Patents by Inventor Kenichi Inoue

Kenichi Inoue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200122236
    Abstract: There are provided an inexpensive copper powder, which has a low content of oxygen even it has a small particle diameter and which has a high shrinkage starting temperature when it is heated, and a method for producing the same. While a molten metal of copper heated to a temperature, which is higher than the melting point of copper by 250 to 700° C. (preferably 350 to 650° C. and more preferably 450 to 600° C.), is allowed to drop, a high-pressure water is sprayed onto the heated molten metal of copper in a non-oxidizing atmosphere (such as an atmosphere of nitrogen, argon, hydrogen or carbon monoxide) to rapidly cool and solidify the heated molten metal of copper to produce a copper powder which has an average particle diameter of 1 to 10 ?m and a crystallite diameter Dx(200) of not less than 40 nm on (200) plane thereof, the content of oxygen in the copper powder being 0.7% by weight or less.
    Type: Application
    Filed: December 21, 2017
    Publication date: April 23, 2020
    Applicant: Dowa Electronics Materials Co., Ltd.
    Inventors: Masahiro Yoshida, Kenichi Inoue, Atsushi Ebara, Yoshiyuki Michiaki, Takahiro Yamada
  • Patent number: 10626493
    Abstract: A method for producing a tool coated with a hard coating, the method including the following steps: applying a TiAIN coating layer onto a substrate with a first magnetron sputtering process and applying a TixSi1-xN coating layer onto the TiAIN layer with a second magnetron sputtering process, where x is smaller than or equal to 0.85 and preferably between and including 0.80 and 0.70 whereas the second magnetron sputtering process is performed with power densities greater than 100 W/cm2 and as such is a HIPIMS process.
    Type: Grant
    Filed: September 17, 2015
    Date of Patent: April 21, 2020
    Assignees: OERLIKON SURFACE SOLUTIONS AG, PFÄFFIKON, HITACHI METALS, LTD., MITSUBISHI HITACHI TOOL ENGINEERING, LTD.
    Inventors: Denis Kurapov, Tomoya Sasaki, Shuho Koseki, Kana Morishita, Saleh Breik Abusuilik, Kenichi Inoue
  • Publication number: 20190371529
    Abstract: A plurality of electronic elements 3 are arranged in a second direction D2 orthogonal to a first direction D1 which is a facing direction of external electrodes 3b and 3c forming a pair in the first electronic element group 5A and the second electronic element group 5B. The first electronic element group SA and the second electronic element group 5B are disposed side by side in the first direction D1. The first terminal 7 is disposed between the first electronic element group 5A and the second electronic element group 5B in the first direction D1. The second terminals 9 and 11 are disposed at positions with the first electronic element group 5A and the second electronic element group 5B respectively interposed between the second terminals and the first terminal 7 in the first direction D1.
    Type: Application
    Filed: June 4, 2019
    Publication date: December 5, 2019
    Applicant: TDK CORPORATION
    Inventors: Shinya ITO, Akitoshi YOSHII, Kenichi INOUE, Yoshiki SATOU
  • Patent number: 10458004
    Abstract: To provide a silver-bismuth powder, which includes: silver; and bismuth, wherein a mass ratio (silver:bismuth) of the silver to the bismuth is 95:5 to 40:60, wherein a cumulative 50% point of particle diameter (D50) of the silver-bismuth powder in a volume-based particle size distribution thereof as measured by a laser diffraction particle size distribution analysis is 0.1 ?m to 10 ?m, and wherein an oxygen content of the silver-bismuth powder is 5.5% by mass or less.
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: October 29, 2019
    Assignee: DOWA Electronics Materials Co., Ltd.
    Inventors: Kozo Ogi, Kenichi Inoue, Atsushi Ebara, Akihiro Asano, Hideyuki Fujimoto, Takahiro Yamada
  • Publication number: 20190323114
    Abstract: The present disclosure relates to a titanium or titanium alloy member and to a surface hardening method for the titanium or titanium alloy member. The titanium or titanium alloy member includes a base material of titanium or titanium alloy, and at a surface of the base material, a hardened layer formed by diffusion of oxygen into the surface. The method includes: a heating step of heating the titanium or titanium alloy base material of the member to a predetermined temperature under an inert gas atmosphere; a hardening step of introducing (i) a mixed gas including an inert gas, and (ii) oxygen gas as a hardening treatment gas, to perform hardening treatment of the surface of the base material; and a cooling step of cooling the base material down to room temperature under the inert gas atmosphere.
