Abstract: A high frequency switch module includes a laminated circuit component that includes an antenna electrode connected to a single antenna, a plurality of communication electrodes connected to a plurality of high frequency communication circuits to transmit, receive, or transmit and receive plural kinds of communication signals, and a land arranged to mount a switch IC on, and a switch IC that is mounted on the laminated circuit component and includes a common terminal connected to the single antenna through the laminated circuit component, and a plurality of communication circuit terminals connected to the plurality of high frequency communication circuits through the laminated circuit component. The switch IC is provided with switch circuits between the communication circuit terminals and the common terminal, and all of the switch circuits have the same or substantially the same resistance against transmission power applied at the time of transmission.

Abstract: In a variable capacitance module capable of achieving necessary variable capacitance ranges, a variable capacitance circuit includes a variable capacitance element and fixed capacitance elements. A first variable capacitance element and a first fixed capacitance element are connected in series, and the series circuit thereof and a second fixed capacitance element are connected in parallel. Accordingly, with reference to the capacitance of the second fixed capacitance element, the range of the combined capacitance of the variable capacitance circuit is provided by a step size of capacitance based on the combined capacitance of the variable capacitance element and the first fixed capacitance element. The first and second fixed capacitance elements are defined by inner-layer flat-plate electrodes in a laminated substrate, and the variable capacitance element is defined by an MEMS element mounted on a top surface of the laminated substrate.

Abstract: In a variable capacitance module capable of achieving necessary variable capacitance ranges, a variable capacitance circuit includes a variable capacitance element and fixed capacitance elements. A first variable capacitance element and a first fixed capacitance element are connected in series, and the series circuit thereof and a second fixed capacitance element are connected in parallel. Accordingly, with reference to the capacitance of the second fixed capacitance element, the range of the combined capacitance of the variable capacitance circuit is provided by a step size of capacitance based on the combined capacitance of the variable capacitance element and the first fixed capacitance element. The first and second fixed capacitance elements are defined by inner-layer flat-plate electrodes in a laminated substrate, and the variable capacitance element is defined by an MEMS element mounted on a top surface of the laminated substrate.

Abstract: A series resonance circuit defined by a series circuit including an inductor and a capacitor and a series resonance circuit defined by a series circuit including an inductor and a capacitor are connected in shunt to a signal line. A diode is disposed between the grounding end of the series resonance circuit and the ground, and a diode is disposed between the grounding end of the series resonance circuit and the ground. The connection point between the grounding end of the series resonance circuit and the diode is connected to the ground via a frequency shifting inductor in a conductive state at high frequency, and the connection point between the grounding end of the series resonance circuit and the diode is connected to the ground via a frequency shifting inductor in a conductive state at high frequency. A matching circuit defined by a multistage T-shape LCL circuit is disposed between the series resonance circuits.

Abstract: A high frequency switch module includes a laminated circuit component that includes an antenna electrode connected to a single antenna, a plurality of communication electrodes connected to a plurality of high frequency communication circuits to transmit, receive, or transmit and receive plural kinds of communication signals, and a land arranged to mount a switch IC on, and a switch IC that is mounted on the laminated circuit component and includes a common terminal connected to the single antenna through the laminated circuit component, and a plurality of communication circuit terminals connected to the plurality of high frequency communication circuits through the laminated circuit component. The switch IC is provided with switch circuits between the communication circuit terminals and the common terminal, and all of the switch circuits have the same or substantially the same resistance against transmission power applied at the time of transmission.

Abstract: A series resonance circuit defined by a series circuit including an inductor and a capacitor and a series resonance circuit defined by a series circuit including an inductor and a capacitor are connected in shunt to a signal line. A diode is disposed between the grounding end of the series resonance circuit and the ground, and a diode is disposed between the grounding end of the series resonance circuit and the ground. The connection point between the grounding end of the series resonance circuit and the diode is connected to the ground via a frequency shifting inductor in a conductive state at high frequency, and the connection point between the grounding end of the series resonance circuit and the diode is connected to the ground via a frequency shifting inductor in a conductive state at high frequency. A matching circuit defined by a multistage T-shape LCL circuit is disposed between the series resonance circuits.

