Patents by Inventor Ken Takano

Ken Takano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10804670
    Abstract: There is provided an electronic equipment assembly apparatus including: a cable mounting mechanism which holds a cable and installs the cable onto a connector; a lock operation mechanism which operates a lock mechanism provided in the connector; a locked-state checker which checks a state of the lock mechanism of the connector; and a controller which controls the cable mounting mechanism and the lock operation mechanism.
    Type: Grant
    Filed: October 17, 2017
    Date of Patent: October 13, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Ken Takano, Yuji Takahashi, Kazu Wagatsuma
  • Patent number: 10766142
    Abstract: The electronic device manufacturing apparatus includes a cable holding tool, a work stage, a robot section, a first position detector, a second position detector, and a controller. The first position detector detects positions in a two-dimensional plane direction of the cable held by the cable holding tool and the connector of the electronic device held by the work stage. The second position detector detects positions in a height direction of the cable held by the cable holding tool and the connector of the electronic device held by the work stage. The controller controls the robot section based on the detection result of the first position detector and the second position detector.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: September 8, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Ken Takano, Minoru Yamamoto
  • Patent number: 10723026
    Abstract: The electronic device manufacturing apparatus includes a cable holding tool, a work stage, a robot section, a first position detector, a second position detector, and a controller. The first position detector detects positions in a two-dimensional plane direction of the cable held by the cable holding tool and the connector of the electronic device held by the work stage. The second position detector detects positions in a height direction of the cable held by the cable holding tool and the connector of the electronic device held by the work stage. The controller controls the robot section based on the detection result of the first position detector and the second position detector.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: July 28, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Ken Takano, Minoru Yamamoto
  • Publication number: 20200046772
    Abstract: It is an object of the present invention to provide a chondrogenesis promoter that is safe and exhibits a chondrogenesis-promoting effect by daily ingestion. It is also an object of the invention to provide a proteoglycan synthesis promoter that exhibits a proteoglycan synthesis-promoting effect by ingestion. Provided are a chondrogenesis promoter and a proteoglycan synthesis promoter each containing a milk-derived basic protein fraction as an active ingredient. Synthesis of proteoglycan and formation of a cartilage can be promoted by oral ingestion of the milk-derived basic protein fraction. A hydrolysate of the milk-derived basic protein fraction also has a similar chondrogenesis-promoting effect.
    Type: Application
    Filed: September 16, 2019
    Publication date: February 13, 2020
    Applicant: MEGMILK SNOW BRAND CO., LTD.
    Inventors: Yoshihiko TAKANO, Takayuki NARA, Ken KATO, Yoshikazu MORITA
  • Patent number: 10399306
    Abstract: Provided is a sheet 2 for forming a protective film including a protective film-forming film 1 of which the light transmittance at a wavelength of 1600 nm is 25% or greater, and light transmittance at a wavelength of 550 nm is 20% or less, and a release sheet 21 which is laminated on one or both surfaces of the protective film-forming film 1. According to such a sheet 2 for forming a protective film, cracks existing in a workpiece or a manufactured product obtained by processing the workpiece can be inspected and a protective film in which grinding marks existing in the workpiece or the manufactured product are not visually recognized can be formed.
    Type: Grant
    Filed: January 30, 2014
    Date of Patent: September 3, 2019
    Assignee: Lintec Corporation
    Inventors: Naoya Saiki, Daisuke Yamamoto, Hiroyuki Yoneyama, Ken Takano
  • Patent number: 10259115
    Abstract: A work device includes a base unit, a movable unit configured to have an end effector mounted thereto, linking mechanisms linking the base unit to the movable unit, actuators fixed to the base unit for driving the plurality of linking mechanisms, respectively, and a controller that moves the end effector by operating the actuators. A certain linking mechanism out of the plurality of linking mechanisms includes a joint. The controller includes a joint angle determination unit that determines whether or not a bending angle of the linking mechanism at the joint is within an operable range.
    Type: Grant
    Filed: December 6, 2016
    Date of Patent: April 16, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Ken Takano, Satoru Kimura
  • Patent number: 10190017
    Abstract: A protective film-forming film is provided for forming a protective film which protects a metal film provided on a back surface of a semiconductor chip and is not likely to peel off from the metal film even after undergoing a history of temperature changes. This protective film-forming film is formed of a protective film-forming composition to which a coupling agent having a thiol group or a protected thiol group is added.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: January 29, 2019
    Assignee: Lintec Corporation
    Inventors: Ken Takano, Naoya Saiki
  • Publication number: 20190027887
    Abstract: An electronic device assembling apparatus has a cable holder and a lock member operator. The cable holder holds a cable and inserts the cable into a connector. After the cable is inserted into the connector by the cable holder, the lock member operator operates a lock member to lock the cable to the connector. The lock member operator starts an operation with respect to the lock member in a state where the cable inserted into the connector is held by the cable holder.