    Type: Application
    Filed: June 29, 2019
    Publication date: October 24, 2019
    Applicant: CASIO COMPUTER CO., LTD.
    Inventors: Junichi SATO, Kazuma KOBAYASHI, Shouta NAGASAWA, Kenichi INOUE, Chinfu LIU, Wuchien LIU, Tienchai LIN, Weipin KAO
  • Patent number: 10355570
    Abstract: In the outer rotor-type axial gap brushless motor of the present invention, each of a plurality of coils provided to a stator is constituted by winding a band-shaped conductor member via an insulating member such that the width direction of the conductor member runs along the axial direction of the coil, and each coil has a through passage which penetrates in the axial direction of the coil and which is included between prescribed turns in a portion of the coil that corresponds to the outer side in the radial direction of the stator relative to a core portion of the coil.
    Type: Grant
    Filed: August 20, 2015
    Date of Patent: July 16, 2019
    Assignee: Kobe Steel, Ltd.
    Inventors: Kenichi Inoue, Hiroaki Kawai, Koji Inoue, Takashi Hiekata, Kazuhide Sekiyama
  • Patent number: 10355625
    Abstract: This DC brushless motor (1) is provided with a stator (2) that has exciting coils (31, 32) and a rotor (4) that is positioned coaxially to the stator (2). The stator (2) has a quasi-E-shaped cross-section in the axial direction at the radius part; a plurality of protrusions (212, 222, 232) serving as magnetic poles are formed on the respective 3 parallel sections (211, 221, 231) of the E in the same number in the circumferential direction; and of the magnetic poles (212, 222, 232) formed at the 3 parallel sections (211, 221, 231) of the E, the top and the bottom magnetic poles (212, 232) are respectively positioned so as to be shifted in the opposite directions in the circumferential direction with respect to the center line of the middle magnetic pole (222). Changes in the magnetic resistance between the stator (2) and the rotor (4), which are caused by the flow of a magnetic flux generated around the exciting coils (31, 32), are utilized as a driving force.
    Type: Grant
    Filed: November 18, 2011
    Date of Patent: July 16, 2019
    Assignee: Kobe Steel, Ltd.
    Inventors: Akira Tsutsui, Kenichi Inoue, Kyoji Zaitsu
  • Publication number: 20190194778
    Abstract: An object of the present invention is to provide metal powder that can be used to form an external electrode, which is excellent in solder wettability and solder leach resistance while having a layer structure with fewer layers than in the related art and, furthermore, is excellent in electrical conductivity. This silver-coated alloy powder comprises a coating layer on a surface of an alloy core particle containing copper, nickel, zinc, and inevitable impurities, the coating layer containing silver.
    Type: Application
    Filed: August 31, 2017
    Publication date: June 27, 2019
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Kyoso MASUDA, Kenichi INOUE, Yuki KANESHIRO, Atsushi EBARA, Yoshiyuki MICHIAKI, Kozo OGI, Takahiro YAMADA, Masahiro YOSHIDA
  • Publication number: 20190086868
    Abstract: A pointer including a pointer body constituted by a plate member, an engraved section provided in at least one of front and back surfaces of the pointer body excluding an edge of the pointer body, and a reinforcing section provided at the edge of the pointer body by the engraved section.
    Type: Application
    Filed: September 7, 2018
    Publication date: March 21, 2019
    Applicant: CASIO COMPUTER CO., LTD.
    Inventors: Kenichi INOUE, Masao AMANO
  • Publication number: 20190080841
    Abstract: A method of manufacturing an electronic device includes preparing a chip component with a terminal electrode. A terminal plate is prepared. A connection member is placed between an end surface of the terminal electrode and an inner surface of the terminal plate. The terminal plate and the terminal electrode are joined using the connection member by bringing a press head into contact with an outer surface of the terminal plate and pressing and heating the terminal plate against the terminal electrode.
    Type: Application
    Filed: September 5, 2018
    Publication date: March 14, 2019
    Applicant: TDK CORPORATION
    Inventors: Norihisa ANDO, Kenichi INOUE, Sunao MASUDA, Masahiro MORI, Kayou MATSUNAGA, Kosuke YAZAWA
  • Publication number: 20190072900
    Abstract: A pointer including a thick section formed on a pointer body in a manner to be thicker than a thickness of the pointer body, an accommodation section provided in the thick section in a manner to penetrate through a front and back of the thick section, and a luminous member provided in the accommodation section.