Abstract: A power distributing and synthesizing device which comprises first to third signal terminals, first and second transmission lines and a resistor. The first signal terminal is provided at the connection portion between one end of the first transmission line and one end of the second transmission line; the second signal terminal is provided at the other end of the first transmission line; and the third signal terminal is provided at the other end of the second transmission line. The resistor is connected between the second signal terminal and the third signal terminal. LC serial resonators each comprising an inductor and a capacitor are respectively connected between the first to third signal terminals and a ground.

Abstract: A receiving module and a TDMA-system receiver are adapted to broadening of bands of received signals and low frequencies of intermediate frequency signals. These apparatuses can be made compact and contribute to cost reduction. The receiving module is constituted of a low-noise amplifier, a high frequency LC filter, a Gilbert-cell type mixer, and baluns. A signal received by an antenna is amplified by the low-noise amplifier and is passed through the LC filter. After that, the signal is mixed with a local oscillation signal by the Gilbert-cell type mixer to be converted into an intermediate frequency signal.

Abstract: A high-frequency composite component can achieve reduction in size and weight, while providing high performance. A portable wireless device incorporates the high-frequency composite component, including a multi-layer substrate, with a low noise amplifier LNA and a band pass filter BPF constituting parts of a high-frequency circuit, with an input terminal, an output terminal, and control terminals on the substrate. The low noise amplifier LNA is constituted of transistors, an inductor, capacitors, and resistors. The band pass filter BPF is constituted of strip lines, an inductor, and capacitors. The low noise amplifier LNA and the band pass filter BPF are connected with each other within the substrate via a matching capacitor. The amplifier ground and filter ground are separated within the substrate and connected respectively to separate ground terminals on the substrate.

Abstract: A high-frequency filter 10 serving as a bandpass filter has three transmission lines SL11 to SL13 side-coupled in three stages. The transmission lines SL11 to SL13 are respectively connected in parallel to capacitors C11 to C13. One end of the input transmission line SL11 is connected to an input terminal Pi through an input capacitor C14. One end of the output transmission line SL13 is connected to an output terminal Po through an output capacitor C15. The other ends of the transmission lines SL11 and SL13 are connected and the connection point is connected to the ground through an inductor Lg for forming a pole. One end of the transmission line SL12 is connected to the ground.

Abstract: The invention provides a complex electronic component, comprising; a multilayer substrate formed by laminating a plurality of dielectric layers; a first concave part being provided at least at the bottom surface of said multilayer substrate; a filter comprising at least one first passive element disposed within said multilayer substrate; an external terminal provided on at least one of the flat portion of the bottom surface and the side face of said multilayer substrate; either one of an active element or a second passive element mounted on the top surface of said multilayer substrate, a surface acoustic wave element mounted inside of said first concave portion of said multilayer substrate; and a flat cap provided at the opening of said first concave portion of said multilayer substrate so as to cover said opening said first concave portion. The size of the above complex electronic component is compact.

Abstract: The invention provides a complex electronic component, comprising; a multilayer substrate formed by laminating a plurality of dielectric layers; a first concave part being provided at least at the bottom surface of said multilayer substrate; a filter comprising at least one first passive element disposed within said multilayer substrate; an external terminal provided on at least one of the flat portion of the bottom surface and the side face of said multilayer substrate; either one of an active element or a second passive element mounted on the top surface of said multilayer substrate, a surface acoustic wave element mounted inside of said first concave portion of said multilayer substrate; and a flat cap provided at the opening of said first concave portion of said multilayer substrate so as to cover said opening said first concave portion. The size of the above complex electronic component is compact.