    Type: Application
    Filed: July 11, 2018
    Publication date: January 24, 2019
    Inventors: KEN TAKANO, YUJI TAKAHASHI, KAZU WAGATSUMA
  • Publication number: 20180244963
    Abstract: An adhesive composition contains an acrylic copolymer and an adhesive aid, in which the acrylic copolymer contains 2-ethylhexyl acrylate as a main monomer, and the adhesive aid contains as a main component a rubber material having a reactive group. An adhesive sheet includes a base material and an adhesive layer containing the adhesive composition.
    Type: Application
    Filed: September 1, 2016
    Publication date: August 30, 2018
    Inventors: Ken TAKANO, Kazuhiro KIKUCHI, Takashi SUGINO
  • Publication number: 20180243909
    Abstract: The electronic device manufacturing apparatus includes a cable holding tool, a work stage, a robot section, a first position detector, a second position detector, and a controller. The first position detector detects positions in a two-dimensional plane direction of the cable held by the cable holding tool and the connector of the electronic device held by the work stage. The second position detector detects positions in a height direction of the cable held by the cable holding tool and the connector of the electronic device held by the work stage. The controller controls the robot section based on the detection result of the first position detector and the second position detector.
    Type: Application
    Filed: February 2, 2018
    Publication date: August 30, 2018
    Inventors: KEN TAKANO, MINORU YAMAMOTO
  • Publication number: 20180123307
    Abstract: An electronic equipment assembly apparatus installs a mounted portion of a cable onto a connector of electronic equipment, the cable including a belt-shaped cable main body portion in which the mounted portion is formed in one end portion, and a reinforcing plate bonded to the one end portion side on one surface of the cable main body portion. The electronic equipment assembly apparatus includes: a cable holding tool which nips and holds the reinforcing plate by a blade and a chuck block; and a robot portion which moves the cable holding tool.
    Type: Application
    Filed: October 17, 2017
    Publication date: May 3, 2018
    Inventors: KEN TAKANO, YUJI TAKAHASHI, KAZU WAGATSUMA
  • Publication number: 20180123306
    Abstract: There is provided an electronic equipment assembly apparatus including: a cable mounting mechanism which holds a cable and installs the cable onto a connector; a lock operation mechanism which operates a lock mechanism provided in the connector; a locked-state checker which checks a state of the lock mechanism of the connector; and a controller which controls the cable mounting mechanism and the lock operation mechanism.
    Type: Application
    Filed: October 17, 2017
    Publication date: May 3, 2018
    Inventors: KEN TAKANO, YUJI TAKAHASHI, KAZU WAGATSUMA
  • Patent number: 9786541
    Abstract: A dicing sheet with a protective film forming layer has a substrate film, an adhesive layer, and a protective film forming layer, and at a minimum, the adhesive layer is formed in an area surrounding the protective film forming layer in a planar view, and the substrate film has the following characteristics (a)-(c): (a) the melting point either exceeds 130° C. or the film has no melting point; (b) the thermal contraction rate under conditions of heating at 130° C. for two hours is from ?5 to +5%, and (c) the degree of elongation-to-break in the MD direction and the CD direction is at least 100%, and the stress at 25% is no more than 100 MPa.
    Type: Grant
    Filed: September 27, 2012
    Date of Patent: October 10, 2017
    Assignee: LINTEC Corporation
    Inventors: Tomonori Shinoda, Masaaki Furudate, Ken Takano
  • Patent number: 9754811
    Abstract: [Problem] To provide a dicing sheet that is with a protective film formation layer, can easily produce a semiconductor chip having a protective film having high uniformity and superior printing precision, is such that the peeling of the protective film and the dicing sheet can be easily performed, and has superior affixing ability of chips during dicing. [Solution] The dicing sheet with a protective film formation layer is characterized by a protective film formation layer being peelably provided on the adhesive layer of an adhesive sheet resulting from the adhesive layer, which contains an adhesive component and a free epoxy group-containing compound, being laminated onto a substrate film.
