Patents by Inventor Kenichi Itou
Kenichi Itou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220140355Abstract: To provide a carbon electrode material which is capable of decreasing cell resistance during initial charging and discharging while improving oxidation resistance to Mn ions. A carbon electrode material for a redox flow battery, including carbon fibers (A), graphite particles (B), and a carbon material (C) for binding the carbon fibers (A) and the graphite particles (B), the carbon electrode material satisfying (1) Lc(C), (2) Lc(C)/Lc(A), (3) an average curvature of the carbon fibers (A), and (4) a number of oxygen atoms bound to a surface of the carbon electrode material.Type: ApplicationFiled: March 6, 2020Publication date: May 5, 2022Applicants: TOYOBO CO., LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Ryouhei Iwahara, Masaru Kobayashi, Takahiro Matsumura, Kana Morimoto, Masayuki Oya, Yongrong Dong, Kenichi Itou, Takahiro Ikegami
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Patent number: 11101466Abstract: A carbon electrode material is disclosed for a redox flow battery that particularly, even when using an Mn—Ti type electrolyte, while stabilizing Mn ions and suppressing a rise in cell resistance during initial charge and discharge, has excellent oxidation resistance. The electrode material includes a carbonaceous fiber, and a carbonaceous material for binding the carbonaceous fiber, and satisfies the requirements: (1) when the size of a crystallite in a c axis direction found by X-ray diffraction in the carbonaceous material (B) is Lc(B), Lc(B) is 10 nm or greater; (2) when the size of the crystallite in the c axis direction found by X-ray diffraction in the carbonaceous fiber (A) is Lc(A), Lc(B)/Lc(A) is 1.0 or greater; and (3) the number of bonded oxygen atoms of the carbon electrode material surface is 1.0% or greater than the total number of carbon atoms of the carbon electrode material surface.Type: GrantFiled: August 29, 2018Date of Patent: August 24, 2021Assignees: TOYOBO CO., LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Toshikatsu Enjoji, Takahiro Matsumura, Ryouhei Iwahara, Masaru Kobayashi, Masako Tatsuta, Yongrong Dong, Masayuki Oya, Kenichi Itou, Yoshiyasu Kawagoe
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Publication number: 20200373583Abstract: A carbon electrode material is disclosed for a redox flow battery that particularly, even when using an Mn—Ti type electrolyte, while stabilizing Mn ions and suppressing a rise in cell resistance during initial charge and discharge, has excellent oxidation resistance. The electrode material includes a carbonaceous fiber, and a carbonaceous material for binding the carbonaceous fiber, and satisfies the requirements: (1) when the size of a crystallite in a c axis direction found by X-ray diffraction in the carbonaceous material (B) is Lc(B), Lc(B) is 10 nm or greater; (2) when the size of the crystallite in the c axis direction found by X-ray diffraction in the carbonaceous fiber (A) is Lc(A), Lc(B)/Lc(A) is 1.0 or greater; and (3) the number of bonded oxygen atoms of the carbon electrode material surface is 1.0% or greater than the total number of carbon atoms of the carbon electrode material surface.Type: ApplicationFiled: August 29, 2018Publication date: November 26, 2020Applicants: TOYOBO CO., LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.Inventors: Toshikatsu Enjoji, Takahiro Matsumura, Ryouhei Iwahara, Masaru Kobayashi, Masako Tatsuta, Yongrong Dong, Masayuki Oya, Kenichi Itou, Yoshiyasu Kawagoe
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Patent number: 10218007Abstract: Provided are a bipolar plate that can decrease the internal resistance of a flow battery, a redox flow battery, and a method for producing a bipolar plate. A bipolar plate sandwiched between a positive electrode in which a positive electrode electrolyte flows and a negative electrode in which a negative electrode electrolyte flows includes a positive-electrode-side surface in which a flow channel having a plurality of grooves through which the positive electrode electrolyte flows is provided and a negative-electrode-side surface in which a flow channel having a plurality of grooves through which the negative electrode electrolyte flows is provided.Type: GrantFiled: January 23, 2015Date of Patent: February 26, 2019Assignee: Sumitomo Electric Industries, Ltd.Inventors: Kei Hanafusa, Kenichi Itou, Souichirou Okumura, Takemi Terao, Hayato Fujita
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Patent number: 9761890Abstract: A redox flow battery having reduced internal resistance is provided. The redox flow battery includes a membrane, a bipolar plate, an electrode disposed between the membrane and the bipolar plate, an inlet port for supplying an electrolyte to the electrode, and an outlet port for discharging the electrolyte from the electrode, and performs a charge-discharge reaction by allowing the electrolyte to flow in the electrode. The electrode includes an anisotropic electrode layer having different permeabilities between a direction A1 on a plane of the electrode and a direction A2 orthogonal to the direction A1 on the plane of the electrode. In the anisotropic electrode layer, a permeability K1 in the direction A1 is larger than a permeability K2 in the direction A2.Type: GrantFiled: December 9, 2014Date of Patent: September 12, 2017Assignee: Sumitomo Electric Industries, Ltd.Inventors: Kenichi Itou, Kei Hanafusa, Souichirou Okumura, Takemi Terao
