Patents by Inventor Keith A. Miller

Keith A. Miller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9950396
    Abstract: A method and apparatus for repairing overhead conveyor chain by removing a section of track, locating a mobile repair station under the exposed track, and effecting the needed repair on the chain by cycling the intact chain past the mobile repair station and repairing it as it passes. Repair embodiments include re-swaging and repair, replacement or rotation of chain links.
    Type: Grant
    Filed: June 5, 2015
    Date of Patent: April 24, 2018
    Assignee: Frost Tech LLC
    Inventors: Charles C. Frost, Charles J. Deschaine, Keith Miller
  • Patent number: 9928997
    Abstract: Apparatus for physical vapor deposition of dielectric material is provided herein. In some embodiments, a chamber lid of a physical vapor deposition chamber includes an inner magnetron assembly coupled to an inner target assembly, and an outer magnet assembly coupled to an outer target assembly, wherein the inner magnetron assembly and the inner target assembly are electrically isolated from the outer magnet assembly and the outer target assembly.
    Type: Grant
    Filed: February 9, 2015
    Date of Patent: March 27, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Keith A. Miller, Thanh X. Nguyen, Ilya Lavitsky, Randy Schmieding, Prashanth Kothnur
  • Patent number: 9927940
    Abstract: A method of displaying information includes presenting representations of information in a manner accounting for independent cognitive capacities corresponding to a subject's left and right halves of visual space. Weightings of importance may be assigned to the information and used to display the representations in the left half or the right half of the visual space with zero or few other representations. Presenting the representations can also include inspecting content of the information and determining a position on a display to present the content as a function of the information previously, currently, or in the future displayed on the display. In a display system, a presentation unit is configured to present, e.g. generate, representations of information in a manner accounting for the independent cognitive capacities, and a display unit is configured to display the representations. Displaying information can include arranging physical objects in locations of a subject's expected visual space.
    Type: Grant
    Filed: June 1, 2012
    Date of Patent: March 27, 2018
    Assignee: Massachusetts Institute of Technology
    Inventors: Earl Keith Miller, Timothy Joseph Buschman
  • Publication number: 20180056311
    Abstract: A method of heating spray components with a spray proportioner unit may include flowing a spray component from a hopper through a preheater and heated hose. The spray component may be received at a receiving end of the heated hose at a first temperature and exit the heated hose at a delivery end at a second temperature. The spray component may be flowed through the heated hose at an operating pressure up to 2000 psi and at a rate up to 12 lb/minute. The second temperature may be at least 30° F., such as between 40° F. and 60° F., greater than the first temperature.
    Type: Application
    Filed: August 29, 2016
    Publication date: March 1, 2018
    Applicant: Spray Polyurethane Parts, Inc.
    Inventor: Keith Miller
  • Publication number: 20180049636
    Abstract: A method, or corresponding dynamic display system, for customizing a controller of a display system includes presenting a visual stimulus to a subject at at least one known location relative to the subject's eye gaze; measuring brain activity of the subject's left and right brain hemispheres in response to the subject's viewing of the stimulus; processing the measured brain activity to determine a frequency-dependent metric of the measured brain activity; assessing independent cognitive capacities of the subject's left and right brain hemispheres based on the frequency-dependent metric; and adjusting a function of the controller in the display system according to the assessed independent capacities, such as by adjusting the function to change a stimulus load in a visual hemifield according to the brain activity in the contralateral brain hemisphere. Example applications include head-up display (HUD), augmented reality (AR) or virtual reality (VR) display systems, and brain injury assessment systems.
    Type: Application
    Filed: August 16, 2017
    Publication date: February 22, 2018
    Inventors: Earl Keith Miller, Timothy Joseph Buschman, Simon John Kornblith
  • Publication number: 20180025895
    Abstract: A method, apparatus and system for controlling the processing of a substrate within a process chamber are described herein. In some embodiments, a method of controlling a substrate process within a process chamber includes determining a position of a moveable magnetron in the process chamber relative to a reference location on a surface of the substrate and modulating a power parameter of at least one power supply affecting substrate processing based on the determined position of the magnetron to control, for example, at least one of a deposition rate or an etching rate of the substrate processing. In one embodiment, the modulated power parameter is a power set point of at least one of a direct current (DC) source power, a radio frequency (RF) bias power, a DC shield bias voltage, or an electromagnetic coil current of the at least one power supply.
    Type: Application
    Filed: October 11, 2016
    Publication date: January 25, 2018
    Inventors: Martin Lee RIKER, Keith A. MILLER, Shreekant GAYAKA, Carl R. JOHNSON
  • Publication number: 20180010242
    Abstract: Embodiments of the invention generally relate to a process kit for a semiconductor processing chamber, and a semiconductor processing chamber having a kit. More specifically, embodiments described herein relate to a process kit including a deposition ring and a pedestal assembly. The components of the process kit work alone, and in combination, to significantly reduce their effects on the electric fields around a substrate during processing.
