Patents by Inventor Kenichi Itou

Kenichi Itou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220140355
    Abstract: To provide a carbon electrode material which is capable of decreasing cell resistance during initial charging and discharging while improving oxidation resistance to Mn ions. A carbon electrode material for a redox flow battery, including carbon fibers (A), graphite particles (B), and a carbon material (C) for binding the carbon fibers (A) and the graphite particles (B), the carbon electrode material satisfying (1) Lc(C), (2) Lc(C)/Lc(A), (3) an average curvature of the carbon fibers (A), and (4) a number of oxygen atoms bound to a surface of the carbon electrode material.
    Type: Application
    Filed: March 6, 2020
    Publication date: May 5, 2022
    Applicants: TOYOBO CO., LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Ryouhei Iwahara, Masaru Kobayashi, Takahiro Matsumura, Kana Morimoto, Masayuki Oya, Yongrong Dong, Kenichi Itou, Takahiro Ikegami
  • Patent number: 11101466
    Abstract: A carbon electrode material is disclosed for a redox flow battery that particularly, even when using an Mn—Ti type electrolyte, while stabilizing Mn ions and suppressing a rise in cell resistance during initial charge and discharge, has excellent oxidation resistance. The electrode material includes a carbonaceous fiber, and a carbonaceous material for binding the carbonaceous fiber, and satisfies the requirements: (1) when the size of a crystallite in a c axis direction found by X-ray diffraction in the carbonaceous material (B) is Lc(B), Lc(B) is 10 nm or greater; (2) when the size of the crystallite in the c axis direction found by X-ray diffraction in the carbonaceous fiber (A) is Lc(A), Lc(B)/Lc(A) is 1.0 or greater; and (3) the number of bonded oxygen atoms of the carbon electrode material surface is 1.0% or greater than the total number of carbon atoms of the carbon electrode material surface.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: August 24, 2021
    Assignees: TOYOBO CO., LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Toshikatsu Enjoji, Takahiro Matsumura, Ryouhei Iwahara, Masaru Kobayashi, Masako Tatsuta, Yongrong Dong, Masayuki Oya, Kenichi Itou, Yoshiyasu Kawagoe
  • Publication number: 20200373583
    Abstract: A carbon electrode material is disclosed for a redox flow battery that particularly, even when using an Mn—Ti type electrolyte, while stabilizing Mn ions and suppressing a rise in cell resistance during initial charge and discharge, has excellent oxidation resistance. The electrode material includes a carbonaceous fiber, and a carbonaceous material for binding the carbonaceous fiber, and satisfies the requirements: (1) when the size of a crystallite in a c axis direction found by X-ray diffraction in the carbonaceous material (B) is Lc(B), Lc(B) is 10 nm or greater; (2) when the size of the crystallite in the c axis direction found by X-ray diffraction in the carbonaceous fiber (A) is Lc(A), Lc(B)/Lc(A) is 1.0 or greater; and (3) the number of bonded oxygen atoms of the carbon electrode material surface is 1.0% or greater than the total number of carbon atoms of the carbon electrode material surface.
    Type: Application
    Filed: August 29, 2018
    Publication date: November 26, 2020
    Applicants: TOYOBO CO., LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Toshikatsu Enjoji, Takahiro Matsumura, Ryouhei Iwahara, Masaru Kobayashi, Masako Tatsuta, Yongrong Dong, Masayuki Oya, Kenichi Itou, Yoshiyasu Kawagoe
  • Patent number: 10218007
    Abstract: Provided are a bipolar plate that can decrease the internal resistance of a flow battery, a redox flow battery, and a method for producing a bipolar plate. A bipolar plate sandwiched between a positive electrode in which a positive electrode electrolyte flows and a negative electrode in which a negative electrode electrolyte flows includes a positive-electrode-side surface in which a flow channel having a plurality of grooves through which the positive electrode electrolyte flows is provided and a negative-electrode-side surface in which a flow channel having a plurality of grooves through which the negative electrode electrolyte flows is provided.
    Type: Grant
    Filed: January 23, 2015
    Date of Patent: February 26, 2019
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Kei Hanafusa, Kenichi Itou, Souichirou Okumura, Takemi Terao, Hayato Fujita
  • Patent number: 9761890
    Abstract: A redox flow battery having reduced internal resistance is provided. The redox flow battery includes a membrane, a bipolar plate, an electrode disposed between the membrane and the bipolar plate, an inlet port for supplying an electrolyte to the electrode, and an outlet port for discharging the electrolyte from the electrode, and performs a charge-discharge reaction by allowing the electrolyte to flow in the electrode. The electrode includes an anisotropic electrode layer having different permeabilities between a direction A1 on a plane of the electrode and a direction A2 orthogonal to the direction A1 on the plane of the electrode. In the anisotropic electrode layer, a permeability K1 in the direction A1 is larger than a permeability K2 in the direction A2.
