Patents by Inventor Kenichi Hirose
Kenichi Hirose has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10830329Abstract: A bicycle sprocket includes a sprocket body, a tooth ring, and at least one non-threaded fastener. The sprocket body is made of a first material and has a rotational center axis. A central portion of the sprocket body has a central opening through which the rotational center axis passes. The sprocket body further includes a plurality of arm portions that extend radially outward from the central portion with respect to the rotational center axis. Each arm portion includes a sprocket body attachment portion. The tooth ring is made of a second material different from the first material and includes an annular portion. The annular portion includes a plurality of tooth ring attachment portions and a plurality of chain-driving teeth extending radially outward from the annular portion. The non-threaded fastener fixedly connects a sprocket body attachment portion and to a corresponding tooth ring attachment portion.Type: GrantFiled: March 8, 2018Date of Patent: November 10, 2020Assignee: Shimano Inc.Inventors: Yuki Hirose, Atsuhiro Emura, Shingo Shiraishi, Kenichi Akanishi
-
Publication number: 20200333762Abstract: A machine control system includes a first movable element configured to be driven by a first motor, a second movable element configured to be driven by a second motor which is connected to the first motor so that a jerk to be generated by the first motor is applied to the second movable element, and control circuitry configured to generate a first control command to control the first motor and to generate a second control command to control the second motor according to the jerk.Type: ApplicationFiled: February 19, 2020Publication date: October 22, 2020Applicant: KABUSHIKI KAISHA YASKAWA DENKIInventors: Kenichi HIROSE, Atsuro TANDAI, Yasuhiro SUZUKI
-
Patent number: 10752183Abstract: A laminated composite interior part includes a first member made of synthetic resin and having a mating surface; and a second member made of elastically deformable synthetic resin and having a plate portion substantially parallel to the mating surface. The plate portion has integrally-formed and interspersed protrusions protruding toward the mating surface. The second member is placed on the first member with distal end portions of the protrusions being in contact with the mating surface. Cushioning properties are provided by elastic deformation of the protrusions, caused as the protrusions' distal end portions are relatively pressed against the mating surface. Flexural rigidity of each of the protrusions against a compressive load is anisotropic about its axis, so that the protrusion is flexurally deformed in one direction about its axis with the distal end portion thereof sliding on the mating surface. Surface roughness of the mating surface is less than 0.20.Type: GrantFiled: August 6, 2015Date of Patent: August 25, 2020Assignee: Toyoda Iron Works Co., Ltd.Inventors: Osamu Miyashita, Kenichi Yoshida, Kenji Onuma, Takeshi Taniguchi, Masamori Hirose, Hideaki Sakai
-
Publication number: 20200255288Abstract: Provided is a microchip that can achieve a favorable bonding state in the bonding portion between first and second substrates even if the microchip is large in size. A microchip includes a first substrate made of a resin and a second substrate made of a resin, the first substrate and the second substrates being bonded to each other, and a channel surrounded by a bonding portion between the first substrate and the second substrate is formed by a channel forming step formed at least in the first substrate. Further, a noncontact portion is formed to surround the bonding portion, and an angle 01 formed between a side wall surface of the channel forming step and a bonding surface continuous therewith satisfies ?1>90°.Type: ApplicationFiled: August 7, 2018Publication date: August 13, 2020Applicant: Ushio Denki Kabushiki KaishaInventors: Kenichi HIROSE, Makoto YAMANAKA, Shinji SUZUKI, Kenji HATAKEYAMA
-