    Type: Application
    Filed: September 4, 2018
    Publication date: March 7, 2019
    Applicant: CASIO COMPUTER CO., LTD.
    Inventors: Kenichi INOUE, Masao AMANO
  • Patent number: 10220377
    Abstract: The present invention is a metal colloid solution comprising: colloidal particles consisting of metal particles consisting of one or two or more metal(s) and a protective agent bonding to the metal particles; and a solvent as a dispersion medium of the colloidal particles, wherein: a chloride ion concentration per a metal concentration of 1 mass % is 25 ppm or less; and a nitrate ion concentration per a metal concentration of 1 mass % is 7500 ppm or less. In the present invention, adsorption performance can be improved with adjustment of the amount of the protective agent of the colloidal particles. It is preferable to bind the protective agent of 0.2 to 2.5 times the mass of the metal particles.
    Type: Grant
    Filed: February 8, 2013
    Date of Patent: March 5, 2019
    Assignee: TANAKA KIKINZOKU KOGOY K.K.
    Inventors: Yuusuke Ohshima, Hitoshi Kubo, Tomoko Ishikawa, Noriaki Nakamura, Junichi Taniuchi, Yoshiteru Tsuchiya, Hiroaki Takahashi, Hidenori Takanezawa, Kenichi Inoue, Syunsuke Kato, Hirokazu Shiraishi
  • Patent number: 10225899
    Abstract: A lighting system for plant cultivation comprises a light source, a light source driving unit that drives the light source, and a control unit that transmits a pulse signal to the light source driving unit. The control unit comprises a first pulse generating unit that generates a first pulse signal (S1) of a predetermined frequency, a second pulse generating unit that generates a second pulse signal (S2) of a frequency different from the predetermined frequency, and a pulse signal selecting unit that selects any one of the first pulse signal (S1) and the second pulse signal (S2) to transmit the selected one to the light source driving unit.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: March 5, 2019
    Assignee: KOWA COMPANY, LTD.
    Inventors: Yutaka Mizukusa, Kenichi Inoue, Kazuhiro Kashiwagi, Ayafumi Taniji
  • Publication number: 20190016641
    Abstract: The present invention pertains to high-strength/high-ductility alloys, and in particular, provides high-strength composite particles comprising a ceramic phase and a metal phase, a composite powder, a method for manufacturing composite particles, and a method for manufacturing a composite member. Composite particles including a ceramic phase and a metal phase, wherein the composite particles are characterized in that the porosity is no greater than 45% in area ratio in cross-section, and the area ratio of the metal phase, where the total area of the ceramic phase and the metal phase is 100%, is at least 20%. A composite powder characterized in including a plurality of the composite particles.
    Type: Application
    Filed: February 23, 2017
    Publication date: January 17, 2019
    Applicant: HITACHI METALS, LTD.
    Inventors: Shuho KOSEKI, Tadashi FURUYA, Daiki SHINNO, Kenichi INOUE
  • Publication number: 20190009341
    Abstract: While a molten metal obtained by melting silver and a metal, which is selected from the group consisting of tin, zinc, lead and indium, in an atmosphere of nitrogen is allowed to drop, a high-pressure water (preferably pure water or alkaline water) is sprayed onto the molten metal in the atmosphere or an atmosphere of nitrogen to rapidly cool and solidify the molten metal to produce a silver alloy powder which comprises silver and the metal which is selected from the group consisting of tin, zinc, lead and indium and which has an average particle diameter of 0.5 to 20 ?m, the silver alloy powder having a temperature of not higher than 300° C. at a shrinking percentage of 0.5%, a temperature of not higher than 400° C. at a shrinking percentage of 1.0% and a temperature of not higher than 450° C. at a shrinking percentage of 1.5% in a thermomechanical analysis.
    Type: Application
    Filed: December 26, 2016
    Publication date: January 10, 2019
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Masahiro YOSHIDA, Yoshiyuki MICHIAKI, Kenichi INOUE
  • Patent number: 10156010
    Abstract: An embodiment of the invention provides a coated cutting tool having a base material and a hard coating, in which: the hard coating is formed from a nitride or a carbonitride having an Al content of from 50 at. % to 68 at. %, a Cr content of from 20 at. % to 46 at. %, and an Si content of from 4 at. % to 15 at. %, relative to the total amount of metal (including semimetal) elements, and when the total of metal (including semimetal) elements, nitrogen, oxygen, and carbon is designated as 100 at. %, the atomic percentage (at. %) A of metal (including semimetal) elements and the atomic percentage (at. %) B of nitrogen satisfy the relationship 1.03?B/A?1.07; and, in an intensity profile obtained from an X-ray diffraction pattern or a selected area diffraction pattern of a transmission electron microscope, an intensity of a peak from the (200) plane or the (111) plane of a face-centered cubic lattice structure exhibits the maximum intensity.
