Patents by Inventor Kenichi Hirose

Kenichi Hirose has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10830329
    Abstract: A bicycle sprocket includes a sprocket body, a tooth ring, and at least one non-threaded fastener. The sprocket body is made of a first material and has a rotational center axis. A central portion of the sprocket body has a central opening through which the rotational center axis passes. The sprocket body further includes a plurality of arm portions that extend radially outward from the central portion with respect to the rotational center axis. Each arm portion includes a sprocket body attachment portion. The tooth ring is made of a second material different from the first material and includes an annular portion. The annular portion includes a plurality of tooth ring attachment portions and a plurality of chain-driving teeth extending radially outward from the annular portion. The non-threaded fastener fixedly connects a sprocket body attachment portion and to a corresponding tooth ring attachment portion.
    Type: Grant
    Filed: March 8, 2018
    Date of Patent: November 10, 2020
    Assignee: Shimano Inc.
    Inventors: Yuki Hirose, Atsuhiro Emura, Shingo Shiraishi, Kenichi Akanishi
  • Publication number: 20200333762
    Abstract: A machine control system includes a first movable element configured to be driven by a first motor, a second movable element configured to be driven by a second motor which is connected to the first motor so that a jerk to be generated by the first motor is applied to the second movable element, and control circuitry configured to generate a first control command to control the first motor and to generate a second control command to control the second motor according to the jerk.
    Type: Application
    Filed: February 19, 2020
    Publication date: October 22, 2020
    Applicant: KABUSHIKI KAISHA YASKAWA DENKI
    Inventors: Kenichi HIROSE, Atsuro TANDAI, Yasuhiro SUZUKI
  • Patent number: 10752183
    Abstract: A laminated composite interior part includes a first member made of synthetic resin and having a mating surface; and a second member made of elastically deformable synthetic resin and having a plate portion substantially parallel to the mating surface. The plate portion has integrally-formed and interspersed protrusions protruding toward the mating surface. The second member is placed on the first member with distal end portions of the protrusions being in contact with the mating surface. Cushioning properties are provided by elastic deformation of the protrusions, caused as the protrusions' distal end portions are relatively pressed against the mating surface. Flexural rigidity of each of the protrusions against a compressive load is anisotropic about its axis, so that the protrusion is flexurally deformed in one direction about its axis with the distal end portion thereof sliding on the mating surface. Surface roughness of the mating surface is less than 0.20.
    Type: Grant
    Filed: August 6, 2015
    Date of Patent: August 25, 2020
    Assignee: Toyoda Iron Works Co., Ltd.
    Inventors: Osamu Miyashita, Kenichi Yoshida, Kenji Onuma, Takeshi Taniguchi, Masamori Hirose, Hideaki Sakai
  • Publication number: 20200255288
    Abstract: Provided is a microchip that can achieve a favorable bonding state in the bonding portion between first and second substrates even if the microchip is large in size. A microchip includes a first substrate made of a resin and a second substrate made of a resin, the first substrate and the second substrates being bonded to each other, and a channel surrounded by a bonding portion between the first substrate and the second substrate is formed by a channel forming step formed at least in the first substrate. Further, a noncontact portion is formed to surround the bonding portion, and an angle 01 formed between a side wall surface of the channel forming step and a bonding surface continuous therewith satisfies ?1>90°.
    Type: Application
    Filed: August 7, 2018
    Publication date: August 13, 2020
    Applicant: Ushio Denki Kabushiki Kaisha
    Inventors: Kenichi HIROSE, Makoto YAMANAKA, Shinji SUZUKI, Kenji HATAKEYAMA
  • Publication number: 20200105632
    Abstract: A wafer accommodation container (1) includes: a container body having one end that is provided with an opening (11) and another end that is provided with a mount element (12) on which wafers are stacked, the mount element (12) facing the opening (11); a cover (20) to cover the opening (11); and a connection mechanism (30) to detachably connect the container body (10) and the cover (20), wherein the connection mechanism (30) includes: at least two engagement members (32) each extending from the other end of the container body (10) to the one end of the container body (10) and each having one end that is provided with an engagement nail (31); and at least two engagement holes (33) included in the cover (20) and configured to be each fitted to the corresponding engagement nail (31), and the cover (20) includes guide members (40) each disposed on corresponding one of cover side wall portions (21) and configured to guide the container body (10) and the cover (20) while the guide members (40) are coming into contac
    Type: Application
    Filed: March 19, 2018
    Publication date: April 2, 2020
    Inventors: Masayuki Nishijima, Kenichi Hirose
  • Patent number: 10553855
    Abstract: A secondary battery capable of improving the cycle characteristics and the initial charge and discharge characteristics is provided. The secondary battery includes a cathode, an anode, and an electrolytic solution. The anode has an anode active material layer on an anode current collector. The anode active material layer contains a crystalline anode active material having silicon as an element, and is linked to the anode current collector.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: February 4, 2020
    Assignee: MURATA MANUFACTURING CO., LTD
    Inventors: Takakazu Hirose, Kenichi Kawase, Kazunori Noguchi, Takayuki Fujii, Rikako Imoto
  • Patent number: 10487183
    Abstract: The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: November 26, 2019
    Assignee: Ushio Denki Kabushiki Kaisha
    Inventors: Fumitoshi Takemoto, Shinji Suzuki, Motohiro Sakai, Kenichi Hirose
  • Patent number: 10476070
    Abstract: A battery capable of improving the cycle characteristics is provided. The battery includes a cathode, an anode, and an electrolytic solution. The anode includes an anode active material layer containing an anode active material having silicon as an element, and a coating layer that coats the anode active material layer, and contains an oxide of a 3d transition metal element at least one selected from the group consisting of iron, cobalt, and nickel.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: November 12, 2019
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takakazu Hirose, Masayuki Iwama, Kenichi Kawase
  • Publication number: 20190300662
    Abstract: The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip.