    Type: Grant
    Filed: December 9, 2014
    Date of Patent: September 12, 2017
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Kenichi Itou, Kei Hanafusa, Souichirou Okumura, Takemi Terao
  • Publication number: 20170047594
    Abstract: Provided are a bipolar plate that can decrease the internal resistance of a flow battery, a redox flow battery, and a method for producing a bipolar plate. A bipolar plate sandwiched between a positive electrode in which a positive electrode electrolyte flows and a negative electrode in which a negative electrode electrolyte flows includes a positive-electrode-side surface in which a flow channel having a plurality of grooves through which the positive electrode electrolyte flows is provided and a negative-electrode-side surface in which a flow channel having a plurality of grooves through which the negative electrode electrolyte flows is provided.
    Type: Application
    Filed: January 23, 2015
    Publication date: February 16, 2017
    Inventors: Kei Hanafusa, Kenichi Itou, Souichirou Okumura, Takemi Terao, Hayato Fujita
  • Publication number: 20170012299
    Abstract: A redox flow battery having reduced internal resistance is provided. The redox flow battery includes a membrane, a bipolar plate, an electrode disposed between the membrane and the bipolar plate, an inlet port for supplying an electrolyte to the electrode, and an outlet port for discharging the electrolyte from the electrode, and performs a charge-discharge reaction by allowing the electrolyte to flow in the electrode. The electrode includes an anisotropic electrode layer having different permeabilities between a direction A1 on a plane of the electrode and a direction A2 orthogonal to the direction A1 on the plane of the electrode. In the anisotropic electrode layer, a permeability K1 in the direction A1 is larger than a permeability K2 in the direction A2.
    Type: Application
    Filed: December 9, 2014
    Publication date: January 12, 2017
    Inventors: Kenichi Itou, Kei Hanafusa, Souichirou Okumura, Takemi Terao
  • Patent number: 9454148
    Abstract: A machine control device includes a control unit body and a display operation device that can be separated from the control unit body. The display operation device uses a mechanism which does not use power while the display operation device waits for charging. The display operation device is automatically turned on and off on the basis of the on and off states of the control unit body. A power switch can be provided only in the control unit body. The supply of power from the control device can be automatically turned on and off on the basis of the state of the display operation device. Therefore, the operability and reliability of the machine control device are improved.
    Type: Grant
    Filed: December 12, 2013
    Date of Patent: September 27, 2016
    Assignee: FANUC CORPORATION
    Inventors: Yuuhei Osa, Kenichi Itou
  • Publication number: 20140172129
    Abstract: A machine control device includes a control unit body and a display operation device that can be separated from the control unit body. The display operation device uses a mechanism which does not use power while the display operation device waits for charging. The display operation device is automatically turned on and off on the basis of the on and off states of the control unit body. A power switch can be provided only in the control unit body. The supply of power from the control device can be automatically turned on and off on the basis of the state of the display operation device. Therefore, the operability and reliability of the machine control device are improved.
    Type: Application
    Filed: December 12, 2013
    Publication date: June 19, 2014
    Applicant: FANUC CORPORATION
    Inventors: Yuuhei OSA, Kenichi ITOU
  • Publication number: 20130011298
    Abstract: A sample analyzer comprising: a measurement unit configured to perform, by using a reagent, a quality control measurement for measuring a quality control specimen; a display; and a controller configured to control the display to show reagent information for verifying a state of the reagent used in the quality control measurement, in conjunction with a result of the quality control measurement obtained by the measurement unit.
    Type: Application
    Filed: July 6, 2012
    Publication date: January 10, 2013
    Inventors: Kenichi Itou, Naoki Shindo, Noriyuki Saito
  • Publication number: 20120321514
    Abstract: An analyzer system comprising: a transporting apparatus having a rack stocker for stocking a rack which holds one or more samples, the transporting apparatus being configured to transport the rack in the rack stocker; a measuring apparatus configured to perform a measurement on a sample of the rack transported by the transporting apparatus; an obtaining section configured to obtain identification data of a person who sets the rack on the rack stocker; a data storage; and a system controller, is disclosed. The system controller is configured to store, in the data storage, a result of the measurement of the sample as well as the identification data obtained from the person who had set the rack holding the sample on the rack stocker.
