Patents by Inventor Kenichi Yoshida

Kenichi Yoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10958232
    Abstract: Disclosed herein is an LC filter that includes a conductive substrate, a first capacitive insulating film having one surface covered with the conductive substrate and other surface covered with a first capacitive electrode, a first inductor pattern having one end connected to the first capacitive electrode, a first terminal electrode connected to other end of the first inductor pattern, and a common terminal electrode connected to the conductive substrate.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: March 23, 2021
    Assignee: TDK CORPORATION
    Inventors: Eiko Wakata, Kenichi Yoshida
  • Patent number: 10950389
    Abstract: A thin-film capacitor satisfies a relationship of CTE1>CTE2>CTE3 regarding a linear expansion coefficient CTE1 of a base, a linear expansion coefficient CTE2 of a capacitance unit, and a linear expansion coefficient CTE3 of a barrier layer. The inventors have newly found that in a case in which such a relationship is satisfied, when a temperature falls from a deposition temperature, cracking occurring in the capacitance unit of the thin-film capacitor is prevented, and cracking occurring in the barrier layer is also prevented.
    Type: Grant
    Filed: March 21, 2019
    Date of Patent: March 16, 2021
    Assignee: TDK CORPORATION
    Inventors: Daiki Ishii, Kazuhiro Yoshikawa, Koichi Tsunoda, Mitsuhiro Tomikawa, Junki Nakamoto, Kenichi Yoshida
  • Publication number: 20210057296
    Abstract: In an electric component embedded structure, a first electrode terminal provided on a first main surface includes an intra-area terminal, and the intra-area terminal is electrically connected to an overlap portion of an overlap wiring in a formation area of an electric component. Accordingly, a decrease in mounting area of the electric component embedded structure is achieved. The intra-area terminal can be electrically connected to a second electrode terminal provided on a second main surface via a first via-conductor, the overlap wiring, and a second via-conductor. The intra-area terminal is connected to a wiring (an overlap wiring) of a first insulating layer without additionally providing a rewiring layer causing an increase in thickness, and the increase in thickness is curbed, whereby a decrease in size of the electric component embedded structure is achieved.
    Type: Application
    Filed: October 25, 2018
    Publication date: February 25, 2021
    Applicant: TDK CORPORATION
    Inventors: Takaaki MORITA, Kenichi YOSHIDA, Mitsuhiro TOMIKAWA
  • Publication number: 20210006762
    Abstract: An object of one embodiment of the present disclosure is to provide a product with a high added value to a user by preventing an unnatural character string from being combined, combination of no character string, and the like in a case where there is no voice or almost no voice before or after an image selected from within a moving image. One embodiment of the present disclosure is an image processing apparatus including: a selection unit configured to select, from a moving image including a plurality of frames, a part of the moving image; an extraction unit configured to extract a voice during a predetermined time corresponding to the selected part in the moving image; and a combination unit configured to combine a character string based on a voice extracted by the extraction unit, with the part of the moving image selected by the selection unit.
    Type: Application
    Filed: June 30, 2020
    Publication date: January 7, 2021
    Inventors: Daiki Kadomatsu, Kosei Tanaka, Gou Sasaki, Hirokazu Kameda, Chisei Sumita, Takeshi Nakamura, Ken Hoshino, Hiroaki Hasegawa, Kenichi Yoshida
  • Publication number: 20210006747
    Abstract: An object of one embodiment of the present disclosure is to provide a product with a high added value to a user by preventing an erroneous character string from being combined in a case where a voice before and after an image selected from within a moving image is a mixed voice. One embodiment of the present disclosure is an image processing apparatus including: a selection unit configured to select, from a moving image including a plurality of frames, a part of the moving image; an extraction unit configured to extract a voice during a predetermined time corresponding to the selected part in the moving image; and a combination unit configured to combine a character string based on a voice extracted by the extraction unit, with the part of the moving image selected by the selection unit or a frame among frames corresponding to the part.
