Abstract: To provide an anticancer agent for preventing and/or treating cancer, comprising a tankyrase inhibitor containing a tankyrase inhibitory compound and a microtubule inhibitor containing a microtubule inhibitory compound as active ingredients.

Abstract: A straddle vehicle includes a front fork unit provided to be inclined rearwardly, a front cover provided forwardly of the front fork unit, and having a rear cover member, and a front cover member separately provided from the front cover member and positioned forwardly of the rear cover member, a headlamp provided at the front cover, a holder attached to the rear cover member and holds the headlamp, and a driver that drives the headlamp. The driver stored in the front cover such that the driver is located at a position farther upward than the headlamp, farther rearward than a first virtual line extending in a up-and-down direction through a rear end of the headlamp in a front-to-rear direction of the vehicle, and farther rearward than a second virtual line extending in parallel with an axis of the front fork unit in the side view of the vehicle.

Abstract: A wire type window regulator includes a guide rail, a wire driving mechanism, and a wire guide member. The guide rail guides a slider base to freely move up and down. A window glass is fixed to the slider base. The wire driving mechanism moves the slider base up/down along the guide rail via a drive wire. The wire guide member is disposed on at least one of an upper end and a lower end of the guide rail. The wire guide member changes a routing direction of the drive wire wound around the wire guide member. The wire guide member supports a fixing member that is inserted through the guide rail and that fixes the guide rail and the wire guide member to the vehicle door panel.

Abstract: A drive device includes a drum housing rotatably supports a drum, allows an outer tube end to be inserted into an outer tube connecting portion and allows a wire to pass through a wire passage portion, and a drive member rotates the drum. An anti-deflection portion limits deflection of the wire and is formed on the drum housing/drive member. The anti-deflection portion includes a range surrounded by a line connecting one end of the formation range of the spiral groove and one end of the formation range of the insertion hole at the outer tube end connected to the outer tube connecting portion and a line connecting the other end of the spiral groove formation range and the other end of the insertion hole formation range at the end of the outer tube connected to the outer tube connecting portion, in the rotational axis direction of the drum.

Abstract: The vehicle component fastening structure includes: a boss receptacle and a boss provided in a pair of the vehicle components, and a fastening member for fastening the boss and the boss receptacle. The boss receptacle has a through-hole penetrating in a fastening axis direction and a nipped portion provided inside the through-hole. The boss has a fastener hole, and a leading end of the boss oriented to a first direction abuts on the nipped portion. The fastening member has a shank inserted into the through-hole and the fastener hole in a second direction and a head abutting on the nipped portion. In the fastened state, a bottom face of the head abuts on the nipped portion, and the entire bottom face and a portion of the nipped portion where the leading end of the boss abuts are placed within a range of the through-hole in the fastening axis direction.

Abstract: The method includes a step of fixing the other end of the drive wire to the drive drum; a step of temporarily placing one end of the drive wire in a temporary placement portion provided on the drum housing; and a step of applying tension to the drive wire by moving the one end of the drive wire to an engaging portion provided on the drive drum after canceling the placed state of the one end of the drive wire in the temporary placement portion by pulling a portion of the drive wire on the one end side thereof by winding a portion of the drive wire on the other end side thereof by the drive drum with the one end of the drive wire placed in the temporary placement portion.

Abstract: According to one embodiment, an optical element is provided with a paraelectric crystal, first and second pressers between which the paraelectric crystal is sandwiched, and fasteners. The paraelectric crystal has a periodic structure in which polarities are periodically inverted along a polarity period direction. The fasteners fix the first and second pressers to each other so that a predetermined pressure is applied in a direction intersecting with the polarity period direction, to the paraelectric crystal through the first and second pressers.