    Type: Application
    Filed: June 19, 2012
    Publication date: December 20, 2012
    Applicant: SYSMEX CORPORATION
    Inventors: Kenichi ITOU, Naoki SHINDO, Noriyuki SAITO
  • Patent number: 8178955
    Abstract: A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically connected with the semiconductor element; and a sealing resin for sealing the semiconductor element, the die pad and the electrode terminals so that a surface of each electrode terminal on an opposite side from a surface having the connecting portion is exposed as an external terminal surface. A recess having a planar shape of a circle is formed on the surface of each electrode terminal with the connecting portion, and the recess is arranged between an end portion of the electrode terminal exposed from an outer edge side face of the sealing resin and the connecting portion. While a function of the configuration for suppressing the peeling between the electrode terminal and the sealing resin can be maintained by mitigating an external force applied to the electrode terminal, the semiconductor device can be downsized.
    Type: Grant
    Filed: April 4, 2011
    Date of Patent: May 15, 2012
    Assignee: Panasonic Corporation
    Inventors: Kenichi Itou, Noboru Takeuchi, Shigetoyo Kawakami, Toshiyuki Fukuda
  • Publication number: 20110177657
    Abstract: A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically connected with the semiconductor element; and a sealing resin for sealing the semiconductor element, the die pad and the electrode terminals so that a surface of each electrode terminal on an opposite side from a surface having the connecting portion is exposed as an external terminal surface. A recess having a planar shape of a circle is formed on the surface of each electrode terminal with the connecting portion, and the recess is arranged between an end portion of the electrode terminal exposed from an outer edge side face of the sealing resin and the connecting portion. While a function of the configuration for suppressing the peeling between the electrode terminal and the sealing resin can be maintained by mitigating an external force applied to the electrode terminal, the semiconductor device can be downsized.
    Type: Application
    Filed: April 4, 2011
    Publication date: July 21, 2011
    Applicant: PANASONIC CORPORATION
    Inventors: Kenichi ITOU, Noboru TAKEUCHI, Shigetoyo KAWAKAMI, Toshiyuki FUKUDA
  • Patent number: 7939933
    Abstract: A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically connected with the semiconductor element; and a sealing resin for sealing the semiconductor element, the die pad and the electrode terminals so that a surface of each electrode terminal on an opposite side from a surface having the connecting portion is exposed as an external terminal surface. A recess having a planar shape of a circle is formed on the surface of each electrode terminal with the connecting portion, and the recess is arranged between an end portion of the electrode terminal exposed from an outer edge side face of the sealing resin and the connecting portion. While a function of the configuration for suppressing the peeling between the electrode terminal and the sealing resin can be maintained by mitigating an external force applied to the electrode terminal, the semiconductor device can be downsized.
    Type: Grant
    Filed: August 7, 2009
    Date of Patent: May 10, 2011
    Assignee: Panasonic Corporation
    Inventors: Kenichi Itou, Noboru Takeuchi, Shigetoyo Kawakami, Toshiyuki Fukuda
  • Patent number: 7816777
    Abstract: A semiconductor-element mounting substrate is a substrate for mounting a semiconductor element, and includes a substrate body. The substrate body has a mounting surface, and the center portion of the mounting surface is provided with a die pattern. Through conductors are provided in a portion of the substrate body located outside the die pattern to penetrate the substrate body in the thicknesswise direction. First terminals and second terminals are connected to the through conductors, respectively. The first terminals each extend toward the outer edge of the mounting surface, and they are electrically connected to the semiconductor element. The second terminals are provided on a surface of the substrate body opposite to the mounting surface.
    Type: Grant
    Filed: December 1, 2006
    Date of Patent: October 19, 2010
    Assignee: Panasonic Corporation
    Inventors: Masanori Minamio, Noboru Takeuchi, Kenichi Itou, Toshiyuki Fukuda, Hideki Sakota
  • Patent number: 7719119
    Abstract: A semiconductor device has upper electrodes and external terminals which are protruding above the both surfaces of a substrate for semiconductor device and connected to each other by penetrating electrodes, a first insulating film covering at least a metal pattern except for the portions of the first insulating film corresponding to the upper electrodes, a second insulating film covering at least another metal pattern except for the portions of the second insulating film corresponding to the external terminals, and a semiconductor element connected to the upper electrodes and placed on the substrate for semiconductor device. The solder-connected surface of the external terminal is positioned to have a height larger than that of a surface of the second insulating film. The semiconductor element is placed on the first insulating film and covered, together with the upper electrodes, with a mold resin.