    Type: Application
    Filed: June 30, 2020
    Publication date: January 7, 2021
    Inventors: Daiki Kadomatsu, Kosei Tanaka, Gou Sasaki, Hirokazu Kameda, Chisei Sumita, Takeshi Nakamura, Ken Hoshino, Hiroaki Hasegawa, Kenichi Yoshida
  • Patent number: 10886219
    Abstract: An electronic component mounting package includes a semiconductor element which is disposed such that an active surface faces a main surface of a wiring portion, and which is electrically connected to the wiring portion via a first terminal; and a thin film passive element which is disposed between the active surface of the semiconductor element and the main surface of the wiring portion when seen in a lamination direction, and which is electrically connected to the semiconductor element. A part of the first terminal is disposed on an outer side with respect to the thin film passive element in a plan view. A length of the first terminal in the lamination direction disposed on the outer side with respect to the thin film passive element is larger than a thickness of the thin film passive element in the lamination direction.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: January 5, 2021
    Assignee: TDK CORPORATION
    Inventors: Kazuhiro Yoshikawa, Mitsuhiro Tomikawa, Kenichi Yoshida
  • Publication number: 20200386795
    Abstract: A semiconductor component 150 has a semiconductor layer 1 including a winding wire part 10 and a winding return wire part 50 connected at a terminal end part of the winding wire part 10 and returning from the terminal end part toward a starting end part side, wherein the semiconductor component is disposed so as to surround an object to be measured.
    Type: Application
    Filed: November 24, 2017
    Publication date: December 10, 2020
    Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Kenichi SUZUKI, Kazuyuki SASHIDA, Mizue YAMAJI, Kenichi YOSHIDA, Shinji KUNORI
  • Publication number: 20200387764
    Abstract: In a system, mobile terminal and a reader are communicable with each other. In the mobile terminal, a terminal tilt state is detected by a detecting unit as a terminal environmental state, an information code is generated such that the detected terminal environmental state and predetermined information are recorded in the information code, and the generated information code is displayed on the screen of a display unit. In the reader, a reading surface tilt state corresponding to the terminal environmental state is detected by a detecting unit as a reading surface environmental state. When the reader reads the information code and the detected reading surface environmental state and the detected terminal environmental state show the same environmental state, the read predetermined information is used by a control unit to perform processing based on the predetermined information.
    Type: Application
    Filed: September 4, 2018
    Publication date: December 10, 2020
    Applicant: DENSO WAVE INCORPORATED
    Inventors: Ryo OZAWA, Kenichi YOSHIDA
  • Publication number: 20200371137
    Abstract: A detection substrate 150 has a body film 1a having a through hole 91; a winding wire part 10 provided on a surface of one side of the body film 1a, on a surface of another side of the body film 1a and in the through hole 91, and disposed so as to surround a current to be detected; and a winding return wire part 50, provided on the body film 1a, connected at a terminal end part of the winding wire part 10 and returning from the terminal end part toward a starting end part side.
    Type: Application
    Filed: November 24, 2017
    Publication date: November 26, 2020
    Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Kazuyuki SASHIDA, Kenichi SUZUKI, Mizue YAMAJI, Kenichi YOSHIDA, Shinji KUNORI
  • Publication number: 20200373379
    Abstract: A semiconductor device 100 has a first electrode 61; a second electrode 62; and a semiconductor layer 1 including a first winding wire part 10 provided so as to surround a current flowing between the first electrode 61 and the second electrode 62, and a second winding wire part 50 connected to a terminal end part of the first winding wire part 10 and returning from the terminal end part toward a starting end part side of the first winding wire part 10.
    Type: Application
    Filed: November 24, 2017
    Publication date: November 26, 2020
    Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Kazuyuki SASHIDA, Mizue YAMAJI, Kenichi YOSHIDA, Kenichi SUZUKI, Shinji KUNORI
  • Patent number: 10813220
    Abstract: An electronic component embedded substrate includes: a substrate that includes an insulating layer and has a first principal surface and a second principal surface; an electronic component that is embedded in the substrate and has at least one first terminal, at least one second terminal, and a capacity part; at least one via conductor that are formed in the insulating layer and electrically connected to the second terminal; and an adhesion layer that is in contact with the second terminal on an end face of the second terminal which are close to the second principal surface. The electronic component is laminated with the insulating layer, and adhesion strength between the adhesion layer and the insulating layer is higher than that between the second terminal and the insulating layer.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: October 20, 2020
    Assignee: TDK CORPORATION
    Inventors: Mitsuhiro Tomikawa, Koichi Tsunoda, Kazuhiro Yoshikawa, Kenichi Yoshida
  • Patent number: 10752183
    Abstract: A laminated composite interior part includes a first member made of synthetic resin and having a mating surface; and a second member made of elastically deformable synthetic resin and having a plate portion substantially parallel to the mating surface. The plate portion has integrally-formed and interspersed protrusions protruding toward the mating surface. The second member is placed on the first member with distal end portions of the protrusions being in contact with the mating surface. Cushioning properties are provided by elastic deformation of the protrusions, caused as the protrusions' distal end portions are relatively pressed against the mating surface. Flexural rigidity of each of the protrusions against a compressive load is anisotropic about its axis, so that the protrusion is flexurally deformed in one direction about its axis with the distal end portion thereof sliding on the mating surface. Surface roughness of the mating surface is less than 0.20.
    Type: Grant
    Filed: August 6, 2015
    Date of Patent: August 25, 2020
    Assignee: Toyoda Iron Works Co., Ltd.
    Inventors: Osamu Miyashita, Kenichi Yoshida, Kenji Onuma, Takeshi Taniguchi, Masamori Hirose, Hideaki Sakai
  • Publication number: 20200265256
    Abstract: A device for analyzing a worker's work state, the analysis involving generation of determination data for determining whether worker's manual work is performed in a predetermined work order. This device includes imaging and setting units. The imaging unit images, a work video, a worker's manual working state in which the worker repeatedly performs predetermined work. This predetermined work is performed by repeating a plurality of fundamental work operations by hand. Based on a predetermined motion which is previously set for each of the fundamental work operations, the setting unit sets delimitation information to delimit the work video every fundamental work operation at a timing when the predetermined motion is detected. In the device, a generation unit generates determination data which includes both the imaged work video and the set delimitation information. Based on the determination data, the worker's manual work can be analyzed in various ways.
    Type: Application
    Filed: February 14, 2020
    Publication date: August 20, 2020
    Applicant: DENSO WAVE INCORPORATED
    Inventors: Ryo OZAWA, Tsu RYO, Kenichi YOSHIDA, Yousuke YAMAGUCHI, Takuya SAKAI, Motoaki WATABE, Yoshiki MORIMOTO, Takuya YODA
  • Publication number: 20200258690
    Abstract: A thin-film capacitor includes an insulating base member, and a capacitance portion that is laminated on the insulating base member has a plurality of internal electrode layers which are laminated on the insulating base member and are provided in a lamination direction and dielectric layers which are sandwiched between the internal electrode layers. A relative dielectric constant of the dielectric layers is 100 or higher.
    Type: Application
    Filed: May 16, 2018
    Publication date: August 13, 2020
    Applicant: TDK Corporation
    Inventors: Koichi TSUNODA, Kazuhiro YOSHIKAWA, Mitsuhiro TOMIKAWA, Kenichi YOSHIDA
  • Patent number: 10699844
    Abstract: Disclosed herein is a thin film capacitor that includes a lower electrode layer, an upper electrode layer, and a dielectric layer positioned between the lower electrode layer and the upper electrode layer. The upper electrode layer has a first capacitive electrode part opposed to the lower electrode layer through the dielectric layer without being connected to the lower electrode layer and a fiducial mark part penetrating the dielectric layer to be connected to the lower electrode layer.
    Type: Grant
    Filed: January 6, 2020
    Date of Patent: June 30, 2020
    Assignee: TDK CORPORATION
    Inventors: Hitoshi Saita, Kazuhiro Yoshikawa, Yuuki Aburakawa, Tatsuo Namikawa, Akiyasu Iioka, Kenichi Yoshida
  • Patent number: 10672010
    Abstract: A management system includes: an information terminal that reads an information code attached to a management target, the information code storing code identification information that specifies the management target; and a server communicable with the information terminal. The information terminal includes: a reading portion that optically reads display information including the information code; a position information acquisition portion that acquires position information of the information terminal; a terminal-side transmission portion that transmits the position information as reading position information to the server; and a notification portion that notifies predetermined information.
    Type: Grant
    Filed: August 4, 2017
    Date of Patent: June 2, 2020
    Assignee: DENSO WAVE INCORPORATED
    Inventors: Kunihiko Ito, Kenichi Yoshida
  • Publication number: 20200137883
    Abstract: Disclosed herein is a thin film capacitor that includes a capacitive insulating film, a first metal film formed on one surface of the capacitive insulating film, and a second metal film formed on other surface of the capacitive insulating film and made of a metal material different from that of the first metal film. The thin film capacitor has an opening penetrating the capacitive insulating film, first metal film, and second metal film. The second metal film is thicker than the first metal film. A first size of a part of the opening that penetrates the first metal film is larger than a second size of a part of the opening that penetrates the second metal film.
    Type: Application
    Filed: October 28, 2019
    Publication date: April 30, 2020
    Inventors: Kazuhiro YOSHIKAWA, Yuuki ABURAKAWA, Tatsuo NAMIKAWA, Kenichi YOSHIDA, Hitoshi SAITA
  • Publication number: 20200043751
    Abstract: A first insulating layer, a conductor layer included on a first main surface, an electronic component included on the first main surface and a second insulating layer stacked on the first insulating layer are included, a stacking direction of the first insulating layer and the second insulating layer is the same as a stacking direction of a first electrode layer, a second electrode layer, and the dielectric layer in the electronic component, and a height position of a main surface of the electronic component on an opposite side from a side of the first main surface is different from a height position of a main surface of the conductor layer adjacent to the electronic component on an opposite side from a side of the first main surface in the stacking direction.
    Type: Application
    Filed: March 16, 2018
    Publication date: February 6, 2020
    Applicant: TDK CORPORATION
    Inventors: Mitsuhiro TOMIKAWA, Kazuhiro YOSHIKAWA, Koichi TSUNODA, Kenichi YOSHIDA
  • Publication number: 20200035410
    Abstract: Disclosed herein is an LC filter that includes a conductive substrate, a first capacitive insulating film having one surface covered with the conductive substrate and other surface covered with a first capacitive electrode, a first inductor pattern having one end connected to the first capacitive electrode, a first terminal electrode connected to other end of the first inductor pattern, and a common terminal electrode connected to the conductive substrate.
    Type: Application
    Filed: July 24, 2019
    Publication date: January 30, 2020
    Inventors: Eiko WAKATA, Kenichi YOSHIDA
  • Publication number: 20200013554
    Abstract: In a thin-film capacitor, an electrode terminal layer and an electrode layer of a capacitor portion are connected to electrode terminals by via conductors that is formed to penetrate an insulating layer in a thickness direction thereof, and a short circuit wiring in the thickness direction is realized by the via conductors. In the thin-film capacitor, an increase in the number of terminals in the plurality of electrode terminals is achieved, a decrease in length of a circuit wiring is achieved, and thus a thin-film capacitor with low-ESL has been achieved.
    Type: Application
    Filed: February 13, 2018
    Publication date: January 9, 2020
    Applicant: TDK Corporation
    Inventors: Koichi TSUNODA, Mitsuhiro TOMIKAWA, Kazuhiro YOSHIKAWA, Kenichi YOSHIDA