Abstract: A laser processing method which can prevent an object to be processed from being cut along a line to cut from a modified region acting as a cutting start point when separating a suction table and a holding member from each other is provided. An expandable tape 23 holding an object to be processed 1 while being stuck to a frame 51 is secured by suction onto a suction table 52 of a vacuum chuck with a porous sheet 53 interposed therebetween. Since the sheet 53 has a Young's modulus lower than that of the table 52, the tape 23 is restrained from biting into fine pores of the sheet 53. As a consequence, even when the table 52 and tape 23 are separated from each other by releasing the suction securing after forming a modified region 7, no strong bending stress acts on the object 1. This can prevent the object 1 from being cut along a line to cut from the modified region 7 acting as a cutting start point when separating the table 52 and tape 23 from each other.

Abstract: An object to be processed 1 comprising a substrate 4 and a plurality of functional devices 15 formed on a front face 3 of the substrate 4 is irradiated with laser light L while locating a converging point P within the substrate 4, so as to form at least one row of a divided modified region 72, at least one row of a quality modified region 71 positioned between the divided modified region 72 and the front face 3 of the substrate 4, and at least one row of an HC modified region 73 positioned between the divided modified region 72 and a rear face 21 of the substrate 4 for one line to cut 5. Here, in a direction along the line to cut, a forming density of the divided modified region 72 is made lower than that of the quality modified region 71 and that of the HC modified region 73.

Abstract: A laser processing method which can accurately cut an object to be processed along a line to cut is provided. A modified region 7 formed by multiphoton absorption forms a cutting start region 8 within an object to be processed 1 along a line to cut 5. Thereafter, the object 1 is irradiated with laser light L2 absorbable by the object 1 along the line to cut 5, so as to generate fractures 24 from the cutting start region 8 acting as a start point, whereby the object 1 can accurately be cut along the line to cut 5. Expanding an expandable film 19 having the object 1 secured thereto separates individual chips 25 from each other, which can further improve the reliability in cutting the object 1 along the line to cut 5.

Abstract: A laser processing method for preventing particles from occurring from cut sections of chips obtained by cutting a silicon wafer is provided. An irradiation condition of laser light L for forming modified regions 77 to 712 is made different from an irradiation condition of laser light L for forming the modified regions 713 to 719 such as to correct the spherical aberration of laser light L in areas where the depth from the front face 3 of a silicon wafer 11 is 335 ?m to 525 ?m. Therefore, even when the silicon wafer 11 and a functional device layer 16 are cut into semiconductor chips from modified regions 71 to 719 acting as a cutting start point, twist hackles do not appear remarkably in the areas where the depth is 335 ?m to 525 ?m, whereby particles are hard to occur.

Abstract: A laser processing apparatus comprises a converging lens 31 for converging processing laser light and rangefinding laser light L2 toward a wafer 1, an actuator for actuating the lens 31, a shaping optical system 49 for adding astigmatism to reflected light L3 of the rangefinding laser light, a quadrant photodiode 42 for receiving the reflected light L3 and outputting voltage values corresponding to its light quantities, and a controller for regulating the actuator, and positions a converging point P2 of the rangefinding laser light L2 between a focal point P0 of the lens and the lens 31, so as to make it possible to form a modified region at a position deeper from the front face 3, thereby suppressing adverse effects due to the reflected light L3. The control is based on an arithmetic value subjected to a division by a sum of the voltage values, so as to prevent the arithmetic value from being changed by the quantity of reflected light.

Abstract: A wavelength conversion element is provided as one including a monocrystalline nonlinear optical crystal. The nonlinear optical crystal has: a plurality of first regions having a polarity direction along a predetermined direction; a plurality of second regions having a polarity direction opposite to the predetermined direction; an entrance face into which a fundamental incident wave having a wavelength ? and a frequency ? is incident in a direction substantially perpendicular to the predetermined direction; and an exit face from which a second harmonic with a frequency 2? generated in the crystal emerges. The plurality of first and second regions are formed as alternately arranged in a period substantially equal to d expressed by a predetermined expression, between the entrance face and the exit face.

Abstract: An object to be processed 1 comprising a substrate 4 and a plurality of functional devices 15 formed on a front face 3 of the substrate 4 is irradiated with laser light L while locating a converging point P within the substrate 4, so as to form at least one row of a divided modified region 72, at least one row of a quality modified region 71 positioned between the divided modified region 72 and the front face 3 of the substrate 4, and at least one row of an HC modified region 73 positioned between the divided modified region 72 and a rear face 21 of the substrate 4 for one line to cut 5. Here, in a direction along the line to cut, a forming density of the divided modified region 72 is made lower than that of the quality modified region 71 and that of the HC modified region 73.

