Patents by Inventor Kenji Alexander Sasaki

Kenji Alexander Sasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11721792
    Abstract: Light emitting devices and methods for their manufacture are provided. According to one aspect, a light emitting device is provided that comprises a substrate having a recess, and an interlayer dielectric layer located on the substrate. The interlayer dielectric layer may have a first hole and a second hole, the first hole opening over the recess of the substrate. The light emitting device may further include first and second micro LEDs, the first micro LED having a thickness greater than the second micro LED. The first micro LED and the second micro LED may be placed in the first hole and the second hole, respectively.
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: August 8, 2023
    Assignee: eLux Inc.
    Inventors: Kenji Alexander Sasaki, Paul J. Schuele, Mark Albert Crowder
  • Publication number: 20210151633
    Abstract: Light emitting devices and methods for their manufacture are provided. According to one aspect, a light emitting device is provided that comprises a substrate having a recess, and an interlayer dielectric layer located on the substrate. The interlayer dielectric layer may have a first hole and a second hole, the first hole opening over the recess of the substrate. The light emitting device may further include first and second micro LEDs, the first micro LED having a thickness greater than the second micro LED. The first micro LED and the second micro LED may be placed in the first hole and the second hole, respectively.
    Type: Application
    Filed: January 25, 2021
    Publication date: May 20, 2021
    Applicant: eLux Inc.
    Inventors: Kenji Alexander Sasaki, Paul J. Schuele, Mark Albert Crowder
  • Patent number: 10930819
    Abstract: Light emitting devices and methods for their manufacture are provided. According to one aspect, a light emitting device is provided that comprises a substrate having a recess, and an interlayer dielectric layer located on the substrate. The interlayer dielectric layer may have a first hole and a second hole, the first hole opening over the recess of the substrate. The light emitting device may further include first and second micro LEDs, the first micro LED having a thickness greater than the second micro LED. The first micro LED and the second micro LED may be placed in the first hole and the second hole, respectively.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: February 23, 2021
    Assignee: eLux Inc.
    Inventors: Kenji Alexander Sasaki, Paul J. Schuele, Mark Albert Crowder
  • Patent number: 10643870
    Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: May 5, 2020
    Assignee: eLux Inc.
    Inventors: Paul John Schuele, David Robert Heine, Mark Albert Crowder, Sean Mathew Garner, Changqing Zhan, Avinash Tukaram Shinde, Kenji Alexander Sasaki, Kurt Michael Ulmer
  • Patent number: 10431718
    Abstract: Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.
    Type: Grant
    Filed: July 2, 2018
    Date of Patent: October 1, 2019
    Assignee: eLux Inc.
    Inventors: Mark Albert Crowder, Paul J. Schuele, Changqing Zhan, Kenji Alexander Sasaki, Kurt Michael Ulmer
  • Publication number: 20190273006
    Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.
    Type: Application
    Filed: May 22, 2019
    Publication date: September 5, 2019
    Inventors: Paul John Schuele, David Robert Heine, Mark Albert Crowder, Sean Mathew Garner, Changqing Zhan, Avinash Tukaram Shinde, Kenji Alexander Sasaki, Kurt Michael Ulmer
  • Patent number: 10347513
    Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.
    Type: Grant
    Filed: January 1, 2018
    Date of Patent: July 9, 2019
    Assignee: eLux Inc.
    Inventors: Paul John Schuele, David Robert Heine, Mark Albert Crowder, Sean Mathew Garner, Changqing Zhan, Avinash Tukaram Shinde, Kenji Alexander Sasaki, Kurt Michael Ulmer
  • Publication number: 20190181304
    Abstract: Light emitting devices and methods for their manufacture are provided. According to one aspect, a light emitting device is provided that comprises a substrate having a recess, and an interlayer dielectric layer located on the substrate. The interlayer dielectric layer may have a first hole and a second hole, the first hole opening over the recess of the substrate. The light emitting device may further include first and second micro LEDs, the first micro LED having a thickness greater than the second micro LED. The first micro LED and the second micro LED may be placed in the first hole and the second hole, respectively.
    Type: Application
    Filed: February 5, 2019
    Publication date: June 13, 2019
    Inventors: Kenji Alexander Sasaki, Paul J. Schuele, Mark Albert Crowder
  • Patent number: 10230020
    Abstract: Light emitting devices and methods for their manufacture are provided. According to one aspect, a light emitting device is provided that comprises a substrate having a recess, and an interlayer dielectric layer located on the substrate. The interlayer dielectric layer may have a first hole and a second hole, the first hole opening over the recess of the substrate. The light emitting device may further include first and second micro LEDs, the first micro LED having a thickness greater than the second micro LED. The first micro LED and the second micro LED may be placed in the first hole and the second hole, respectively.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: March 12, 2019
    Assignee: eLux Inc.
    Inventors: Kenji Alexander Sasaki, Paul J. Schuele, Mark Albert Crowder
  • Publication number: 20180309023
    Abstract: Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.
