Patents by Inventor Kenichi Kawabata

Kenichi Kawabata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9907179
    Abstract: Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a magnetic mold resin formed of a composite magnetic material including a thermosetting resin material and a magnetic filler, the magnetic mold resin covering the surface of the substrate so as to embed therein the electronic component; and a metal film connected to the power supply pattern and covering at least a top surface of the magnetic mold resin. A volume resistance value of the magnetic mold resin is equal to or larger than 1010?, and a resistance value at an interface between the top surface of the magnetic mold resin and the metal film is equal to or larger than 106?.
    Type: Grant
    Filed: April 25, 2016
    Date of Patent: February 27, 2018
    Assignee: TDK CORPORATION
    Inventor: Kenichi Kawabata
  • Publication number: 20180033738
    Abstract: Disclosed herein is an electronic circuit package includes a substrate having a power supply pattern, a first electronic component mounted on a first region of a front surface of the substrate, a mold resin that covers the front surface of the substrate so as to embed the first electronic component therein, and a laminated film covering an upper surface of the mold resin, the laminated film including a magnetic film and a first metal film. The first metal film is connected to the power supply pattern. The magnetic film is selectively thick on the first region.
    Type: Application
    Filed: July 5, 2017
    Publication date: February 1, 2018
    Applicant: TDK Corporation
    Inventors: Kenichi KAWABATA, Toshio Hayakawa, Toshiro Okubo
  • Patent number: 9881877
    Abstract: Disclosed herein is an electronic circuit package includes a substrate, an electronic component mounted on a surface of the substrate, and a magnetic mold resin covering the surface of the substrate so as to embed therein the electronic component. The magnetic mold resin includes a resin material and a filler blended in the resin material in a blended ratio of 30 vol. % or more to 85 vol. % or less. The filler includes a magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material contained mainly of Ni, thereby a thermal expansion coefficient of the magnetic mold resin is 15 ppm/° C. or less.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: January 30, 2018
    Assignee: TDK CORPORATION
    Inventor: Kenichi Kawabata
  • Publication number: 20180019042
    Abstract: Disclosed herein is a composite magnetic sealing material includes a resin material and a filler blended in the resin material in a blended ratio of 30 vol. % or more to 85 vol. % or less. The filler includes a magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material contained mainly of Ni, thereby a thermal expansion coefficient of the composite magnetic sealing material is 15 ppm/° C. or less.
    Type: Application
    Filed: September 27, 2017
    Publication date: January 18, 2018
    Applicant: TDK Corporation
    Inventor: KENICHI KAWABATA
  • Patent number: 9818518
    Abstract: Disclosed herein is a composite magnetic sealing material includes a resin material and a filler blended in the resin material in a blended ratio of 30 vol. % or more to 85 vol. % or less. The filler includes a magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material contained mainly of Ni, thereby a thermal expansion coefficient of the composite magnetic sealing material is 15 ppm/° C. or less.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: November 14, 2017
    Assignee: TDK CORPORATION
    Inventor: Kenichi Kawabata
  • Publication number: 20170311448
    Abstract: Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a magnetic mold resin formed of a composite magnetic material including a thermosetting resin material and a magnetic filler, the magnetic mold resin covering the surface of the substrate so as to embed therein the electronic component; and a metal film connected to the power supply pattern and covering at least a top surface of the magnetic mold resin. A volume resistance value of the magnetic mold resin is equal to or larger than 1010?, and a resistance value at an interface between the top surface of the magnetic mold resin and the metal film is equal to or larger than 106?.
    Type: Application
    Filed: April 25, 2016
    Publication date: October 26, 2017
    Applicant: TDK Corporation
    Inventor: Kenichi KAWABATA
  • Publication number: 20170309576
    Abstract: Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a mold resin covering the surface of the substrate so as to embed therein the electronic component; a magnetic film formed of a composite magnetic material obtained by dispersing magnetic fillers in a thermosetting resin material, the magnetic film covering upper and side surfaces of the molding resin and an edge portion of the front surface exposed to aside surface of the substrate; and a metal film connected to the power supply pattern and covering the molding resin through the magnetic film.