Publication number: 20200105632Abstract: A wafer accommodation container (1) includes: a container body having one end that is provided with an opening (11) and another end that is provided with a mount element (12) on which wafers are stacked, the mount element (12) facing the opening (11); a cover (20) to cover the opening (11); and a connection mechanism (30) to detachably connect the container body (10) and the cover (20), wherein the connection mechanism (30) includes: at least two engagement members (32) each extending from the other end of the container body (10) to the one end of the container body (10) and each having one end that is provided with an engagement nail (31); and at least two engagement holes (33) included in the cover (20) and configured to be each fitted to the corresponding engagement nail (31), and the cover (20) includes guide members (40) each disposed on corresponding one of cover side wall portions (21) and configured to guide the container body (10) and the cover (20) while the guide members (40) are coming into contacType: ApplicationFiled: March 19, 2018Publication date: April 2, 2020Inventors: Masayuki Nishijima, Kenichi Hirose
-
Patent number: 10553855Abstract: A secondary battery capable of improving the cycle characteristics and the initial charge and discharge characteristics is provided. The secondary battery includes a cathode, an anode, and an electrolytic solution. The anode has an anode active material layer on an anode current collector. The anode active material layer contains a crystalline anode active material having silicon as an element, and is linked to the anode current collector.Type: GrantFiled: June 30, 2017Date of Patent: February 4, 2020Assignee: MURATA MANUFACTURING CO., LTDInventors: Takakazu Hirose, Kenichi Kawase, Kazunori Noguchi, Takayuki Fujii, Rikako Imoto
-
Patent number: 10487183Abstract: The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip.Type: GrantFiled: June 27, 2017Date of Patent: November 26, 2019Assignee: Ushio Denki Kabushiki KaishaInventors: Fumitoshi Takemoto, Shinji Suzuki, Motohiro Sakai, Kenichi Hirose
-
Patent number: 10476070Abstract: A battery capable of improving the cycle characteristics is provided. The battery includes a cathode, an anode, and an electrolytic solution. The anode includes an anode active material layer containing an anode active material having silicon as an element, and a coating layer that coats the anode active material layer, and contains an oxide of a 3d transition metal element at least one selected from the group consisting of iron, cobalt, and nickel.Type: GrantFiled: October 24, 2018Date of Patent: November 12, 2019Assignee: Murata Manufacturing Co., Ltd.Inventors: Takakazu Hirose, Masayuki Iwama, Kenichi Kawase
-
Publication number: 20190300662Abstract: The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip.Type: ApplicationFiled: June 27, 2017Publication date: October 3, 2019Applicant: Ushio Denki Kabushiki KaishaInventors: Fumitoshi TAKEMOTO, Shinji SUZUKI, Motohiro SAKAI, Kenichi HIROSE
-
Patent number: 10420221Abstract: A desmear treatment method for a wiring board material is provide that is capable of performing desmear treating on the interior of a through hole formed in an insulating layer without requiring complicated steps and obtaining an insulating layer having appropriate surface roughness. The desmear treatment method comprises forming a hole passing through an insulating layer, wherein the insulating layer is made of a resin containing a filler, and desmear treating the wiring board material with radicals. The wiring board material includes a depletable resist layer formed on the insulating layer, and the depletable resist layer is made of a resin to be depleted in the desmear treatment step. A method of manufacturing a wiring board material to be subjected to the desmear treatment method and a composite insulating layer forming material used in the manufacturing method are also disclosed.Type: GrantFiled: November 21, 2014Date of Patent: September 17, 2019Assignee: Ushio Denki Kabushiki KaishaInventors: Kenichi Hirose, Makoto Wasamoto, Shinichi Endo
-
Publication number: 20190277386Abstract: A bicycle sprocket includes a sprocket body, a tooth ring, and at least one non-threaded fastener. The sprocket body is made of a first material and has a rotational center axis. A central portion of the sprocket body has a central opening through which the rotational center axis passes. The sprocket body further includes a plurality of arm portions that extend radially outward from the central portion with respect to the rotational center axis. Each arm portion includes a sprocket body attachment portion. The tooth ring is made of a second material different from the first material and includes an annular portion. The annular portion includes a plurality of tooth ring attachment portions and a plurality of chain-driving teeth extending radially outward from the annular portion. The non-threaded fastener fixedly connects a sprocket body attachment portion and to a corresponding tooth ring attachment portion.Type: ApplicationFiled: March 8, 2018Publication date: September 12, 2019Inventors: Yuki Hirose, Atsuhiro Emura, Shingo Shiraishi, Kenichi Akanishi