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Publication number: 20170047594Abstract: Provided are a bipolar plate that can decrease the internal resistance of a flow battery, a redox flow battery, and a method for producing a bipolar plate. A bipolar plate sandwiched between a positive electrode in which a positive electrode electrolyte flows and a negative electrode in which a negative electrode electrolyte flows includes a positive-electrode-side surface in which a flow channel having a plurality of grooves through which the positive electrode electrolyte flows is provided and a negative-electrode-side surface in which a flow channel having a plurality of grooves through which the negative electrode electrolyte flows is provided.Type: ApplicationFiled: January 23, 2015Publication date: February 16, 2017Inventors: Kei Hanafusa, Kenichi Itou, Souichirou Okumura, Takemi Terao, Hayato Fujita
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Publication number: 20170012299Abstract: A redox flow battery having reduced internal resistance is provided. The redox flow battery includes a membrane, a bipolar plate, an electrode disposed between the membrane and the bipolar plate, an inlet port for supplying an electrolyte to the electrode, and an outlet port for discharging the electrolyte from the electrode, and performs a charge-discharge reaction by allowing the electrolyte to flow in the electrode. The electrode includes an anisotropic electrode layer having different permeabilities between a direction A1 on a plane of the electrode and a direction A2 orthogonal to the direction A1 on the plane of the electrode. In the anisotropic electrode layer, a permeability K1 in the direction A1 is larger than a permeability K2 in the direction A2.Type: ApplicationFiled: December 9, 2014Publication date: January 12, 2017Inventors: Kenichi Itou, Kei Hanafusa, Souichirou Okumura, Takemi Terao
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Patent number: 9454148Abstract: A machine control device includes a control unit body and a display operation device that can be separated from the control unit body. The display operation device uses a mechanism which does not use power while the display operation device waits for charging. The display operation device is automatically turned on and off on the basis of the on and off states of the control unit body. A power switch can be provided only in the control unit body. The supply of power from the control device can be automatically turned on and off on the basis of the state of the display operation device. Therefore, the operability and reliability of the machine control device are improved.Type: GrantFiled: December 12, 2013Date of Patent: September 27, 2016Assignee: FANUC CORPORATIONInventors: Yuuhei Osa, Kenichi Itou
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Publication number: 20140172129Abstract: A machine control device includes a control unit body and a display operation device that can be separated from the control unit body. The display operation device uses a mechanism which does not use power while the display operation device waits for charging. The display operation device is automatically turned on and off on the basis of the on and off states of the control unit body. A power switch can be provided only in the control unit body. The supply of power from the control device can be automatically turned on and off on the basis of the state of the display operation device. Therefore, the operability and reliability of the machine control device are improved.Type: ApplicationFiled: December 12, 2013Publication date: June 19, 2014Applicant: FANUC CORPORATIONInventors: Yuuhei OSA, Kenichi ITOU
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Publication number: 20130011298Abstract: A sample analyzer comprising: a measurement unit configured to perform, by using a reagent, a quality control measurement for measuring a quality control specimen; a display; and a controller configured to control the display to show reagent information for verifying a state of the reagent used in the quality control measurement, in conjunction with a result of the quality control measurement obtained by the measurement unit.Type: ApplicationFiled: July 6, 2012Publication date: January 10, 2013Inventors: Kenichi Itou, Naoki Shindo, Noriyuki Saito
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Publication number: 20120321514Abstract: An analyzer system comprising: a transporting apparatus having a rack stocker for stocking a rack which holds one or more samples, the transporting apparatus being configured to transport the rack in the rack stocker; a measuring apparatus configured to perform a measurement on a sample of the rack transported by the transporting apparatus; an obtaining section configured to obtain identification data of a person who sets the rack on the rack stocker; a data storage; and a system controller, is disclosed. The system controller is configured to store, in the data storage, a result of the measurement of the sample as well as the identification data obtained from the person who had set the rack holding the sample on the rack stocker.Type: ApplicationFiled: June 19, 2012Publication date: December 20, 2012Applicant: SYSMEX CORPORATIONInventors: Kenichi ITOU, Naoki SHINDO, Noriyuki SAITO