    Type: Application
    Filed: July 2, 2018
    Publication date: October 25, 2018
    Inventors: Mark Albert Crowder, Paul J. Schuele, Changqing Zhan, Kenji Alexander Sasaki, Kurt Michael Ulmer
  • Patent number: 10032957
    Abstract: Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: July 24, 2018
    Assignee: eLux Inc.
    Inventors: Mark Albert Crowder, Paul J. Schuele, Changqing Zhan, Kenji Alexander Sasaki, Kurt Michael Ulmer
  • Publication number: 20180144957
    Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.
    Type: Application
    Filed: January 1, 2018
    Publication date: May 24, 2018
    Inventors: Paul John Schuele, David Robert Heine, Mark Albert Crowder, Sean Mathew Garner, Changqing Zhan, Avinash Tukaram Shinde, Kenji Alexander Sasaki, Kurt Michael Ulmer
  • Publication number: 20180076168
    Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for forming contacts during fluidic assembly.
    Type: Application
    Filed: September 13, 2016
    Publication date: March 15, 2018
    Inventors: LISA H. STECKER, KENJI ALEXANDER SASAKI, DAVID ROBERT HEINE
  • Patent number: 9892944
    Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.
    Type: Grant
    Filed: June 23, 2016
    Date of Patent: February 13, 2018
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Paul John Schuele, David Robert Heine, Mark Albert Crowder, Sean Mathew Garner, Changqing Zhan, Avinash Tukaram Shinde, Kenji Alexander Sasaki, Kurt Michael Ulmer
  • Publication number: 20180033915
    Abstract: Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.
    Type: Application
    Filed: August 21, 2017
    Publication date: February 1, 2018
    Inventors: Mark Albert Crowder, Paul J. Schuele, Changqing Zhan, Kenji Alexander Sasaki, Kurt Michael Ulmer
  • Publication number: 20170372927
    Abstract: Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.
    Type: Application
    Filed: June 23, 2016
    Publication date: December 28, 2017
    Inventors: PAUL JOHN SCHUELE, DAVID ROBERT HEINE, MARK ALBERT CROWDER, SEAN MATHEW GARNER, CHANGQING ZHAN, AVINASH TUKARAM SHINDE, KENJI ALEXANDER SASAKI, KURT MICHAEL ULMER
  • Publication number: 20170317242
    Abstract: Light emitting devices and methods for their manufacture are provided. According to one aspect, a light emitting device is provided that comprises a substrate having a recess, and an interlayer dielectric layer located on the substrate. The interlayer dielectric layer may have a first hole and a second hole, the first hole opening over the recess of the substrate. The light emitting device may further include first and second micro LEDs, the first micro LED having a thickness greater than the second micro LED. The first micro LED and the second micro LED may be placed in the first hole and the second hole, respectively.
    Type: Application
    Filed: July 14, 2017
    Publication date: November 2, 2017
    Inventors: Kenji Alexander Sasaki, Paul J. Schuele, Mark Albert Crowder
  • Patent number: 9755110
    Abstract: Embodiments are related to integrated circuit (IC) fabrication and, more particularly, to a fluidic assembly process for the placement of light emitting diodes on a direct-emission display substrate.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: September 5, 2017
    Assignee: SHARP LABORATORIES of AMERICA, INC.
    Inventors: Mark Albert Crowder, Paul J. Schuele, Changqing Zhan, Kenji Alexander Sasaki, Kurt Michael Ulmer
  • Patent number: 9722145
    Abstract: Light emitting devices and methods for their manufacture are provided. According to one aspect, a light emitting device is provided that comprises a substrate having a recess, and an interlayer dielectric layer located on the substrate. The interlayer dielectric layer may have a first hole and a second hole, the first hole opening over the recess of the substrate. The light emitting device may further include first and second micro LEDs, the first micro LED having a thickness greater than the second micro LED. The first micro LED and the second micro LED may be placed in the first hole and the second hole, respectively.
    Type: Grant
    Filed: June 24, 2015
    Date of Patent: August 1, 2017
    Assignee: SHARP LABORATORIES OF AMERICA, INC.
    Inventors: Kenji Alexander Sasaki, Paul John Schuele, Mark Albert Crowder
  • Publication number: 20160380158
    Abstract: Light emitting devices and methods for their manufacture are provided. According to one aspect, a light emitting device is provided that comprises a substrate having a recess, and an interlayer dielectric layer located on the substrate. The interlayer dielectric layer may have a first hole and a second hole, the first hole opening over the recess of the substrate. The light emitting device may further include first and second micro LEDs, the first micro LED having a thickness greater than the second micro LED. The first micro LED and the second micro LED may be placed in the first hole and the second hole, respectively.
    Type: Application
    Filed: June 24, 2015
    Publication date: December 29, 2016
    Inventors: Kenji Alexander Sasaki, Paul John Schuele, Mark Albert Crowder