Abstract: A defect review system includes a stage, a light source, a turning mirror, and a ring of collectors. The stage supports and moves an article for inspection, the article having a surface. The light source provides light. The turning mirror turns the light toward the surface at an oblique incident angle whereby the light illuminates a spot on the surface and the light scatters from the spot. The ring of collectors is adapted to collect scattering light. A method of reviewing surface of a wafer is disclosed. The method provides a dark-field mode of operation adapted to inspect the surface by illuminating a spot on the surface at an oblique angle and collecting scattering light from the surface. Further, the method provides a bright-field mode of operation adapted to inspect the surface by illuminating a spot on the surface at a normal angle to examine the reflecting light.

Abstract: A method is described for characterizing defects on a test surface of a semiconductor wafer using a confocal-microscope-based automatic defect characterization (ADC) system. The surface to be tested and a reference surface are scanned using a confocal microscope to obtain three-dimensional images of the test and reference surfaces. The test and reference images are converted into sets of geometric constructs, or “primitives,” that are used to approximate features of the images. Next, the sets of test and reference primitives are compared to determine whether the set of test primitives is different from the set of reference primitives. If such a difference exists, then the difference data is used to generate defect parameters, which are then compared to a knowledge base of defect reference data. Based on this comparison, the ADC system characterizes the defect and estimates a degree of confidence in the characterization.

Abstract: A method is described for characterizing defects on a test surface of a semiconductor wafer using a confocal-microscope-based automatic defect characterization (ADC) system. The surface to be tested and a reference surface are scanned using a confocal microscope to obtain three-dimensional images of the test and reference surfaces. The test and reference images are converted into sets of geometric constructs, or “primitives,” that are used to approximate features of the images. Next, the sets of test and reference primitives are compared to determine whether the set of test primitives is different from the set of reference primitives. If such a difference exists, then the difference data is used to generate defect parameters, which are then compared to a knowledge base of defect reference data. Based on this comparison, the ADC system characterizes the defect and estimates a degree of confidence in the characterization.

Abstract: An inspection system includes a stage, a light source, and a light collection subsystem is disclosed. The stage supports an article for inspection, the article having a surface. The light source provides light impinging on and scattering from an illumination area of the surface. The light collection system includes a plurality of collectors arranged generally in a semi-spherical layout such that each collector collects at least a portion of the scattering light at a collection polar angle and a collection azimuthal angle that are unique relative to collection polar angle and collection azimuthal angle of other collectors. The collectors are arranged in three rings of collectors. The inspection system includes a plurality of channels where each collector of the light collection subsystem is associated with a channel. The inspection system includes a processor connected to the channels. The processor is adapted to process information from the channels.

Abstract: A method is described for characterizing defects on a test surface of a semiconductor wafer using a confocal-microscope-based automatic defect characterization (ADC) system. The surface to be tested and a reference surface are scanned using a confocal microscope to obtain three-dimensional images of the test and reference surfaces. The test and reference images are converted into sets of geometric constructs, or “primitives,” that are used to approximate features of the images. Next, the sets of test and reference primitives are compared to determine whether the set of test primitives is different from the set of reference primitives. If such a difference exists, then the difference data is used to generate defect parameters, which are then compared to a knowledge base of defect reference data. Based on this comparison, the ADC system characterizes the defect and estimates a degree of confidence in the characterization.

Abstract: A switching regulator includes an inductive element to provide a first voltage across the element and at least one switch to energize and de-energize the inductive element to produce an output voltage. A controller of the regulator constructs an indication of a current from the first voltage and operates the switch(es) to regulate the output voltage in response to the indication.

Abstract: A method is described for characterizing defects on a test surface of a semiconductor wafer using a confocal-microscope-based automatic defect characterization (ADC) system. The surface to be tested and a reference surface are scanned using a confocal microscope to obtain three-dimensional images of the test and reference surfaces. The test and reference images are converted into sets of geometric constructs, or “primitives,” that are used to approximate features of the images. Next, the sets of test and reference primitives are compared to determine whether the set of test primitives is different from the set of reference primitives. If such a difference exists, then the difference data is used to generate defect parameters, which are then compared to a knowledge base of defect reference data. Based on this comparison, the ADC system characterizes the defect and estimates a degree of confidence in the characterization.

Abstract: A fixture to couple an integrated circuit to a circuit board is disclosed and claimed. The fixture includes a base member and a holder to retain the circuit board in a selected position relative to the base member. A clamp assembly is included to hold a package containing the integrated circuit in a predetermined position on the circuit board and to cause electrical contact between the integrated circuit and the circuit board.

Abstract: A switching regulator includes an inductive element to provide a first voltage across the element and at least one switch to energize and de-energize the inductive element to produce an output voltage. A controller of the regulator constructs an indication of a current from the first voltage and operates the switch(es) to regulate the output voltage in response to the indication.

Abstract: A switching regulator includes an inductive element to provide a first voltage across the element and at least one switch to energize and de-energize the inductive element to produce an output voltage. A controller of the regulator constructs an indication of a current from the first voltage and operates the switch(es) to regulate the output voltage in response to the indication.