    Type: Application
    Filed: March 21, 2017
    Publication date: October 26, 2017
    Applicant: TDK Corporation
    Inventors: Kenichi KAWABATA, Toshio HAYAKAWA, Toshiro OKUBO
  • Publication number: 20170301628
    Abstract: Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a mold resin covering the surface of the substrate so as to embed therein the electronic component; a laminated structure of a magnetic film and a metal film, the laminated structure covering at least an upper surface of the molding resin. The metal film is connected to the power supply pattern, and a resistance value at an interface between the magnetic film and the metal film is equal to or larger than 106?.
    Type: Application
    Filed: March 21, 2017
    Publication date: October 19, 2017
    Applicant: TDK Corporation
    Inventors: Kenichi KAWABATA, Toshio HAYAKAWA, Toshiro OKUBO
  • Publication number: 20170294387
    Abstract: Disclosed herein is an electronic circuit package includes a substrate having a power supply pattern, a first electronic component mounted on a first region of a front surface of the substrate, a mold resin that covers the front surface of the substrate so as to embed the first electronic component therein and has a concave portion above the first region, a magnetic film selectively provided in the concave portion, and a first metal film that is connected to the power supply pattern and covers the mold resin.
    Type: Application
    Filed: December 16, 2016
    Publication date: October 12, 2017
    Applicant: TDK Corporation
    Inventors: Kenichi KAWABATA, Toshio HAYAKAWA, Toshiro OKUBO
  • Publication number: 20170287848
    Abstract: Disclosed herein is an electronic circuit package includes a substrate, an electronic component mounted on a surface of the substrate, and a magnetic mold resin covering the surface of the substrate so as to embed therein the electronic component. The magnetic mold resin includes a resin material and a filler blended in the resin material in a blended ratio of 30 vol. % or more to 85 vol. % or less. The filler includes a magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material contained mainly of Ni, thereby a thermal expansion coefficient of the magnetic mold resin is 15 ppm/° C. or less.
    Type: Application
    Filed: November 16, 2016
    Publication date: October 5, 2017
    Applicant: TDK Corporation
    Inventor: KENICHI KAWABATA
  • Publication number: 20170287604
    Abstract: Disclosed herein is a composite magnetic sealing material includes a resin material and a filler blended in the resin material in a blended ratio of 30 vol. % or more to 85 vol. % or less. The filler includes a magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material contained mainly of Ni, thereby a thermal expansion coefficient of the composite magnetic sealing material is 15 ppm/° C. or less.
    Type: Application
    Filed: November 15, 2016
    Publication date: October 5, 2017
    Applicant: TDK Corporation
    Inventor: KENICHI KAWABATA
  • Publication number: 20170278804
    Abstract: Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a mold resin covering the surface of the substrate so as to embed therein the electronic component; a magnetic film formed so as to contact at least a top surface of the mold resin; and a metal film electrically connected to the power supply pattern and covering the mold resin through the magnetic film.
    Type: Application
    Filed: November 15, 2016
    Publication date: September 28, 2017
    Applicant: TDK Corporation
    Inventors: KENICHI KAWABATA, Toshio HAYAKAWA, Toshiro OKUBO
  • Patent number: 9472428
    Abstract: A manufacturing method of electronic module components according to the present invention includes: forming a plurality of module components on a principal surface of a substrate; forming a groove by dicing between the module components; spraying a conductive paste toward the principal surface of the substrate; and separating the module components. The spraying is performed so that an angle formed between a spray direction and the principal surface is an angle ?. The angle ? is set so as to satisfy the following expression (1), assuming that a depth of the groove is D and a width of the groove is w.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: October 18, 2016
    Assignee: TDK CORPORATION
    Inventors: Kenichi Kawabata, Seiko Komatsu
  • Patent number: 9439288
    Abstract: An electronic module is provided with a circuit board 2, a chip component 3 surface-mounted on the circuit board 2 and a mold member 4 that seals the chip component 3. The circuit board 2 includes a land 7 and a resist pattern 8A that partially covers the land 7. The chip component 3 has a bottom electrode 6b and a side electrode 6c. The resist pattern 8A has an overlapped portion overlapped with the bottom electrode 6b of the chip component 3 in a planar view. A portion of the mold member 4 is filled at least in a first gap D1 between the resist pattern 8A and the first solder portion 10a.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: September 6, 2016
    Assignee: TDK Corporation
    Inventors: Shuichi Takizawa, Kenichi Kawabata
  • Patent number: 9386697
    Abstract: A wiring board or an electronic component embedded substrate includes a substrate that includes a resin containing a plurality of fillers; and a via that is electrically connected to at least one interconnect provided to the substrate, wherein the via includes a mix area in which metal is provided between the fillers on an inner radial side with respect to the substrate. A method of manufacturing a wiring board or an electronic component embedded substrate includes preparing a substrate that includes a resin containing a plurality of fillers; forming a via formation hole in the substrate; performing an ashing process on at least an inner wall of the via formation hole; and performing electroless plating on the inner wall of the via formation hole.
