Abstract: A liquid level detector includes: a float; an arm; a holder; a frame having a shaft; a detection part that is provided in the frame and detects a rotation angle of the holder; a ground terminal connected to the detection part; and a conductive part having a first end portion connected to the ground terminal and a second end portion positioned so as to be contactable with respect to the arm, and that is at least partially embedded in the frame, wherein the frame has a pair of first stoppers that come into contact with the distal end side of the arm from a position facing the shaft, thereby restricting a rotation range of the holder, and the second end portion is exposed toward a trajectory of the arm from each of a first stopper surface and a second stopper surface constituting the pair of first stoppers.

Abstract: An information processing apparatus detects a signal transmitted from an external communication apparatus and displays information of the communication apparatus corresponding to the detected signal. If a first signal is detected, a notification screen for prompting a user to perform a specification operation on the communication apparatus is displayed, and if a second signal is detected after displaying the notification screen, when the second signal corresponds to the specification operation, information of the communication apparatus corresponding to the second signal is displayed. If the first signal and the second signal are both detected, a second notification screen for prompting the user to perform a different second specification operation is displayed, and if a third signal is detected after displaying the second notification screen, when the third signal corresponds to the second specification operation, information of the communication apparatus corresponding to the third signal is displayed.

Abstract: A command generation device to control a motor includes command input circuitry configured to receive a first command, first intermediate data calculation circuitry configured to calculate first intermediate data based on the first command, delay time setting circuitry configured to determine a delay time based on the first command, second intermediate data calculation circuitry configured to calculate second intermediate data by smoothing the first intermediate data based on the delay time, and command output circuitry configured to calculate, based on the second intermediate data, a second command according to which the motor is controlled. A first time period during which positioning the motor based on the first command is completed when the first intermediate data is smoothed is longer by the delay time than a second time period during which positioning the motor based on the first command is completed when the first intermediate data is not smoothed.

Abstract: According to an embodiment, the information processing apparatus includes a communication interface and a processor. The processor acquires a plurality of orders from a host management apparatus through the communication interface; extracts, through the communication interface, a specific order from the plurality of orders based on label information indicating the specific order acquired from a first work station; and transmits, through the communication interface to an automated guided vehicle, a control signal for transporting one of racks that stores an article indicated by the extracted specific order to the first work station and a control signal for transporting another one of the racks that stores an article indicated by a normal order other than the specific order to one of the work stations other than the first work station.

Abstract: A container (1) for transporting a semiconductor wafer includes: a container body (10) having one end provided with an opening (11) and the other end provided with a mounter (12) that faces the opening (11) and on which stacked wafers are housed; and a cover (20) that closes the opening (11). The container body (10) includes: body side walls (14) having an arc shape, disposed upright on the mounter (12), sectioning a housing (13) that houses the wafers; and auxiliary walls (14a) that are disposed upright and folded toward a back surface on both edges of the body side walls (14).

Abstract: A method includes detecting a signal transmitted from an external communication apparatus and displaying, based on the detected signal, information of the communication apparatus corresponding to the signal on a display unit of an information processing apparatus. If a first signal is detected, a notification screen for prompting a user to perform a specification operation on a communication apparatus is displayed on the display unit. If a second signal is detected after displaying the notification screen on the display unit, in a case in which the second signal corresponds to the specification operation, information of the communication apparatus corresponding to the second signal is displayed on the display unit.

Abstract: Provided is a microchip that can achieve a favorable bonding state in the bonding portion between first and second substrates even if the microchip is large in size. A microchip includes a first substrate made of a resin and a second substrate made of a resin, the first substrate and the second substrates being bonded to each other, and a channel surrounded by a bonding portion between the first substrate and the second substrate is formed by a channel forming step formed at least in the first substrate. Further, a noncontact portion is formed to surround the bonding portion, and an angle ?1 formed between a side wall surface of the channel forming step and a bonding surface continuous therewith satisfies ?1>90°.

Abstract: A machine control system includes a first movable element configured to be driven by a first motor, a second movable element configured to be driven by a second motor which is connected to the first motor so that a jerk to be generated by the first motor is applied to the second movable element, and control circuitry configured to generate a first control command to control the first motor and to generate a second control command to control the second motor according to the jerk.

Abstract: Described herein are wafer accommodation containers. A wafer accommodation container (1) includes: a container body having one end that is provided with an opening (11) and another end that is provided with a mount element (12) on which wafers are stacked, the mount element (12) facing the opening (11); a cover (20) to cover the opening (11); and a connection mechanism (30) to detachably connect the container body (10) and the cover (20).

Abstract: The cell culture chip includes a bottom substrate and a base body part. The base body part includes a plurality of first portions for forming the culture space, and a cavity penetrating the base body part in a region where the first portions are not formed. The first portions each include a recessed region and a plurality of opening grooves that are formed through the base body part from a plurality of places inside the recessed region. In the cavity, at least a part of an end is positioned inside an outer edge of the base body part. The bottom substrate and the first surface of the base body part are bonded together to form the culture space in which the recessed region is sandwiched between the bottom substrate and the base body part.