    Type: Application
    Filed: June 26, 2017
    Publication date: January 11, 2018
    Inventors: Muhammad RASHEED, Keith A. MILLER, Rongjun WANG
  • Patent number: 9848461
    Abstract: Embodiments of methods and apparatus for thermally treating a substrate are provided herein. In some embodiments, a thermal treatment apparatus includes a chamber body including an interior volume; a plurality of substrate supports disposed within the interior volume, wherein each of the plurality of substrate supports includes a heating element; a selectively sealable opening in the chamber body sized to allow substrates to be inserted into or removed from the interior volume; a robotic arm disposed in the interior volume to move substrates onto and off of the plurality of substrate supports; and a heating assembly configured to heat substrates disposed on the robotic arm.
    Type: Grant
    Filed: September 29, 2014
    Date of Patent: December 19, 2017
    Assignee: APPLIED MATERIALS, INC.
    Inventor: Keith A. Miller
  • Publication number: 20170253959
    Abstract: Methods and apparatus for controlling the ion fraction in physical vapor deposition processes are disclosed. In some embodiments, a process chamber for processing a substrate having a given diameter includes: an interior volume and a target to be sputtered, the interior volume including a central portion and a peripheral portion; a rotatable magnetron above the target to form an annular plasma in the peripheral portion; a substrate support disposed in the interior volume to support a substrate having the given diameter; a first set of magnets disposed about the body to form substantially vertical magnetic field lines in the peripheral portion; a second set of magnets disposed about the body and above the substrate support to form magnetic field lines directed toward a center of the support surface; a first power source to electrically bias the target; and a second power source to electrically bias the substrate support.
    Type: Application
    Filed: March 3, 2017
    Publication date: September 7, 2017
    Inventors: Xiaodong WANG, Joung Joo LEE, Fuhong ZHANG, Martin Lee RIKER, Keith A. MILLER, William FRUCHTERMAN, Rongjun WANG, Adolph Miller ALLEN, Shouyin ZHANG, Xianmin TANG
  • Patent number: 9739543
    Abstract: A heat sink includes a frame having a non-metallic body that includes a window. The non-metallic body includes at least one peripheral wall that defines a boundary of the window. The non-metallic body includes a non-metallic material. The heat sink also includes a heat exchanger having a base and cooling fins. The base has a structure side and an opposite environmental side. The structure side of the base is configured to thermally communicate with a structure for absorbing heat from the structure. The cooling fins extend from the environmental side of the base. The heat exchanger is held by the frame such that the cooling fins extend within the window of the frame.
    Type: Grant
    Filed: February 6, 2013
    Date of Patent: August 22, 2017
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Chong Hun Yi, Andrew Dewitt Balthaser, Brian Klinger, Matt Richard McAlonis, Keith Miller
  • Publication number: 20170219219
    Abstract: A demand based control for a hydronic heating system varies the heat response based on an actual demand of the conditioned space, rather than an estimated thermal loss. Differences between supply and return of a heat transfer medium, such as forced hot water, are measured for the conditioned space, as well as the flow rate of the forced water to determine an actual thermal transfer to the conditioned space. A required heat generation is computed based on the measured transfer and resultant temperature change of the conditioned space, and heat generation parameters such as boiler firing rate and circulator pump speed varied to control the heat transfer to the conditioned space and avoid overshoot or excessive heat generation beyond that needed for the measured demand.
    Type: Application
    Filed: February 1, 2016
    Publication date: August 3, 2017
    Inventors: Keith A. Miller, Marjorie S. Miller
  • Patent number: 9689070
    Abstract: Embodiments of the invention generally relate to a process kit for a semiconductor processing chamber, and a semiconductor processing chamber having a kit. More specifically, embodiments described herein relate to a process kit including a deposition ring and a pedestal assembly. The components of the process kit work alone, and in combination, to significantly reduce their effects on the electric fields around a substrate during processing.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: June 27, 2017
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Muhammad Rasheed, Keith A. Miller, Rongjun Wang
  • Patent number: 9605341
    Abstract: Methods and apparatus for processing a substrate in a physical vapor deposition (PVD) chamber are provided herein. In some embodiments, a process kit shield used in a substrate processing chamber may include a shield body having an inner surface and an outer surface, a process kit shield impedance match device coupled between the shield body and ground, wherein the process kit shield impedance match device is configured to adjust a bias voltage of the process kit shield, a cavity formed on the outer surface of the shield body, and one or more magnets disposed within the cavity.
    Type: Grant
    Filed: March 6, 2013
    Date of Patent: March 28, 2017
    Assignee: APPLIED MATERIALS, INC.