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Patent number: 8178955Abstract: A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically connected with the semiconductor element; and a sealing resin for sealing the semiconductor element, the die pad and the electrode terminals so that a surface of each electrode terminal on an opposite side from a surface having the connecting portion is exposed as an external terminal surface. A recess having a planar shape of a circle is formed on the surface of each electrode terminal with the connecting portion, and the recess is arranged between an end portion of the electrode terminal exposed from an outer edge side face of the sealing resin and the connecting portion. While a function of the configuration for suppressing the peeling between the electrode terminal and the sealing resin can be maintained by mitigating an external force applied to the electrode terminal, the semiconductor device can be downsized.Type: GrantFiled: April 4, 2011Date of Patent: May 15, 2012Assignee: Panasonic CorporationInventors: Kenichi Itou, Noboru Takeuchi, Shigetoyo Kawakami, Toshiyuki Fukuda
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Publication number: 20110177657Abstract: A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically connected with the semiconductor element; and a sealing resin for sealing the semiconductor element, the die pad and the electrode terminals so that a surface of each electrode terminal on an opposite side from a surface having the connecting portion is exposed as an external terminal surface. A recess having a planar shape of a circle is formed on the surface of each electrode terminal with the connecting portion, and the recess is arranged between an end portion of the electrode terminal exposed from an outer edge side face of the sealing resin and the connecting portion. While a function of the configuration for suppressing the peeling between the electrode terminal and the sealing resin can be maintained by mitigating an external force applied to the electrode terminal, the semiconductor device can be downsized.Type: ApplicationFiled: April 4, 2011Publication date: July 21, 2011Applicant: PANASONIC CORPORATIONInventors: Kenichi ITOU, Noboru TAKEUCHI, Shigetoyo KAWAKAMI, Toshiyuki FUKUDA
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Patent number: 7939933Abstract: A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically connected with the semiconductor element; and a sealing resin for sealing the semiconductor element, the die pad and the electrode terminals so that a surface of each electrode terminal on an opposite side from a surface having the connecting portion is exposed as an external terminal surface. A recess having a planar shape of a circle is formed on the surface of each electrode terminal with the connecting portion, and the recess is arranged between an end portion of the electrode terminal exposed from an outer edge side face of the sealing resin and the connecting portion. While a function of the configuration for suppressing the peeling between the electrode terminal and the sealing resin can be maintained by mitigating an external force applied to the electrode terminal, the semiconductor device can be downsized.Type: GrantFiled: August 7, 2009Date of Patent: May 10, 2011Assignee: Panasonic CorporationInventors: Kenichi Itou, Noboru Takeuchi, Shigetoyo Kawakami, Toshiyuki Fukuda
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Patent number: 7816777Abstract: A semiconductor-element mounting substrate is a substrate for mounting a semiconductor element, and includes a substrate body. The substrate body has a mounting surface, and the center portion of the mounting surface is provided with a die pattern. Through conductors are provided in a portion of the substrate body located outside the die pattern to penetrate the substrate body in the thicknesswise direction. First terminals and second terminals are connected to the through conductors, respectively. The first terminals each extend toward the outer edge of the mounting surface, and they are electrically connected to the semiconductor element. The second terminals are provided on a surface of the substrate body opposite to the mounting surface.Type: GrantFiled: December 1, 2006Date of Patent: October 19, 2010Assignee: Panasonic CorporationInventors: Masanori Minamio, Noboru Takeuchi, Kenichi Itou, Toshiyuki Fukuda, Hideki Sakota