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: December 18, 2018
    Assignees: HITACHI METALS, LTD., Mitsubishi Hitachi Tool Engineering, Ltd.
    Inventors: Tomoya Sasaki, Kenichi Inoue
  • Publication number: 20180326497
    Abstract: There is provided a silver powder which has a small average particle diameter and a small thermal shrinkage percentage, and a method for producing the same. While a molten metal of silver heated to a temperature (1292 to 1692° C.), which is higher than the melting point (962° C.) of silver by 330 to 730° C., is allowed to drop, a high-pressure water is sprayed onto the molten metal of silver (preferably at a water pressure of 90 to 160 MPa) to rapidly cool and solidify the molten metal of silver to powderize silver to produce a silver powder which has an average particle diameter of 1 to 6 ?m and a shrinkage percentage of not greater than 8% (preferably not greater than 7%) at 500° C., the product of the average particle diameter by the shrinkage percentage at 500° C. being 1 to 11 ?m·% (preferably 1.5 to 10.5 ?m·%).
    Type: Application
    Filed: October 26, 2016
    Publication date: November 15, 2018
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Atsushi Ebara, Kenichi Inoue, Yoshiyuki Michiaki, Takahiro Yamada, Masahiro Yoshida
  • Patent number: 10097067
    Abstract: Liquefier includes first compression section which is driven by a superconducting motor and which compresses a substance in a gaseous state. Cooling circuit includes: second compression section which is driven by the motor when first compression section is being driven by the motor and which compresses a refrigerant; first heat exchange section which cools the refrigerant by causing heat exchange between a substance in a tank and the compressed refrigerant; second expansion section which brings the refrigerant down to or below a critical temperature of a superconducting material by expanding the cooled refrigerant; and second heat exchange section which imparts cold heat of the refrigerant to the substance by causing heat exchange between the substance in the tank and the refrigerant after cooling a superconducting magnet, and supplies the refrigerant brought down to or below the critical temperature by second expansion section to the motor and cools the superconducting magnet.
    Type: Grant
    Filed: March 4, 2016
    Date of Patent: October 9, 2018
    Assignees: Kobe Steel, Ltd., JAPAN SUPERCONDUCTOR TECHNOLOGY INC.
    Inventors: Kenichi Inoue, Kazuyoshi Saitou, Kyoji Zaitsu, Koji Inoue, Satoshi Ito
  • Publication number: 20180243831
    Abstract: An object of the present invention is to provide a phosphorus-containing copper powder with good volume resistivity and a small carbon content by suppressing an oxygen content to a relatively low value even if a particle size is made small, and a method for producing the same. In the phosphorus-containing copper powder containing phosphorus, a ratio of an oxygen content (wt. %) to a BET specific surface area (m2/g) (oxygen content/BET specific surface area) is 0.90 wt. %·g/m2 or less, a divalent copper compound is present on a surface of particles constituting the phosphorus-containing copper powder, a carbon content is 0.10 wt. % or less, and D50 is 7.11 ?m or less.
    Type: Application
    Filed: August 18, 2016
    Publication date: August 30, 2018
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Kenichi INOUE, Atsushi EBARA, Masahiro YOSHIDA, Kyoso MASUDA, Takahiro YAMADA, Shinichi UCHIYAMA
  • Patent number: 10062473
    Abstract: A silver-coated copper alloy powder, which has a low volume resistivity and excellent storage stability (reliability), is produced by coating a copper alloy powder, which has a chemical composition comprising 1 to 50 wt % of at least one of nickel and zinc and the balance being copper and unavoidable impurities (preferably a copper alloy powder wherein a particle diameter (D50 diameter) corresponding to 50% of accumulation in cumulative distribution of the copper alloy powder, which is measured by a laser diffraction particle size analyzer, is 0.1 to 15 ?m), with 7 to 50 wt % of a silver containing layer, preferably a layer of silver or an silver compound.
    Type: Grant
    Filed: January 15, 2013
    Date of Patent: August 28, 2018
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Kenichi Inoue, Kozo Ogi, Atsushi Ebara, Yuto Hiyama, Takahiro Yamada, Toshihiko Ueyama