Patents by Inventor Kemmei OTSUBO

Kemmei OTSUBO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11548068
    Abstract: Provided is a method of producing spherical silver powder, which makes it possible to easily produce spherical silver powder having primary particle diameters with less variation than conventional powder and spherical silver powder obtained by the method. The method of producing spherical silver powder includes a reduction precipitation step of precipitating silver particles by reduction by adding a reductant including hydrazine carbonate to an aqueous reaction system containing silver ions.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: January 10, 2023
    Assignee: DOWA Electronics Materials Co., Ltd.
    Inventors: Kemmei Otsubo, Koji Hirata
  • Publication number: 20210268583
    Abstract: Provided is a method of producing spherical silver powder, which makes it possible to easily produce spherical silver powder having primary particle diameters with less variation than conventional powder and spherical silver powder obtained by the method. The method of producing spherical silver powder includes a reduction precipitation step of precipitating silver particles by reduction by adding a reductant including hydrazine carbonate to an aqueous reaction system containing silver ions.
    Type: Application
    Filed: July 17, 2019
    Publication date: September 2, 2021
    Applicant: DOWA Electronics Materials Co., Ltd.
    Inventors: Kemmei OTSUBO, Koji HIRATA