-
Patent number: 10351288Abstract: A paper sheets pre-processing apparatus of an embodiment includes a large band remover, a small bundle coupler, a small band remover and an accumulator. The large band remover conveys a bundle in which a plurality of paper sheets are bound by small bands and a predetermined number of small bundles are bound by a large band, and removes the large band from the bundle. The small bundle coupler conveys the predetermined number of small bundles included in the bundle from which the large band is removed by the large band remover, and couples the predetermined number of small bundles to each other. The small band remover separates a single small bundle from the small bundles coupled by the small bundle coupler and removes the small band from the small bundle. The accumulator accumulates the paper sheets from which the small band is removed by the small band remover.Type: GrantFiled: March 4, 2016Date of Patent: July 16, 2019Assignee: Kabushiki Kaisha ToshibaInventors: Kenichi Hirose, Kazuhiro Mukai, Masahiro Nagao, Junichi Inoue, Toshinori Utsugi, Osamu Maruyama
-
Patent number: 10293762Abstract: A vehicle interior part includes a structure in which a soft upholstery material covers a front surface of a base material which is located on an interior side of a vehicle. The soft upholstery material is disposed in a stretched state on the front surface of the base material which is located on the interior side of the vehicle.Type: GrantFiled: November 24, 2015Date of Patent: May 21, 2019Assignees: TOYOTA IRON WORKS CO., LTD., HAYASHI TELEMPU CO., LTDInventors: Kenji Onuma, Osamu Miyashita, Kenichi Yoshida, Masamori Hirose, Kenichi Uemori, Shintaro Suga
-
Publication number: 20190013226Abstract: Disclosed is a separator for semiconductor wafers vertically stacked in that the stacked wafers do not contact with each other, or the wafer does not contact to an inner top surface or an inner bottom surface of a conveyance container of the semiconductor wafer, the separator being interposed between two of the wafers neighboring vertically, between the wafer and an inner top surface, or between the wafer and an inner bottom surface of the container. The separator includes: a flat annular body; an annular convex portion having a wafer support surface coming into contact with a peripheral line of the wafer along a peripheral edge portion of the flat annular body, the annular convex portion forming cutout portions in a suitable number of places; and shock-absorbing function pieces neighboring to the cutout portions and extending diagonally upward or diagonally downward from a separator reference plane.Type: ApplicationFiled: October 20, 2016Publication date: January 10, 2019Inventors: Masayuki Nishijima, Kenichi Hirose
-
Publication number: 20180141280Abstract: Disclosed herein is a method of bonding substrates, a microchip, and a method of manufacturing the microchip capable of joining two substrates in a higher adhered state even when at least one of the substrate has a warpage or a roll. A method of bonding a first substrate and a second substrate each of which is made of glass or a resin comprises: a surface activating step for activating each of joining surfaces of the first substrate and the second substrate; and a pressurizing step for pressurizing the first substrate and the second substrate in a state that the first substrate and the second substrate are stacked such that respective joining surfaces contact each other. The joining surface of the first substrate and/or the joining surface of the second substrate are constituted with a plurality of joining regions segmented to be separate from one another by a segmenting recessed portion.Type: ApplicationFiled: November 15, 2017Publication date: May 24, 2018Applicant: USHIO DENKI KABUSHIKI KAISHAInventors: Motohiro SAKAI, Shinji SUZUKI, Fumitoshi TAKEMOTO, Kenichi HIROSE
-