    Type: Application
    Filed: June 27, 2017
    Publication date: October 3, 2019
    Applicant: Ushio Denki Kabushiki Kaisha
    Inventors: Fumitoshi TAKEMOTO, Shinji SUZUKI, Motohiro SAKAI, Kenichi HIROSE
  • Patent number: 10420221
    Abstract: A desmear treatment method for a wiring board material is provide that is capable of performing desmear treating on the interior of a through hole formed in an insulating layer without requiring complicated steps and obtaining an insulating layer having appropriate surface roughness. The desmear treatment method comprises forming a hole passing through an insulating layer, wherein the insulating layer is made of a resin containing a filler, and desmear treating the wiring board material with radicals. The wiring board material includes a depletable resist layer formed on the insulating layer, and the depletable resist layer is made of a resin to be depleted in the desmear treatment step. A method of manufacturing a wiring board material to be subjected to the desmear treatment method and a composite insulating layer forming material used in the manufacturing method are also disclosed.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: September 17, 2019
    Assignee: Ushio Denki Kabushiki Kaisha
    Inventors: Kenichi Hirose, Makoto Wasamoto, Shinichi Endo
  • Publication number: 20190277386
    Abstract: A bicycle sprocket includes a sprocket body, a tooth ring, and at least one non-threaded fastener. The sprocket body is made of a first material and has a rotational center axis. A central portion of the sprocket body has a central opening through which the rotational center axis passes. The sprocket body further includes a plurality of arm portions that extend radially outward from the central portion with respect to the rotational center axis. Each arm portion includes a sprocket body attachment portion. The tooth ring is made of a second material different from the first material and includes an annular portion. The annular portion includes a plurality of tooth ring attachment portions and a plurality of chain-driving teeth extending radially outward from the annular portion. The non-threaded fastener fixedly connects a sprocket body attachment portion and to a corresponding tooth ring attachment portion.
    Type: Application
    Filed: March 8, 2018
    Publication date: September 12, 2019
    Inventors: Yuki Hirose, Atsuhiro Emura, Shingo Shiraishi, Kenichi Akanishi
  • Patent number: 10351288
    Abstract: A paper sheets pre-processing apparatus of an embodiment includes a large band remover, a small bundle coupler, a small band remover and an accumulator. The large band remover conveys a bundle in which a plurality of paper sheets are bound by small bands and a predetermined number of small bundles are bound by a large band, and removes the large band from the bundle. The small bundle coupler conveys the predetermined number of small bundles included in the bundle from which the large band is removed by the large band remover, and couples the predetermined number of small bundles to each other. The small band remover separates a single small bundle from the small bundles coupled by the small bundle coupler and removes the small band from the small bundle. The accumulator accumulates the paper sheets from which the small band is removed by the small band remover.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: July 16, 2019
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kenichi Hirose, Kazuhiro Mukai, Masahiro Nagao, Junichi Inoue, Toshinori Utsugi, Osamu Maruyama
  • Patent number: 10293762
    Abstract: A vehicle interior part includes a structure in which a soft upholstery material covers a front surface of a base material which is located on an interior side of a vehicle. The soft upholstery material is disposed in a stretched state on the front surface of the base material which is located on the interior side of the vehicle.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: May 21, 2019
    Assignees: TOYOTA IRON WORKS CO., LTD., HAYASHI TELEMPU CO., LTD
    Inventors: Kenji Onuma, Osamu Miyashita, Kenichi Yoshida, Masamori Hirose, Kenichi Uemori, Shintaro Suga
  • Publication number: 20190013226
    Abstract: Disclosed is a separator for semiconductor wafers vertically stacked in that the stacked wafers do not contact with each other, or the wafer does not contact to an inner top surface or an inner bottom surface of a conveyance container of the semiconductor wafer, the separator being interposed between two of the wafers neighboring vertically, between the wafer and an inner top surface, or between the wafer and an inner bottom surface of the container. The separator includes: a flat annular body; an annular convex portion having a wafer support surface coming into contact with a peripheral line of the wafer along a peripheral edge portion of the flat annular body, the annular convex portion forming cutout portions in a suitable number of places; and shock-absorbing function pieces neighboring to the cutout portions and extending diagonally upward or diagonally downward from a separator reference plane.
