disclosed. The methods and apparatus rotate a thin substrate without exposing the thin substrate to pressure gradients. The apparatus and method can be part of an integrated system for depositing films on both sides of the thin substrate.
    Type: Application
    Filed: December 13, 2017
    Publication date: June 21, 2018
    Inventor: Keith A. Miller
  • Patent number: 9984911
    Abstract: An electrostatic chuck includes a puck having a support surface to support a substrate when disposed thereon and an opposing second surface, wherein one or more chucking electrodes are embedded in the puck, a body having a support surface coupled to the second surface of the puck to support the puck, a DC voltage sensing circuit disposed on support surface of the puck, and an inductor disposed in the body and proximate the support surface of the body, wherein the inductor is electrically coupled to DC voltage sensing circuit, and wherein the inductor is configured to filter high frequency current flow in order to accurately measure DC potential on the substrate.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: May 29, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Ryan Hanson, Manjunatha Koppa, Vijay D. Parkhe, John C. Forster, Keith A. Miller
  • Publication number: 20180142342
    Abstract: Embodiments of collimators and process chambers incorporating same are provided herein. In some embodiments, a collimator for use in a substrate processing chamber includes a ring; an adapter surrounding the ring and having an inner annular wall; and a plurality of spokes extending from the inner annular wall and intersecting at a central axis of the collimator.
    Type: Application
    Filed: November 16, 2017
    Publication date: May 24, 2018
    Inventors: GOICHI YOSHIDOME, KEITH A. MILLER, HAMID TAVASSOLI, ANDREW TOMKO
  • Publication number: 20180122670
    Abstract: An apparatus may include a platen to hold a substrate. A substrate plane structure may be disposed in front of the platen. The substrate plane structure has an opening therein. The apparatus may further include a removable structure disposed in the opening of the substrate plane structure. The removable structure may have an opening exposing a surface of the platen.
    Type: Application
    Filed: November 1, 2016
    Publication date: May 3, 2018
    Inventors: Ernest E. Allen, Richard John Hertel, Jay R. Wallace, Keith A. Miller
  • Patent number: 9957601
    Abstract: Apparatus for physical vapor deposition are provided herein. In some embodiments, a shield for use in a physical vapor deposition chamber, comprises an annular one-piece body having an inner volume, a top opening and a bottom opening, wherein a bottom of the annular one-piece body includes an inner upwardly extending u-shaped portion, an annular groove formed in an inner wall of the one-piece body, and a plurality of gas distribution vents disposed along the annular feature and formed through the one-piece body, wherein the plurality of gas distribution vents are spaced apart from each other to distribute gases into the inner volume in a desired pattern.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: May 1, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Muhammad Rasheed, Kirankumar Savandaiah, Alan A. Ritchie, Isaac Porras, Keith A. Miller
  • Patent number: 9960021
    Abstract: Embodiments of target assemblies for use in substrate processing chambers are provided herein. In some embodiments, a target assembly includes a plate comprising a first side including a central portion and a support portion; a target disposed on the central portion; a plurality of recesses formed in the support portion; and a plurality of pads partially disposed in the plurality of recesses.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: May 1, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Uday Pai, William Fruchterman, Keith A. Miller, Muhammad M. Rasheed, Thanh X. Nguyen, Kirankumar Savandaiah
  • Publication number: 20180111140
    Abstract: A spray proportioner hose includes an inner diameter that extends along a longitudinal length of the hose and through which a flow of spray component from a spray proportioner unit may be directed toward a fluid manifold of an applicator gun. At the fluid manifold, the spray component will be mixed with another spray component in a desired proportion. The hose includes a static mixer positioned within its inner diameter to interact with and thereby mix the flowed spray component within the inner diameter of the hose before the spray component is delivered to the fluid manifold.
    Type: Application
    Filed: October 20, 2016
    Publication date: April 26, 2018
    Applicant: Spray Polyurethane Parts, Inc.
    Inventor: Keith Miller
  • Patent number: D825504
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: August 14, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Fuhong Zhang, William Johanson, Yu Liu, Adolph Miller Allen, Brij Datta, Keith A. Miller