    Type: Grant
    Filed: October 23, 2006
    Date of Patent: May 18, 2010
    Assignee: Panasonic Corporation
    Inventors: Noriyuki Yoshikawa, Noboru Takeuchi, Kenichi Itou, Toshiyuki Fukuda
  • Publication number: 20090294950
    Abstract: A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically connected with the semiconductor element; and a sealing resin for sealing the semiconductor element, the die pad and the electrode terminals so that a surface of each electrode terminal on an opposite side from a surface having the connecting portion is exposed as an external terminal surface. A recess having a planar shape of a circle is formed on the surface of each electrode terminal with the connecting portion, and the recess is arranged between an end portion of the electrode terminal exposed from an outer edge side face of the sealing resin and the connecting portion. While a function of the configuration for suppressing the peeling between the electrode terminal and the sealing resin can be maintained by mitigating an external force applied to the electrode terminal, the semiconductor device can be downsized.
    Type: Application
    Filed: August 7, 2009
    Publication date: December 3, 2009
    Applicant: PANASONIC CORPORATION
    Inventors: Kenichi Itou, Noboru Takeuchi, Shigetoyo Kawakami, Toshiyuki Fukuda
  • Patent number: 7589404
    Abstract: A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically connected with the semiconductor element; and a sealing resin for sealing the semiconductor element, the die pad and the electrode terminals so that a surface of each electrode terminal on an opposite side from a surface having the connecting portion is exposed as an external terminal surface. A recess having a planar shape of a circle is formed on the surface of each electrode terminal with the connecting portion, and the recess is arranged between an end portion of the electrode terminal exposed from an outer edge side face of the sealing resin and the connecting portion. While a function of the configuration for suppressing the peeling between the electrode terminal and the sealing resin can be maintained by mitigating an external force applied to the electrode terminal, the semiconductor device can be downsized.
    Type: Grant
    Filed: June 5, 2008
    Date of Patent: September 15, 2009
    Assignee: Panasonic Corporation
    Inventors: Kenichi Itou, Noboru Takeuchi, Shigetoyo Kawakami, Toshiyuki Fukuda
  • Publication number: 20090130801
    Abstract: There are provided a lead frame including a plurality of first external terminal portions 5 provided on a plane, inner lead portions 6 formed of back surfaces of the respective first external terminal portions and arranged so as to surround a region inside the inner lead portions, and second external terminal portions 7 formed of uppermost surfaces of convex portions positioned outside the respective inner lead portions; a semiconductor element 2 flip-chip bonded to the inner lead portions via bumps 3; and an encapsulating resin 4 encapsulating surroundings of the semiconductor element and the inner lead portions. The first external terminal portions are arranged in a lower surface region of the encapsulating resin along a periphery of the region, and the second external terminal portions are exposed on an upper surface of the encapsulating resin.
    Type: Application
    Filed: January 16, 2009
    Publication date: May 21, 2009
    Applicant: PANASONIC CORPORATION
    Inventors: Toshiyuki FUKUDA, Masanori MINAMIO, Hiroaki FUJIMOTO, Ryuichi SAHARA, Kenichi ITOU
  • Patent number: 7495319
    Abstract: There are provided a lead frame including a plurality of first external terminal portions 5 provided on a plane, inner lead portions 6 formed of back surfaces of the respective first external terminal portions and arranged so as to surround a region inside the inner lead portions, and second external terminal portions 7 formed of uppermost surfaces of convex portions positioned outside the respective inner lead portions; a semiconductor element 2 flip-chip bonded to the inner lead portions via bumps 3; and an encapsulating resin 4 encapsulating surroundings of the semiconductor element and the inner lead portions. The first external terminal portions are arranged in a lower surface region of the encapsulating resin along a periphery of the region, and the second external terminal portions are exposed on an upper surface of the encapsulating resin.
    Type: Grant
    Filed: March 3, 2005
    Date of Patent: February 24, 2009
    Assignee: Panasonic Corporation
    Inventors: Toshiyuki Fukuda, Masanori Minamio, Hiroaki Fujimoto, Ryuichi Sahara, Kenichi Itou