    Type: Grant
    Filed: August 22, 2013
    Date of Patent: September 5, 2017
    Assignee: LINTEC CORPORATION
    Inventors: Naoya Saeki, Tomonori Shinoda, Ken Takano
  • Publication number: 20170173792
    Abstract: A work device includes a base unit, a movable unit configured to have an end effector mounted thereto, linking mechanisms linking the base unit to the movable unit, actuators fixed to the base unit for driving the plurality of linking mechanisms, respectively, and a controller that moves the end effector by operating the actuators. A certain linking mechanism out of the plurality of linking mechanisms includes a joint. The controller includes a joint angle determination unit that determines whether or not a bending angle of the linking mechanism at the joint is within an operable range.
    Type: Application
    Filed: December 6, 2016
    Publication date: June 22, 2017
    Inventors: KEN TAKANO, SATORU KIMURA
  • Publication number: 20170121552
    Abstract: A protective film-forming film is provided for forming a protective film which protects a metal film provided on a back surface of a semiconductor chip and is not likely to peel off from the metal film even after undergoing a history of temperature changes. This protective film-forming film is formed of a protective film-forming composition to which a coupling agent having a thiol group or a protected thiol group is added.
    Type: Application
    Filed: March 17, 2015
    Publication date: May 4, 2017
    Inventors: Ken Takano, Naoya Saiki
  • Publication number: 20170025636
    Abstract: A laminated sheet for sealing electronic elements is configured to comprise: a first long release sheet; a plurality of sealing materials that are laminated on the first release sheet within a central area in the width direction and at different positions in the longitudinal direction; protection materials that are laminated on the first release sheet at both side portions in the width direction; and a second long release sheet that is laminated on the sealing materials and the protection materials at the opposite sides to the first release sheet. According to such a laminated sheet for sealing electronic elements, highly reliable electronic devices can be produced in an efficient manner.
    Type: Application
    Filed: March 9, 2015
    Publication date: January 26, 2017
    Applicant: LINTEC CORPORATION
    Inventors: Yoshiaki HAGIHARA, Ken TAKANO
  • Patent number: 9443750
    Abstract: A dicing sheet with a protective film-forming layer includes a protective film-forming layer on an adhesive layer of an adhesive sheet with a peel strength adjusting layer being interposed therebetween. The adhesive sheet is composed of a base film and the adhesive layer. The dicing sheet with a protective film-forming layer may also include a laminate of the peel strength adjusting layer and the protective film-forming layer arranged in the inner circumferential part of the adhesive sheet; the adhesive layer is exposed in the outer circumferential part of the adhesive sheet; and the peel strength between the peel strength adjusting layer and a protective film that is obtained by curing the protective film-forming layer is 0.05-5 N/25 mm.
    Type: Grant
    Filed: December 25, 2012
    Date of Patent: September 13, 2016
    Assignee: LINTEC Corporation
    Inventors: Tomonori Shinoda, Ken Takano
  • Publication number: 20160167345
    Abstract: Provided is a sheet 2 for forming a protective film including a protective film-forming film 1 of which the light transmittance at a wavelength of 1600 nm is 25% or greater, and light transmittance at a wavelength of 550 nm is 20% or less, and a release sheet 21 which is laminated on one or both surfaces of the protective film-forming film 1. According to such a sheet 2 for forming a protective film, cracks existing in a workpiece or a manufactured product obtained by processing the workpiece can be inspected and a protective film in which grinding marks existing in the workpiece or the manufactured product are not visually recognized can be formed.
    Type: Application
    Filed: January 30, 2014
    Publication date: June 16, 2016
    Inventors: Naoya Saiki, Daisuke Yamamoto, Hiroyuki Yamamoto, Ken Takano
  • Publication number: 20150228526
    Abstract: [Problem] To provide a dicing sheet that is with a protective film formation layer, can easily produce a semiconductor chip having a protective film having high uniformity and superior printing precision, is such that the peeling of the protective film and the dicing sheet can be easily performed, and has superior affixing ability of chips during dicing. [Solution] The dicing sheet with a protective film formation layer is characterized by a protective film formation layer being peelably provided on the adhesive layer of an adhesive sheet resulting from the adhesive layer, which contains an adhesive component and a free epoxy group-containing compound, being laminated onto a substrate film.
    Type: Application
    Filed: August 22, 2013
    Publication date: August 13, 2015
    Applicant: LINTEC CORPORATION
    Inventors: Naoya Saeki, Tomonori Shinoda, Ken Takano