Patents by Inventor Kenichi Kagawa
Kenichi Kagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7570773Abstract: A sound detecting mechanism capable of forming a diaphragm and a back electrode on a substrate by a simple process includes acoustic holes corresponding to perforations formed on a front surface of a substrate. A second protective film, a sacrificial layer and a metal film are laminated on the front surface in a portion corresponding to the acoustic holes. The substrate is etched from the back surface thereof to a depth reaching the acoustic holes to form an acoustic opening. Subsequently, by effecting an etching from the back surface of the substrate through the acoustic holes, the sacrificial layer is removed and a void area is formed between the diaphragm made of the metal film, the substrate and the formed perforations. The sacrificial layer that remains after the etching is used as a spacer for maintaining a gap between the back electrode and the diaphragm.Type: GrantFiled: July 14, 2004Date of Patent: August 4, 2009Assignees: Hosiden Corporation, Tokyo Electron LimitedInventors: Yoshiaki Ohbayashi, Mamoru Yasuda, Shinichi Saeki, Masatsugu Komai, Kenichi Kagawa
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Publication number: 20090122379Abstract: The present invention can provide a downsized optical deflecting element having less operating fluctuations at low cost and further it can be actuated at lower frequencies and at wider deflecting angles. The optical deflecting element comprises a base component having magnets therein; a soft resin component comprising a fixed part adhered to the base component and a movable part having a coil therein supported by the fixed part via a pair of beams; and a reflector plate 3 adhered on to the movable part. The soft resin component consists of a first insulating resin part 2-1 and second conductive resin part 2-2 for electrical wiring.Type: ApplicationFiled: May 18, 2006Publication date: May 14, 2009Applicant: MICRO PRECISION CO. & LTD.Inventors: Kenichi Kagawa, Norihiro Asada
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Publication number: 20080285107Abstract: The present invention provides an electromagnetically actuating optical deflecting elements which can be manufactured out of reduced number of components and are capable of being actuated at lower frequencies and at wider deflecting angles without causing mechanical influences of the metal wiring on beams of the optical deflecting element. For that purpose, the electromagnetically actuating optical deflecting element comprises: a movable part having a light reflecting plane and a coil; a base component having a magnetic field generating means; and a pair of beams which axially support said movable part on to the base component, The movable part is actuated by an electromagnetic force generated by an electric current flowing through the coil and the magnetic field generating means.Type: ApplicationFiled: August 7, 2007Publication date: November 20, 2008Inventors: Norihiro Asada, Kenichi Kagawa
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Patent number: 7386136Abstract: A sound detecting mechanism is provided which forms a diaphragm with a required thickness by thickness control and yet restrains distortion of the diaphragm to provide high sensitivity. The sound detecting mechanism comprises a pair of electrodes forming a capacitor on a substrate A in which one of the electrodes is a back electrode C forming perforations Ca therein corresponding to acoustic holes and the other of the electrodes is a diaphragm B. The diaphragm B is mounted on the substrate A while the back electrode C is mounted in a position opposed to the diaphragm B across a void F to be supported by the substrate A, the back electrode C being formed by polycrystal silicon of 5 ?m to 20 ?m in thickness.Type: GrantFiled: May 25, 2004Date of Patent: June 10, 2008Assignees: Hosiden Corporation, Tokyo Electron LimitedInventors: Yoshiaki Ohbayashi, Mamoru Yasuda, Shinichi Saeki, Masatsugu Komai, Kenichi Kagawa
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Publication number: 20080067073Abstract: In a manufacturing method for an interposer, a seed layer is formed at an opening portion in a through hole on back surface side of a substrate, an electrode layer for electroplated coating is formed based on the seed layer, and an electroplated coating layer is formed to fill the through hole from the electrode layer for electroplated coating layer to a front surface side. As a result, a manufacturing method for an interposer is provided in which the manufacturing process is simple and the void is not generated inside of the through hole.Type: ApplicationFiled: July 5, 2005Publication date: March 20, 2008Inventors: Kenichi Kagawa, Tomohisa Hoshino, Masami Yakabe