Abstract: The invention provides a complex electronic component, comprising; a multilayer substrate formed by laminating a plurality of dielectric layers; a first concave part being provided at least at the bottom surface of said multilayer substrate; a filter comprising at least one first passive element disposed within said multilayer substrate; an external terminal provided on at least one of the flat portion of the bottom surface and the side face of said multilayer substrate; either one of an active element or a second passive element mounted on the top surface of said multilayer substrate, a surface acoustic wave element mounted inside of said first concave portion of said multilayer substrate; and a flat cap provided at the opening of said first concave portion of said multilayer substrate so as to cover said opening said first concave portion. The size of the above complex electronic component is compact.

Abstract: The invention provides a filter, comprising: at least one inductance device, at least one resonator, and at least one switching device. The inductance device may be connected in parallel with said switching device, and the resonator may be connected in series with the switching device. The above filter is small in size that is capable of functioning for high-frequency signals of plural frequency bands which are relatively adjacent to each other.

Abstract: A filter 10 (30) includes a laminate body 11 (31), PIN diodes PD1 and PD2 of switching elements and choke coils CC1-CC2 are mounted on a top surface or a principal face of the laminate body 11, and six external electrodes Ta-Tf extend on a side surface from the top surface to the bottom surface of the laminate body 11 (31). Three external electrodes Ta-Tc among the external electrodes Ta-Tf are formed on one side surface of the laminate body 11 (31), and three other external electrodes Td-Tf are formed on the opposing side surface of the laminate body laminate body 11 (31). The external electrode Ta is an input terminal, the external electrodes Tb and Te are control terminals for controlling a voltage supplied to the PIN diode PD, the external electrode Tc is an output terminal, and the external electrodes Td and Tf are ground terminals.

Abstract: The invention provides a high-frequency composite unit, wherein: a two-terminal switch constituting a transmission section, an LC filter, and a notch filter are connected between a first terminal and a second terminal; and said two-terminal switch, said LC filter, and said notch filter are integrated into a layered structure in which a plurality of dielectric layers are stacked. The above high-frequency composite unit has high performance, which can handle high-frequency signals of multiple frequency bands that are relatively adjacent.

Abstract: A high-frequency filter 10 serving as a bandpass filter has three transmission lines SL11 to SL13 side-coupled in three stages. The transmission lines SL11 to SL13 are respectively connected in parallel to capacitors C11 to C13. One end of the input transmission line SL11 is connected to an input terminal Pi through an input capacitor C14. One end of the output transmission line SL13 is connected to an output terminal Po through an output capacitor C15. The other ends of the transmission lines SL11 and SL13 are connected and the connection point is connected to the ground through an inductor Lg for forming a pole in the transmission characteristic of the high-frequency filter. One end of the transmission line SL12 is connected to the ground.

Abstract: A composite high-frequency component is designed to occupy a smaller area and a smaller volume when mounted in an apparatus, can be located in the apparatus with improved flexibility, and is able to operate without an impedance matching circuit. The composite high-frequency component includes a multilayer substrate, diodes constituting a high-frequency switch component, and a circuit base. External terminals for connection to a transmitting circuit, a receiving circuit and an antenna, external terminals for control and an external terminal for connection to ground potential are formed on an outer surface of the multilayer substrate. Strip lines and capacitors constituting the high-frequency switch and strip lines and capacitors constituting a low-pass filter circuit are formed in the multilayer substrate.

Abstract: A composite high frequency apparatus includes a high frequency filter and a high frequency switch which have a substantially reduced size and do not require an impedance matching circuit. The apparatus includes a multilayered base having an outer surface with a plurality of diodes, an external ground electrode, an external electrode for a transmission circuit, an external electrode for a receiving circuit, an external electrode for an antenna circuit and external electrodes for control terminals located thereon. A plurality of strip lines, capacitor electrodes and an external grounding electrode are located within the multilayered base.

Abstract: A composite high frequency apparatus includes a high frequency filter and a high frequency switch which have a substantially reduced size and do not require an impedance matching circuit. The apparatus includes a multilayered base having an outer surface with a plurality of diodes, an external ground electrode, an external electrode for a transmission circuit, an external electrode for a receiving circuit, an external electrode for an antenna circuit and external electrodes for control terminals located thereon. A plurality of strip lines, capacitor electrodes and an external grounding electrode are located within the multilayered base.