    Inventor: Keith A. Miller
  • Patent number: 9580795
    Abstract: In some embodiments, a sputter source for a process chamber may include: a first enclosure having a top, sides and an open bottom; a target coupled to the open bottom; an electrical feed coupled to the top of the first enclosure proximate a central axis of the first enclosure to provide power to the target via the first enclosure; a magnet assembly having a shaft, a support arm coupled to the shaft, and a magnet coupled to the support arm disposed within the first enclosure; a first rotational actuator disposed off-axis to the central axis of the first enclosure and rotatably coupled to the magnet to rotate the magnet about the central axis of the first enclosure; and a second rotational actuator disposed off-axis to the central axis of the first enclosure and rotatably coupled to the magnet to rotate the magnet about a central axis of the magnet assembly.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: February 28, 2017
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Keith A. Miller, Martin Lee Riker
  • Patent number: 9564348
    Abstract: Processing chamber shutter blade and robot blade assemblies are constructed to eliminate thermal effects on the placement of elements in processing chambers. Such blade assemblies may contain at least two parts, which may include a positioning member including a low CTE material and a thermal compensating member including a high CTE material. The positioning member includes a coupling point and a reference point on a reference axis separated by a first distance. The thermal compensating member includes a connection point and a controlled point separated by another distance that is less than the first distance. A distance ratio of the first distance to the other distance is substantially equal to a CTE ratio of the high CTE material to the low CTE material, and the positioning member is joined to the thermal compensating member through the coupling point and the connection point.
    Type: Grant
    Filed: March 17, 2014
    Date of Patent: February 7, 2017
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Ilya Lavitsky, Keith A. Miller
  • Patent number: 9534286
    Abstract: In some embodiments, a target assembly, for use in a substrate processing chamber having a process shield, may include a backing plate having a first side and an opposing second side, wherein the second side comprises a first surface having a first diameter bounded by a first edge; a target material having a first side bonded to the first surface of the backing plate; wherein the first edge is an interface between the backing plate and the target material; a plurality of slots disposed along an outer periphery of the backing plate extending from the first side of the backing plate toward the second side of the backing plate, wherein the plurality of slots are configured to align the target assembly with respect to the process shield.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: January 3, 2017
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Goichi Yoshidome, Ryan Hanson, Donny Young, Muhammad Rasheed, Keith A. Miller
  • Publication number: 20160354876
    Abstract: A method and apparatus for repairing overhead conveyor chain by removing a section of track, locating a mobile repair station under the exposed track, and effecting the needed repair on the chain by cycling the intact chain past the mobile repair station and repairing it as it passes. Repair embodiments include re-swaging and repair, replacement or rotation of chain links.
    Type: Application
    Filed: June 5, 2015
    Publication date: December 8, 2016
    Applicant: Frost Tech LLC
    Inventors: Charles C. Frost, Charles J. Deschaine, Keith Miller
  • Publication number: 20160340775
    Abstract: Embodiments of the invention generally relate to a process kit for a semiconductor processing chamber, and a semiconductor processing chamber having a kit. More specifically, embodiments described herein relate to a process kit including a deposition ring and a pedestal assembly. The components of the process kit work alone, and in combination, to significantly reduce their effects on the electric fields around a substrate during processing.
    Type: Application
    Filed: July 21, 2016
    Publication date: November 24, 2016
    Inventors: Muhammad RASHEED, Keith A. MILLER, Rongjun WANG
  • Patent number: 9476122
    Abstract: Embodiments described herein generally relate to components for a semiconductor processing chamber, a process kit for a semiconductor processing chamber, and a semiconductor processing chamber having a process kit. In one embodiment a lower shield for encircling a sputtering target and a substrate support is provided. The lower shield comprises a cylindrical outer band having a first diameter dimensioned to encircle the sputtering surface of the sputtering target and the substrate support, the cylindrical band comprising a top wall that surrounds a sputtering surface of a sputtering target and a bottom wall that surrounds the substrate support, a support ledge comprising a resting surface and extending radially outward from the cylindrical outer band, a base plate extending radially inward from the bottom wall of the cylindrical band, and a cylindrical inner band coupled with the base plate and partially surrounding a peripheral edge of the substrate support.
    Type: Grant
    Filed: March 11, 2014
    Date of Patent: October 25, 2016
    Assignee: Applied Materials, Inc.
    Inventors: Martin Lee Riker, Keith A. Miller, Anantha K. Subramani
  • Patent number: D797067
    Type: Grant
    Filed: April 21, 2015
    Date of Patent: September 12, 2017
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Fuhong Zhang, William Johanson, Yu Liu, Adolph Miller Allen, Brij Datta, Keith A. Miller