Abstract: A wavelength conversion element is provided as one including a monocrystalline nonlinear optical crystal. The nonlinear optical crystal has: a plurality of first regions having a polarity direction along a predetermined direction; a plurality of second regions having a polarity direction opposite to the predetermined direction; an entrance face into which a fundamental incident wave having a wavelength ? and a frequency ? is incident in a direction substantially perpendicular to the predetermined direction; and an exit face from which a second harmonic with a frequency 2? generated in the crystal emerges. The plurality of first and second regions are formed as alternately arranged in a period substantially equal to d expressed by a predetermined expression, between the entrance face and the exit face.

Abstract: An illumination optical system illuminates an irradiated surface with light supplied from a light source. The illumination optical system includes a diffractive optical element disposed in an optical path of linearly polarized light supplied from the light source. The diffractive optical element forms a multipole illumination field. including a plurality of illumination fields. The illumination optical system also includes an optical integrator that forms a multipole light source including a plurality of planar light sources with light that has passed through the multipole illumination field. The illumination optical system also includes a polarization optical member disposed in an illumination optical path and that sets a polarization direction of light that has passed through the multipole light source to a predetermined polarization direction.

Abstract: A wavelength conversion element is provided as one including a monocrystalline nonlinear optical crystal. The nonlinear optical crystal has: a plurality of first regions having a polarity direction along a predetermined direction; a plurality of second regions having a polarity direction opposite to the predetermined direction; an entrance face into which a fundamental incident wave having a wavelength ? and a frequency ? is incident in a direction substantially perpendicular to the predetermined direction; and an exit face from which a second harmonic with a frequency 2? generated in the crystal emerges. The plurality of first and second regions are formed as alternately arranged in a period substantially equal to d expressed by a predetermined expression, between the entrance face and the exit face.

Abstract: A laser processing method which can accurately cut an object to be processed along a line to cut is provided. A modified region 7 formed by multiphoton absorption forms a cutting start region 8 within an object to be processed 1 along a line 5 along which the object is intended to be cut. Thereafter, the object 1 is irradiated with laser light L2 transmittable through an unmodified region of the object 1, so as to generate fractures 24 from the cutting start region 8 acting as a start point, whereby the object 1 can accurately be cut along the line 5 along which the object is intended to be cut. Expanding an expandable film 19 having the object 1 secured thereto separates individual chips 25 from each other, which can further improve the reliability in cutting the object 1 along the line 5 along which the object is intended to be cut.

Abstract: A laser processing method for preventing particles from occurring from cut sections of chips obtained by cutting a silicon wafer is provided. An irradiation condition of laser light L for forming modified regions 77 to 712 is made different from an irradiation condition of laser light L for forming the modified regions 713 to 719 such as to correct the spherical aberration of laser light L in areas where the depth from the front face 3 of a silicon wafer 11 is 335 ?m to 525 ?m. Therefore, even when the silicon wafer 11 and a functional device layer 16 are cut into semiconductor chips from modified regions 71 to 719 acting as a cutting start point, twist hackles do not appear remarkably in the areas where the depth is 335 ?m to 525 ?m, whereby particles are hard to occur.

Abstract: A laser processing method for preventing particles from occurring from cut sections of chips obtained by cutting a silicon wafer is provided. An irradiation condition of laser light L for forming modified regions 77 to 712 is made different from an irradiation condition of laser light L for forming the modified regions 713 to 719 such as to correct the spherical aberration of laser light L in areas where the depth from the front face 3 of a silicon wafer 11 is 335 ?m to 525 ?m. Therefore, even when the silicon wafer 11 and a functional device layer 16 are cut into semiconductor chips from modified regions 71 to 719 acting as a cutting start point, twist hackles do not appear remarkably in the areas where the depth is 335 ?m to 525 ?m, whereby particles are hard to occur.