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Publication number: 20070278650Abstract: In a semiconductor device a substrate is formed in a rectangular shape having four edges along dicing lines, and a jetty portion is formed so as to surround an actuator element and an electrode pad for signal input and output. The jetty portion is a rectangular shape having four sides and each side continuously extends along each edge of the substrate in parallel. A foreign object generated when dicing process is performed, is prevented from attaching onto the actuator element and the electrode pad because close adhesion of a protecting tape is improved by the jetty portion.Type: ApplicationFiled: February 28, 2005Publication date: December 6, 2007Inventors: Kenichi Kagawa, Masami Yakabe
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Publication number: 20070246253Abstract: A through substrate which comprises a silicon substrate (10) having a through hole (19) penetrating a front surface (11) and a back surface (12), a oxidized silicon film (13) being provided along the inner wall surface of the through hole (19), layers (14, 15) comprising Zn and Cu, respectively, being formed on the inner wall surface of the oxidized silicon film (13), and a Cu plating layer (18) which has been grown from a Cu seed layer (17) along the inner wall surface of layers (14, 15) comprising Zn and Cu, respectively, via an insulating layer (16) between them. The above through substrate can provide a through electrode capable of avoiding the noise due to the cross talk.Type: ApplicationFiled: July 5, 2005Publication date: October 25, 2007Inventors: Masami Yakabe, Kenichi Kagawa, Tomohisa Hoshino
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Publication number: 20070193358Abstract: A capacity detection type sensor element includes a rectangular vibrating plate, a flat back electrode which are provided opposedly with each other, and fixing portions which are provided adjoining to the vibrating plate, and has a predetermined length A of edge at a side adjoining to the vibrating plate. The back electrode is held by the fixing portions in a state that space is provided between the back electrode and the vibrating plate. Outer edges of the back electrode which are not held by the adjoining fixing portions, are straight lines and the straight lines define an octagonal shape as a whole.Type: ApplicationFiled: February 14, 2005Publication date: August 23, 2007Inventors: Kenichi Kagawa, Masami Yakabe, Shinichi Saeki, Takahisa Ohtsuji
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Publication number: 20060233400Abstract: A sound detecting mechanism capable of forming a diaphragm and a back electrode on a substrate by a simple process includes acoustic holes corresponding to perforations formed on a front surface of a substrate. A second protective film, a sacrificial layer and a metal film are laminated on the front surface in a portion corresponding to the acoustic holes. The substrate is etched from the back surface thereof to a depth reaching the acoustic holes to form an acoustic opening. Subsequently, by effecting an etching from the back surface of the substrate through the acoustic holes, the sacrificial layer is removed and a void area is formed between the diaphragm made of the metal film, the substrate and the formed perforations. The sacrificial layer that remains after the etching is used as a spacer for maintaining a gap between the back electrodes and the diaphragm.Type: ApplicationFiled: July 14, 2004Publication date: October 19, 2006Applicants: HOSIDEN CORPORATION, TOKYO ELECTRON LIMITEDInventors: Yoshiaki Ohbayashi, Mamoru Yasuda, Shinichi Saeki, Masatsugu Komai, Kenichi Kagawa
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Publication number: 20060145570Abstract: A sound detecting mechanism is provided which forms a diaphragm with a required thickness by thickness control and yet restrains distortion of the diaphragm to provide high sensitivity. The sound detecting mechanism comprises a pair of electrodes forming a capacitor on a substrate A in which one of the electrodes is a back electrode C forming perforations Ca therein corresponding to acoustic holes and the other of the electrodes is a diaphragm B. The diaphragm B is mounted on the substrate A while the back electrode C is mounted in a position opposed to the diaphragm B across a void F to be supported by the substrate A, the back electrode C being formed by polycrystal silicon of 5 ?m to 20 ?m in thickness.Type: ApplicationFiled: May 25, 2004Publication date: July 6, 2006Applicants: Hoisden Corporation, Tokyo Electron LimitedInventors: Yoshiaki Ohbayashi, Mamoru Yasuda, Shinichi Saeki, Masatsugu Komai, Kenichi Kagawa