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Patent number: 7719119Abstract: A semiconductor device has upper electrodes and external terminals which are protruding above the both surfaces of a substrate for semiconductor device and connected to each other by penetrating electrodes, a first insulating film covering at least a metal pattern except for the portions of the first insulating film corresponding to the upper electrodes, a second insulating film covering at least another metal pattern except for the portions of the second insulating film corresponding to the external terminals, and a semiconductor element connected to the upper electrodes and placed on the substrate for semiconductor device. The solder-connected surface of the external terminal is positioned to have a height larger than that of a surface of the second insulating film. The semiconductor element is placed on the first insulating film and covered, together with the upper electrodes, with a mold resin.Type: GrantFiled: October 23, 2006Date of Patent: May 18, 2010Assignee: Panasonic CorporationInventors: Noriyuki Yoshikawa, Noboru Takeuchi, Kenichi Itou, Toshiyuki Fukuda
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Publication number: 20090294950Abstract: A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically connected with the semiconductor element; and a sealing resin for sealing the semiconductor element, the die pad and the electrode terminals so that a surface of each electrode terminal on an opposite side from a surface having the connecting portion is exposed as an external terminal surface. A recess having a planar shape of a circle is formed on the surface of each electrode terminal with the connecting portion, and the recess is arranged between an end portion of the electrode terminal exposed from an outer edge side face of the sealing resin and the connecting portion. While a function of the configuration for suppressing the peeling between the electrode terminal and the sealing resin can be maintained by mitigating an external force applied to the electrode terminal, the semiconductor device can be downsized.Type: ApplicationFiled: August 7, 2009Publication date: December 3, 2009Applicant: PANASONIC CORPORATIONInventors: Kenichi Itou, Noboru Takeuchi, Shigetoyo Kawakami, Toshiyuki Fukuda
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Patent number: 7589404Abstract: A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically connected with the semiconductor element; and a sealing resin for sealing the semiconductor element, the die pad and the electrode terminals so that a surface of each electrode terminal on an opposite side from a surface having the connecting portion is exposed as an external terminal surface. A recess having a planar shape of a circle is formed on the surface of each electrode terminal with the connecting portion, and the recess is arranged between an end portion of the electrode terminal exposed from an outer edge side face of the sealing resin and the connecting portion. While a function of the configuration for suppressing the peeling between the electrode terminal and the sealing resin can be maintained by mitigating an external force applied to the electrode terminal, the semiconductor device can be downsized.Type: GrantFiled: June 5, 2008Date of Patent: September 15, 2009Assignee: Panasonic CorporationInventors: Kenichi Itou, Noboru Takeuchi, Shigetoyo Kawakami, Toshiyuki Fukuda
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Publication number: 20090130801Abstract: There are provided a lead frame including a plurality of first external terminal portions 5 provided on a plane, inner lead portions 6 formed of back surfaces of the respective first external terminal portions and arranged so as to surround a region inside the inner lead portions, and second external terminal portions 7 formed of uppermost surfaces of convex portions positioned outside the respective inner lead portions; a semiconductor element 2 flip-chip bonded to the inner lead portions via bumps 3; and an encapsulating resin 4 encapsulating surroundings of the semiconductor element and the inner lead portions. The first external terminal portions are arranged in a lower surface region of the encapsulating resin along a periphery of the region, and the second external terminal portions are exposed on an upper surface of the encapsulating resin.Type: ApplicationFiled: January 16, 2009Publication date: May 21, 2009Applicant: PANASONIC CORPORATIONInventors: Toshiyuki FUKUDA, Masanori MINAMIO, Hiroaki FUJIMOTO, Ryuichi SAHARA, Kenichi ITOU
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Patent number: 7495319Abstract: There are provided a lead frame including a plurality of first external terminal portions 5 provided on a plane, inner lead portions 6 formed of back surfaces of the respective first external terminal portions and arranged so as to surround a region inside the inner lead portions, and second external terminal portions 7 formed of uppermost surfaces of convex portions positioned outside the respective inner lead portions; a semiconductor element 2 flip-chip bonded to the inner lead portions via bumps 3; and an encapsulating resin 4 encapsulating surroundings of the semiconductor element and the inner lead portions. The first external terminal portions are arranged in a lower surface region of the encapsulating resin along a periphery of the region, and the second external terminal portions are exposed on an upper surface of the encapsulating resin.Type: GrantFiled: March 3, 2005Date of Patent: February 24, 2009Assignee: Panasonic CorporationInventors: Toshiyuki Fukuda, Masanori Minamio, Hiroaki Fujimoto, Ryuichi Sahara, Kenichi Itou