Patent number: 9908649Abstract: According to one embodiment, a paper sheet processing apparatus includes a supply unit, a pick-up mechanism, an inspection device, a stacking device, and a wrapping device configured to wind a band around a stacked paper sheet bundle and wrap the stacked paper sheet bundle. The wrapping device includes a clamp mechanism configured to curve the stacked paper sheet bundle by pressing both side portions of the stacked paper sheet bundle, a band winding device configured to wind a wrapper band around the curved stacked paper sheet bundle, and a heater configured to heat-seal an end of the wrapper band. The clamp mechanism includes a press member configured to adjust a degree of curvature of the stacked paper sheet bundle.Type: GrantFiled: June 17, 2013Date of Patent: March 6, 2018Assignee: Kabushiki Kaisha ToshibaInventors: Jun Okamoto, Kenichi Hirose
-
Patent number: 9724652Abstract: The present invention relates to a copolymer containing a constitutional unit derived from acrylic acid cesium salt or acrylic acid rubidium salt and a constitutional unit derived from vinyl alcohol, a resin composition containing the copolymer, a carbon dioxide gas separation membrane which can be manufactured with the resin composition, a carbon dioxide gas separation membrane module having the separation membrane, and a carbon dioxide gas separation apparatus including at least one type of the module.Type: GrantFiled: October 18, 2013Date of Patent: August 8, 2017Assignee: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Kenichi Hirose, Hayato Sugiyama, Takehiro Nakasuji, Shinichi Furukawa
-
Patent number: 9678428Abstract: A light irradiating apparatus that may include: an ultraviolet light emission lamp configured to emit vacuum ultraviolet light toward a workpiece to be disposed in an atmosphere of a treatment gas including oxygen; a light passing window adapted to be disposed between the workpiece and the ultraviolet light emission lamp and configured to allow the vacuum ultraviolet light from the ultraviolet light emission lamp to pass therethrough, in which the light passing window has a light-exiting surface; and a spacer adapted to be disposed between the light passing window and the workpiece, to apply a pressing force onto the workpiece and to form a gap that allows a distance from the light-exiting surface of the light passing window to a surface of the workpiece to be of a uniform size over the entire surface of the workpiece.Type: GrantFiled: September 28, 2015Date of Patent: June 13, 2017Assignee: USHIO DENKI KABUSHIKI KAISHAInventors: Kenichi Hirose, Tetsuya Murakami
-
Patent number: 9663258Abstract: According to one embodiment, a stacking/wrapping apparatus includes a stacking device configured to stack paper sheets in a predetermined number on a stacking unit, a wrapping device configured to wrap a bundle of the stacked paper sheets by winding a band thereon, and a transport carrier configured to receive the paper sheet bundle and transport the paper sheet bundle to the wrapping device. The wrapping device includes a hand assembly, a hand drive mechanism configured to open and close the hand assembly and reciprocate the hand assembly at right angles to the stacking direction, and a band winding device configured to wind a wrapper band around the paper sheet bundle drawn into the binding position.Type: GrantFiled: January 16, 2013Date of Patent: May 30, 2017Assignee: Kabushiki Kaisha ToshibaInventors: Yoshitaka Sakoguchi, Masakazu Itoya, Hidetake Suzuki, Kenichi Hirose
-
Publication number: 20160368632Abstract: According to one embodiment, a stacking/wrapping apparatus includes a stacking device configured to stack paper sheets in a predetermined number on a stacking unit, a wrapping device configured to wrap a bundle of the stacked paper sheets by winding a band thereon, and a transport carrier configured to receive the paper sheet bundle and transport the paper sheet bundle to the wrapping device. The wrapping device includes a hand assembly, a hand drive mechanism configured to open and close the hand assembly and reciprocate the hand assembly at right angles to the stacking direction, and a band winding device configured to wind a wrapper band around the paper sheet bundle drawn into the binding position.Type: ApplicationFiled: June 13, 2016Publication date: December 22, 2016Inventors: Yoshitaka Sakoguchi, Masakazu Itoya, Hidetake Suzuki, Kenichi Hirose