    Type: Application
    Filed: October 20, 2016
    Publication date: January 10, 2019
    Inventors: Masayuki Nishijima, Kenichi Hirose
  • Publication number: 20180141280
    Abstract: Disclosed herein is a method of bonding substrates, a microchip, and a method of manufacturing the microchip capable of joining two substrates in a higher adhered state even when at least one of the substrate has a warpage or a roll. A method of bonding a first substrate and a second substrate each of which is made of glass or a resin comprises: a surface activating step for activating each of joining surfaces of the first substrate and the second substrate; and a pressurizing step for pressurizing the first substrate and the second substrate in a state that the first substrate and the second substrate are stacked such that respective joining surfaces contact each other. The joining surface of the first substrate and/or the joining surface of the second substrate are constituted with a plurality of joining regions segmented to be separate from one another by a segmenting recessed portion.
    Type: Application
    Filed: November 15, 2017
    Publication date: May 24, 2018
    Applicant: USHIO DENKI KABUSHIKI KAISHA
    Inventors: Motohiro SAKAI, Shinji SUZUKI, Fumitoshi TAKEMOTO, Kenichi HIROSE
  • Patent number: 9908649
    Abstract: According to one embodiment, a paper sheet processing apparatus includes a supply unit, a pick-up mechanism, an inspection device, a stacking device, and a wrapping device configured to wind a band around a stacked paper sheet bundle and wrap the stacked paper sheet bundle. The wrapping device includes a clamp mechanism configured to curve the stacked paper sheet bundle by pressing both side portions of the stacked paper sheet bundle, a band winding device configured to wind a wrapper band around the curved stacked paper sheet bundle, and a heater configured to heat-seal an end of the wrapper band. The clamp mechanism includes a press member configured to adjust a degree of curvature of the stacked paper sheet bundle.
    Type: Grant
    Filed: June 17, 2013
    Date of Patent: March 6, 2018
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Jun Okamoto, Kenichi Hirose
  • Patent number: 9724652
    Abstract: The present invention relates to a copolymer containing a constitutional unit derived from acrylic acid cesium salt or acrylic acid rubidium salt and a constitutional unit derived from vinyl alcohol, a resin composition containing the copolymer, a carbon dioxide gas separation membrane which can be manufactured with the resin composition, a carbon dioxide gas separation membrane module having the separation membrane, and a carbon dioxide gas separation apparatus including at least one type of the module.
    Type: Grant
    Filed: October 18, 2013
    Date of Patent: August 8, 2017
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Kenichi Hirose, Hayato Sugiyama, Takehiro Nakasuji, Shinichi Furukawa
  • Patent number: 9678428
    Abstract: A light irradiating apparatus that may include: an ultraviolet light emission lamp configured to emit vacuum ultraviolet light toward a workpiece to be disposed in an atmosphere of a treatment gas including oxygen; a light passing window adapted to be disposed between the workpiece and the ultraviolet light emission lamp and configured to allow the vacuum ultraviolet light from the ultraviolet light emission lamp to pass therethrough, in which the light passing window has a light-exiting surface; and a spacer adapted to be disposed between the light passing window and the workpiece, to apply a pressing force onto the workpiece and to form a gap that allows a distance from the light-exiting surface of the light passing window to a surface of the workpiece to be of a uniform size over the entire surface of the workpiece.
    Type: Grant
    Filed: September 28, 2015
    Date of Patent: June 13, 2017
    Assignee: USHIO DENKI KABUSHIKI KAISHA
    Inventors: Kenichi Hirose, Tetsuya Murakami
  • Patent number: 9663258
    Abstract: According to one embodiment, a stacking/wrapping apparatus includes a stacking device configured to stack paper sheets in a predetermined number on a stacking unit, a wrapping device configured to wrap a bundle of the stacked paper sheets by winding a band thereon, and a transport carrier configured to receive the paper sheet bundle and transport the paper sheet bundle to the wrapping device. The wrapping device includes a hand assembly, a hand drive mechanism configured to open and close the hand assembly and reciprocate the hand assembly at right angles to the stacking direction, and a band winding device configured to wind a wrapper band around the paper sheet bundle drawn into the binding position.
    Type: Grant
    Filed: January 16, 2013
    Date of Patent: May 30, 2017
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Yoshitaka Sakoguchi, Masakazu Itoya, Hidetake Suzuki, Kenichi Hirose
  • Publication number: 20160368632
    Abstract: According to one embodiment, a stacking/wrapping apparatus includes a stacking device configured to stack paper sheets in a predetermined number on a stacking unit, a wrapping device configured to wrap a bundle of the stacked paper sheets by winding a band thereon, and a transport carrier configured to receive the paper sheet bundle and transport the paper sheet bundle to the wrapping device. The wrapping device includes a hand assembly, a hand drive mechanism configured to open and close the hand assembly and reciprocate the hand assembly at right angles to the stacking direction, and a band winding device configured to wind a wrapper band around the paper sheet bundle drawn into the binding position.
    Type: Application
    Filed: June 13, 2016
    Publication date: December 22, 2016
    Inventors: Yoshitaka Sakoguchi, Masakazu Itoya, Hidetake Suzuki, Kenichi Hirose