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Publication number: 20060050905Abstract: A sound detecting mechanism is provided which forms a diaphragm with a required thickness and yet restraining distortion of the diaphragm to provide high sensitivity. The sound detecting mechanism comprises a pair of electrodes forming a capacitor on a substrate A in which one of the electrodes is a back electrode C forming perforations Ca therein corresponding to acoustic holes and the other of the electrodes is a diaphragm B. A silicon nitride film 303 is provided on the side adjacent a base of the substrate A with respect to a membrane acting as the diaphragm B formed on the substrate A.Type: ApplicationFiled: May 25, 2004Publication date: March 9, 2006Applicants: HOSIDEN CORPORATION, TOKYO ELECTRON LIMITEDInventors: Yoshiaki Ohbayashi, Mamoru Yasuda, Shinichi Saeki, Masatsugu Komai, Kenichi Kagawa
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Patent number: 5388091Abstract: A communications system includes an electronic control apparatus having an asynchronous serial communications function and a test apparatus for checking the operation of the electronic control apparatus. The test apparatuses using different communications modes can be connected to a single electronic control apparatus. The test apparatus includes an identification signal generator for generating an identification signal identifying the full or half duplex communications mode of the specific test apparatus. The electronic control apparatus has both full and half duplex communications arrangements. Either the full or half duplex communications arrangement is selected according to the identification signal received from the test apparatus.Type: GrantFiled: April 13, 1993Date of Patent: February 7, 1995Assignee: Sumitomo Electric Industries, Ltd.Inventor: Kenichi Kagawa
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Patent number: 4765349Abstract: A system for controlling the lamina size, in a material treatment process for tobacco leaves. The system comprises measuring means for measuring the production ratio of the lamina larger than a given size in the raw material treatment process in which the tobacco leaves which have been provided with a water content and temperature by a humidity controller are stripped into laminae and ribs by means of rib removing machines capable of changing a mechanical impact force applied upon the tobacco leaves by changing the rotational speed of grid or threshing gear and are then separated by means of separating machines; and operational control means for receiving measurement signals from said measuring means as a feedback signal for searching a rotational speed of grid or threshing gear which provides an optimum lamina size by a hill-climb method using the rotational speed of grid or threshing gear of the rib removing machines as manipulation factor.Type: GrantFiled: October 27, 1986Date of Patent: August 23, 1988Assignee: Japan Tobacco & Salt Public CorporationInventor: Kenichi Kagawa
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Patent number: 4723560Abstract: A system for controlling the lamina size in a raw material treatment process for tobacco leaves comprising measuring means for measuring the production rate of the laminae larger than a given size in the raw material treatment process in which the tobacco leaves which have been provided with a water content and temperature by a humidity controller are stripped into laminae and ribs by means of rib removing machines capable of changing a mechanical impact force applied upon the tobacco leaves by changing the rotational number of grid or threshing gear and are then separated by means of separating machines, and operational control means for receiving measurement signals from said measuring means as a feedback signal for searching a water content, temperature and rotational number of grid or threshing gear which minimize the production rate of the laminae not larger than a given size by a hill-climb method using the water content and temperature provided by the humidity controller and the rotational number of grType: GrantFiled: July 20, 1984Date of Patent: February 9, 1988Assignee: The Japan Tobacco & Salt Public Corp.Inventor: Kenichi Kagawa
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Patent number: 4709708Abstract: A system for controlling the water content and temperature of tobacco leaves in a humidity controller is provided.Type: GrantFiled: July 12, 1984Date of Patent: December 1, 1987Assignee: The Japan Tobacco & Salt Public CorporationInventor: Kenichi Kagawa
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Patent number: 4641265Abstract: A new system for controlling the proportion of leaf vein in a tobacco raw material treating process is provided. In general, the process involves feeding a raw leaf tobacco to a humidity controller to impart thereto moisture and temperature necessary for the removal of leaf vein, then peeling off the leaf tobacco into lamina and leaf vein by leaf vein removing means and subsequently separating the lamina and leaf vein from each other by winnowing means.Type: GrantFiled: July 27, 1984Date of Patent: February 3, 1987Assignee: Japan Tobacco Inc.Inventor: Kenichi Kagawa