Patents by Inventor Kenichi Donuma

Kenichi Donuma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6754950
    Abstract: An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the elec
    Type: Grant
    Filed: January 31, 2001
    Date of Patent: June 29, 2004
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Osamu Furukawa, Hitoshi Chiyoma, Kazuhisa Yabukawa, Kenichi Donuma
  • Patent number: 6628043
    Abstract: An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the elec
    Type: Grant
    Filed: January 31, 2001
    Date of Patent: September 30, 2003
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Osamu Furukawa, Hitoshi Chiyoma, Kazuhisa Yabukawa, Kenichi Donuma
  • Publication number: 20020149298
    Abstract: An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the elec
    Type: Application
    Filed: January 31, 2001
    Publication date: October 17, 2002
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Osamu Furukawa, Hitoshi Chiyoma, Kazuhisa Yabukawa, Kenichi Donuma
  • Publication number: 20010009342
    Abstract: An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the elec
    Type: Application
    Filed: January 31, 2001
    Publication date: July 26, 2001
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Osamu Furukawa, Hitoshi Chiyoma, Kazuhisa Yabukawa, Kenichi Donuma
  • Patent number: 6262513
    Abstract: An electronic device and a fabricating method for fabricating the electronic device, the electronic device comprising; a surface acoustic wave device 3 having a main surface thereon having a transducer portion 4 and wiring patterns 5 connected electrically to the transducer portion; a printed circuit board 1 having wiring patterns 2 formed at least on one main surface thereof; a plurality of conductive bumps 6 which connect electrically both of the mutually opposed wiring patterns and form a space portion 10 between the surface acoustic wave device 3 and a printed circuit board 1; and resin portion 11 which, by heating/melting and hardening, makes an intimate contact with other main surface of the device and coats the device 3 and seals the device 3 together with the printed circuit board 1, wherein, by employing a highly thixotropic and viscous thermo-setting resin compared with a conventional one, an electronic device having a simple structure can be provided and fabricating process for fabricating the elec
    Type: Grant
    Filed: December 30, 1997
    Date of Patent: July 17, 2001
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Osamu Furukawa, Hitoshi Chiyoma, Kazuhisa Yabukawa, Kenichi Donuma
  • Patent number: 4759599
    Abstract: An optical connector includes a plug and an adaptor to which the plug is to be connected. The adaptor is formed with a plug body fitting portion and a holder fitting portion. The plug has a plug body to which a optical fiber cable is fixed. A floating holder is arranged in the plug body to be movable in any direction with respect to the plug body. An end of the optical fiber of the cable is attached to a ferrule which is supported by the holder. When the plug is connected to the adaptor, the plug body is fitted to the plug body fitting portion and the holder to the holder fitting portion. At this time, the plug body is locked to the plug body fitting portion by a lock mechanism, and the holder is locked to the holder fitting portion by engaging projections on the holder and engaging holes which are formed in the holder fitting portion and engaged with the projections.
    Type: Grant
    Filed: December 19, 1986
    Date of Patent: July 26, 1988
    Assignees: Kabushiki Kaisha Toshiba, Nippon Telegraph and Telephone Corporation
    Inventors: Yasuhiro Yamaguchi, Kenichi Donuma, Yasuhiro Ando, Shuichiro Inagaki
  • Patent number: 4695858
    Abstract: A duplex optical communication module unit is disclosed, which comprises a ceramic substrate and first and second metal shells having respective transparent window members and hermetically bonded to the ceramic substrate so as to define a first and second space, respectively. A light-emitting element is assembled in the first space, and a light-emitting element and a circuit element for amplifying the photocurrent from the light-emitting element are assembled in the second space. Metallization layers are formed on the ceramic substrate over a substantial area thereof, light-receiving and light-transmitting sections being shielded by the metallization layers and metal shells.
    Type: Grant
    Filed: July 15, 1983
    Date of Patent: September 22, 1987
    Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
    Inventors: Hatsuo Takezawa, Kenichi Donuma, Shuhei Katagiri, Shigeyuki Sakura
  • Patent number: 4539476
    Abstract: A module for a fiber optic link has a case housing a circuit module plate. An optoelectric element mounted at a predetermined position of lead frames is molded from a transparent transfer molding material. The case has a socket for mounting a fiber cable connector which is molded from a nontransparent injection molding material. A hole in which is inserted a plug of the connector is formed in the socket and the case. The optoelectric element is arranged to oppose the hole of the case through a convex lens segment of the case.
    Type: Grant
    Filed: May 14, 1984
    Date of Patent: September 3, 1985
    Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
    Inventors: Kenichi Donuma, Makoto Ohashi, Takeshi Ozeki
  • Patent number: 4410469
    Abstract: In a method for manufacturing a module for a fiber optic link, a plate-shaped transparent circuit unit is molded in advance. The circuit module is transfer molded together with an optoelectronic element connected to leads. The circuit module is clamped between a pair of rod-shaped first dies which have a common central axis and one of which defines an optical path of the module, in such a manner that the optoelectronic element is located on a central axis of the circuit module. Under this condition, the circuit module is housed in a cavity defined by a pair of second dies. A light-shielding molding material is injected into the cavity for injection molding to mold a case. After the case is cured, the first and second dies are removed, and the hole of the case formed by one of the first die is closed with a cap to complete a receptacle.
    Type: Grant
    Filed: November 27, 1981
    Date of Patent: October 18, 1983
    Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
    Inventors: Shuhei Katagiri, Kenichi Donuma, Makoto Ohashi