Abstract: A command generation device to control a motor includes command input circuitry configured to receive a first command, first intermediate data calculation circuitry configured to calculate first intermediate data based on the first command, delay time setting circuitry configured to determine a delay time based on the first command, second intermediate data calculation circuitry configured to calculate second intermediate data by smoothing the first intermediate data based on the delay time, and command output circuitry configured to calculate, based on the second intermediate data, a second command according to which the motor is controlled. A first time period during which positioning the motor based on the first command is completed when the first intermediate data is smoothed is longer by the delay time than a second time period during which positioning the motor based on the first command is completed when the first intermediate data is not smoothed.

Abstract: A semiconductor wafer container includes two outer shells in a substantially flat and identical form. Each outer shell vertically overlaps so as to accommodate a single semiconductor wafer therein. Each outer shell has a main body, a wafer retaining device and an external wall forming device. The wafer retaining device accommodates and fixedly holds the wafer in such a manner that upper and bottom surfaces of the wafer are not substantially in contact with the outer shells. The wafer retaining device includes: an inclined surface; a wafer contact surface; and a shallow gap portion. The external wall forming device has a hanging portion formed on an outer peripheral edge of the bottom surface of the outer shell so as to externally constitute a closed external wall relative to the wafer when each outer shell vertically overlaps to store the wafer.

Abstract: Provided are a desmearing method and a desmearing device which are able to reliably remove a smear derived from any of an inorganic substance and an organic substance, and eliminate the need to use a chemical that requires a waste liquid treatment. The desmearing method of the present invention is directed to a desmearing method for a wiring substrate material that is a laminated body of insulating layers made from resin containing a filler and a conductive layer, and includes an ultraviolet irradiation treatment step for irradiating the wiring substrate material with ultraviolet beams with a wavelength of 220 nm or less, and a physical vibration treatment step for applying physical vibrations to the wiring substrate material which has undergone the ultraviolet irradiation treatment step.

Abstract: Disclosed is a separator for semiconductor wafers vertically stacked in that the stacked wafers do not contact with each other, or the wafer does not contact to an inner top surface or an inner bottom surface of a conveyance container of the semiconductor wafer, the separator being interposed between two of the wafers neighboring vertically, between the wafer and an inner top surface, or between the wafer and an inner bottom surface of the container. The separator includes: a flat annular body; an annular convex portion having a wafer support surface coming into contact with a peripheral line of the wafer along a peripheral edge portion of the flat annular body, the annular convex portion forming cutout portions in a suitable number of places; and shock-absorbing function pieces neighboring to the cutout portions and extending diagonally upward or diagonally downward from a separator reference plane.

Abstract: [Problem to be Solved] To provide a semiconductor wafer container [Solution] A semiconductor wafer container including two outer shells in a substantially flat and identical form, each outer shell vertically overlapping so as to accommodate a single semiconductor wafer therein, wherein the outer shell has a wafer retaining device and an external wall forming device in addition to a main body of the outer shell, wherein the wafer retaining device accommodates and fixedly holds the wafer in such a manner that upper and bottom surfaces of the wafer are not substantially in contact with the outer shells, the wafer retaining device including: an inclined surface formed on an upper surface of the outer shell and being in line contact with an outer peripheral edge of the wafer from below; a wafer contact surface formed on a bottom surface of the outer shell and being in surface contact with the outer peripheral edge of the wafer from above; and a shallow gap portion formed on each central region of both the upper

Abstract: A machine control system includes a first movable element configured to be driven by a first motor, a second movable element configured to be driven by a second motor which is connected to the first motor so that a jerk to be generated by the first motor is applied to the second movable element, and control circuitry configured to generate a first control command to control the first motor and to generate a second control command to control the second motor according to the jerk.

Abstract: Provided is a microchip that can achieve a favorable bonding state in the bonding portion between first and second substrates even if the microchip is large in size. A microchip includes a first substrate made of a resin and a second substrate made of a resin, the first substrate and the second substrates being bonded to each other, and a channel surrounded by a bonding portion between the first substrate and the second substrate is formed by a channel forming step formed at least in the first substrate. Further, a noncontact portion is formed to surround the bonding portion, and an angle 01 formed between a side wall surface of the channel forming step and a bonding surface continuous therewith satisfies ?1>90°.

Abstract: A wafer accommodation container (1) includes: a container body having one end that is provided with an opening (11) and another end that is provided with a mount element (12) on which wafers are stacked, the mount element (12) facing the opening (11); a cover (20) to cover the opening (11); and a connection mechanism (30) to detachably connect the container body (10) and the cover (20), wherein the connection mechanism (30) includes: at least two engagement members (32) each extending from the other end of the container body (10) to the one end of the container body (10) and each having one end that is provided with an engagement nail (31); and at least two engagement holes (33) included in the cover (20) and configured to be each fitted to the corresponding engagement nail (31), and the cover (20) includes guide members (40) each disposed on corresponding one of cover side wall portions (21) and configured to guide the container body (10) and the cover (20) while the guide members (40) are coming into contac

Abstract: The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip.

Abstract: The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip.