Patents by Inventor Keiyu O

Keiyu O has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device
    Patent number: 11579528
    Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes a resin whose solubility in an aqueous alkali solution increases by the action of an acid, a compound that generates an acid upon irradiation with actinic rays or radiation, an ester compound, and a fluorine-containing polymer, in which the ester compound has alkali decomposability and has a molecular weight of 50 or more and less than 1,500.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: February 14, 2023
    Assignee: FUJIFILM Corporation
    Inventors: Ryo Nishio, Akira Takada, Akiyoshi Goto, Naohiro Tango, Kazuhiro Marumo, Keiyu O
  • PHOTOSENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
    Publication number: 20200183274
    Abstract: A photosensitive resin composition includes a resin, a photoacid generator, a solvent, and a low-molecular-weight ester compound, in which low-molecular-weight ester compound has alkali degradability and has a molecular weight of less than 1,500, and a content of the low-molecular-weight ester compound is from 0.1% by mass to 6% by mass with respect to the total solid content of the composition.
    Type: Application
    Filed: February 6, 2020
    Publication date: June 11, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Naohiro TANGO, Akiyoshi GOTO, Keiyu O, Kazuhiro Marumo, Ryo NISHIO, Akira TAKADA
  • ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
    Publication number: 20200159117
    Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes a resin whose solubility in an aqueous alkali solution increases by the action of an acid, a compound that generates an acid upon irradiation with actinic rays or radiation, an ester compound, and a fluorine-containing polymer, in which the ester compound has alkali decomposability and has a molecular weight of 50 or more and less than 1,500.
    Type: Application
    Filed: January 21, 2020
    Publication date: May 21, 2020
    Applicant: FUJIFILM Corporation
    Inventors: Ryo NISHIO, Akira Takada, Akiyoshi Goto, Naohiro Tango, Kazuhiro Marumo, Keiyu O