Abstract: A switching regulator includes an inductive element to provide a first voltage across the element and at least one switch to energize and de-energize the inductive element to produce an output voltage. A controller of the regulator constructs an indication of a current from the first voltage and operates the switch(es) to regulate the output voltage in response to the indication.

Abstract: A switching regulator includes an inductive element to provide a first voltage across the element and at least one switch to energize and de-energize the inductive element to produce an output voltage. A controller of the regulator constructs an indication of a current from the first voltage and operates the switch(es) to regulate the output voltage in response to the indication.

Abstract: A fixture to couple an integrated circuit to a circuit board is disclosed and claimed. The fixture includes a base member and a holder to retain the circuit board in a selected position relative to the base member. A clamp assembly is included to hold a package containing the integrated circuit in a predetermined position on the circuit board and to cause electrical contact between the integrated circuit and the circuit board.

Abstract: A method is described for characterizing defects on a test surface of a semiconductor wafer using a confocal-microscope-based automatic defect characterization (ADC) system. The surface to be tested and a reference surface are scanned using a confocal microscope to obtain three-dimensional images of the test and reference surfaces. The test and reference images are converted into sets of geometric constructs, or “primitives,” that are used to approximate features of the images. Next, the sets of test and reference primitives are compared to determine whether the set of test primitives is different from the set of reference primitives. If such a difference exists, then the difference data is used to generate defect parameters, which are then compared to a knowledge base of defect reference data. Based on this comparison, the ADC system characterizes the defect and estimates a degree of confidence in the characterization.

Abstract: A method is described for characterizing defects on a test surface of a semiconductor wafer using a confocal-microscope-based automatic defect characterization (ADC) system. The surface to be tested and a reference surface are scanned using a confocal microscope to obtain three-dimensional images of the test and reference surfaces. The test and reference images are converted into sets of geometric constructs, or “primitives,” that are used to approximate features of the images. Next, the sets of test and reference primitives are compared to determine whether the set of test primitives is different from the set of reference primitives. If such a difference a exists, then the difference data is used to generate defect parameters, which are then compared to a knowledge base of defect reference data. Based on this comparison, the ADC system characterizes the defect and estimates a degree of confidence in the characterization.

Abstract: A system for analyzing an object has two operating modes such as scanned imaging mode and stop scan spectral analysis mode. A beam scanner is optically connected to a laser to receive laser beams from the laser. Beam scanner also scans the beams if the system is in the scanned imaging mode. A lens (e.g., an objective lens) is optically coupled to the beam scanner to focus the beams received from the beam scanner. A sensor is optically coupled to the lens to receive the beams that reflect from the object. The sensor may detect characteristics of the beam such as color and intensity. A spectrometer is optically coupled to the objective lens. During stop scan spectral analysis mode, spectrometer generates wavelength spectrum data.

Abstract: A laser imaging system is used to analyze defects on semiconductor wafers that have been detected by patterned wafer defect detecting systems (wafer scanners). The laser imaging system replaces optical microscope review stations now utilized in the semiconductor fab environment to examine detected optical anomalies that may represent wafer defects. In addition to analyzing defects, the laser imaging system can perform a variety of microscopic inspection functions including defect detection and metrology. The laser imaging system uses confocal laser scanning microscopy techniques, and operates under class 1 cleanroom conditions and without exposure of the wafers to operator contamination or airflow.

Abstract: A method is described for characterizing defects on a test surface of a semiconductor wafer using a confocal-microscope-based automatic defect characterization (ADC) system. The surface to be tested and a reference surface are scanned using a confocal microscope to obtain three-dimensional images of the test and reference surfaces. The test and reference images are converted into sets of geometric constructs, or "primitives," that are used to approximate features of the images. Next, the sets of test and reference primitives are compared to determine whether the set of test primitives is different from the set of reference primitives. If such a difference exists, then the difference data is used to generate defect parameters, which are then compared to a knowledge base of defect reference data. Based on this comparison, the ADC system characterizes the defect and estimates a degree of confidence in the characterization.

Abstract: 10A method is described for detecting and characterizing defects on a test surface of a semiconductor wafer. A three-dimensional image of the test surface is aligned and compared with a three-dimensional image of a defect-free reference surface. Intensity differences between corresponding pixels in the two images that exceed a predefined threshold value are deemed defect pixels. According to the method, the pixels of the reference image are grouped according to their respective z values (elevation) to identify different physical layers of the reference surface. Because different surface layers can have different image properties, such as reflectance and image texture, the groups of pixels are analyzed separately to determine an optimal threshold value for each of the groups, and therefore for each layer of the reference surface.

Abstract: A microscope system moves a target in a first direction relative to a low power objective lens and, during the relative motion, generates and records values of an electronic focus signal that depends on the magnitude of light reflected by the target. Then, a host workstation calculates a first estimate of position ("focus position") of the target at which the microscope system is focused, by a median point method. In the median point method, the host workstation calculates the sum of the recorded values and determines the position along the range of motion at which half of this sum was exceeded, to be a first estimate of the focus position. From the intensity values of the first pass, optimal sensor gain is set for subsequent passes. Second and third estimates of the focus position can be calculated in a similar manner if necessary and the target is moved to the most recent estimate of the focus position.