    Type: Grant
    Filed: June 12, 2014
    Date of Patent: July 5, 2016
    Assignee: TDK CORPORATION
    Inventors: Hiroyuki Uematsu, Kenichi Kawabata
  • Patent number: 9381595
    Abstract: A Pb-free solder includes a first metal including at least Sn and Bi, and a second metal including at least an Ni—Fe alloy. In the first metal, the sum of Sn and Bi is 90 mass % or more, and a ratio of Bi is 5 to 15 mass %. A ratio of the second metal to the sum of mass of the first metal and mass of the second metal is 5 to 30 mass %.
    Type: Grant
    Filed: October 27, 2015
    Date of Patent: July 5, 2016
    Assignee: TDK CORPORATION
    Inventors: Tsutomu Yasui, Kenichi Kawabata
  • Publication number: 20160121434
    Abstract: A Pb-free solder includes a first metal including at least Sn and Bi, and a second metal including at least an Ni—Fe alloy. In the first metal, the sum of Sn and Bi is 90 mass % or more, and a ratio of Bi is 5 to 15 mass %.
    Type: Application
    Filed: October 27, 2015
    Publication date: May 5, 2016
    Inventors: Tsutomu YASUI, Kenichi KAWABATA
  • Publication number: 20160128196
    Abstract: An electronic circuit module component includes: an electronic component; a circuit board including the electronic component mounted thereon; and a bonding metal disposed between a terminal electrode of the electronic component and a terminal electrode of the circuit board, and including Sn alloy phases, an Ni—Sn alloy phase that disperses and forms between the Sn alloy phases and includes at least Fe, and a plurality of holes that is formed inside the Ni—Sn alloy phase and has a diameter of 5 ?m or less. A center distance between the holes adjacent to each other is 10 ?m or more.
    Type: Application
    Filed: October 27, 2015
    Publication date: May 5, 2016
    Inventors: Tsutomu YASUI, Kenichi KAWABATA
  • Patent number: 9258905
    Abstract: A first solder is lead-free solder that contains no lead (Pb). The first solder includes a first metal that contains at least Sn; and a second metal that contains at least a Ni—Fe alloy. An electronic component built-in module may include an electronic component and a substrate on which the electronic component is installed, where a terminal of the electronic component and a terminal of the substrate are joined together by using the lead-free solder.
    Type: Grant
    Filed: January 13, 2011
    Date of Patent: February 9, 2016
    Assignee: TDK CORPORATION
    Inventors: Tsutomu Yasui, Hisayuki Abe, Kenichi Kawabata, Tomoko Kitamura
  • Publication number: 20160008930
    Abstract: First solder is lead-free solder that contains no lead (Pb). The first solder includes a first metal that contains at least Sn; and a second metal that contains at least a Ni—Fe alloy.
    Type: Application
    Filed: September 23, 2015
    Publication date: January 14, 2016
    Applicant: TDK Corporation
    Inventors: Tsutomu YASUI, Hisayuki ABE, Kenichi KAWABATA, Tomoko KITAMURA