Patents by Inventor Kenji Furuta
Kenji Furuta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8592717Abstract: A workpiece dividing method for dividing a workpiece having an uneven incident surface upon which a pulsed laser beam falls. The workpiece dividing method includes a coating step of applying a coating member to the incident surface of the workpiece, thereby planarizing the incident surface of the workpiece, the coating member transmitting the pulsed laser beam and having a refractive index close to that of the workpiece for the pulsed laser beam, a modified layer forming step of applying the pulsed laser beam to the workpiece from the side of the incident surface in the condition where a focal point of the pulsed laser beam is set inside the workpiece after performing the coating step, thereby forming a modified layer inside the workpiece, and a dividing step of applying an external force to the workpiece after performing the modified layer forming step, thereby dividing the workpiece as starting from the modified layer formed inside said workpiece as a break start point.Type: GrantFiled: March 15, 2011Date of Patent: November 26, 2013Assignee: Disco CorporationInventor: Kenji Furuta
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Publication number: 20130302659Abstract: An object is to, in a battery pack device in which battery cells are lined up, provide a thermally conductive member that can reduce the risk of heat being conducted to an adjacent battery cell in order to make the cooling property of each battery cell uniform, and a battery pack device using this thermally conductive member. Provided is a thermally conductive member arranged between battery cells when assembling the battery cells into a battery pack, wherein the thermally conductive member includes thermally conductive layers each having a thermal conductivity of 0.5 W/mK or more provided respectively on both sides of a backing layer having a thermal conductivity of less than 0.5 W/mK. Especially, it is preferred that a resin member forming the backing layer has a flexural modulus of 1 GPa or more.Type: ApplicationFiled: July 17, 2013Publication date: November 14, 2013Applicant: NITTO DENKO CORPORATIONInventors: Yoshio Terada, Akira Shouji, Kouki Tomioka, Kenji Furuta, Midori Tojo, Kazunori Hayashi, Shoujirou Moriki
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Patent number: 8581144Abstract: A laser processing apparatus including a holding unit for holding a workpiece, a processing unit for applying a laser beam to the workpiece held by the holding unit, a surface displacement detecting unit for detecting a surface displacement of the workpiece, and a focal position adjusting unit for adjusting the position of a focusing lens provided in the processing unit according to the surface displacement detected. The surface displacement detecting unit includes a detecting light source capable of oscillating light having a plurality of wavelengths different from the wavelength of the laser beam and a wavelength selecting section configured to select one of the plurality of wavelengths as the wavelength of detecting light. The detecting light having the selected wavelength is focused by the focusing lens and applied to the workpiece.Type: GrantFiled: August 4, 2009Date of Patent: November 12, 2013Assignee: Disco CorporationInventors: Kenji Furuta, Keiji Nomaru
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Patent number: 8536486Abstract: A workpiece including an irregularly shaped portion on a dividing line is divided along the dividing line by detecting the location of the irregularly shaped portion, applying a detecting laser beam to an area of the workpiece except for the detected location, along the dividing line to detect the height of a surface of the workpiece except for the location, applying and focusing a machining laser beam having a wavelength which permeates the workpiece within the workpiece while moving a focused spot of the machining laser beam based on the detected height of the surface of the workpiece to form a modified layer in an area of the workpiece except for at least the location of the irregularly shaped portion along the dividing line, and applying an external force to the modified layer to divide the workpiece along the dividing line.Type: GrantFiled: May 23, 2011Date of Patent: September 17, 2013Assignee: Disco CorporationInventors: Kenji Furuta, Satoshi Usuda
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Publication number: 20130161794Abstract: Provided are an internally reformed substrate for epitaxial growth having an arbitrary warpage shape and/or an arbitrary warpage amount, an internally reformed substrate with a multilayer film using the internally reformed substrate for epitaxial growth, a semiconductor device, a bulk semiconductor substrate, and manufacturing methods therefor. The internally reformed substrate for epitaxial growth includes: a single crystal substrate; and a heat-denatured layer formed in an internal portion of the single crystal substrate by laser irradiation to the single crystal substrate.Type: ApplicationFiled: March 4, 2011Publication date: June 27, 2013Applicants: DISCO CORPORATION, NAMIKI SEIMITSU HOUSEKI KABUSHIKI KAISHAInventors: Hideo Aida, Natsuko Aota, Hitoshi Hoshino, Kenji Furuta, Tomosaburo Hamamoto, Keiji Honjo
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Publication number: 20130161797Abstract: In order to correct warpage resulting from the formation of a multilayer film, provided are a single crystal substrate which includes a heat-denatured layer provided in one of two regions including a first region and a second region obtained by bisecting the single crystal substrate in a thickness direction thereof, and which is warped convexly toward a side of a surface of the region provided with the heat-denatured layer, a manufacturing method for the single crystal substrate, a manufacturing method for a single crystal substrate with a multilayer film using the single crystal substrate, and an element manufacturing method using the manufacturing method for a single crystal substrate with a multilayer film.Type: ApplicationFiled: March 4, 2011Publication date: June 27, 2013Applicants: DISCO CORPORATION, NAMIKI SEIMITSU HOUSEKI KABUSHIKI KAISHAInventors: Hideo Aida, Natsuko Aota, Hitoshi Hoshino, Kenji Furuta, Tomosaburo Hamamoto, Keiji Honjo
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Publication number: 20130082358Abstract: In order to correct warpage that occurs in formation of a multilayer film, provided are a single crystal substrate with a multilayer film, a manufacturing method therefor, and an element manufacturing method using the manufacturing method. The single crystal substrate with a multilayer film includes: a single crystal substrate (20); a multilayer film (30) including two or more layers that is formed on one surface of the single crystal substrate (20) and having a compressive stress; and a heat-denatured layer (22) provided, of two regions (20U, 20D) obtained by bisecting the single crystal substrate (20) in the thickness direction thereof, at least in the region (20D) on the side of the surface opposite to the one surface of the single crystal substrate (20) having the multilayer film (30) formed thereon.Type: ApplicationFiled: March 4, 2011Publication date: April 4, 2013Applicants: DISCO CORPORATION, NAMIKI SEIMITSU HOUSEKI KABUSHIKI KAISHAInventors: Hideo Aida, Natsuko Aota, Hitoshi Hoshino, Kenji Furuta, Tomosaburo Hamamoto, Keiji Honjo
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Publication number: 20130078406Abstract: A sheet product including a sheet-shaped pressure-sensitive adhesive sheet having pressure-sensitive adhesiveness; a base separator disposed on one surface side of the sheet so as to be peelable from the sheet, and supporting the sheet and serving as a base; and a protective separator disposed on the other surface side of the sheet so as to be peelable from the sheet, wherein the peel force between the sheet and the base separator is smaller than the peel force between the sheet and the protective separator; and a cut is given to the sheet and the protective separator in the direction of the thickness of the sheet such that the sheet and the protective separator can be peeled from the base separator as a separate piece in the state where the sheet and the protective separator are layered.Type: ApplicationFiled: May 27, 2011Publication date: March 28, 2013Applicant: NITTO DENKO CORPORATIONInventors: Akira Shouji, Tatsuya Tsukagoshi, Kenji Furuta, Midori Tojo, Yoshio Terada
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Publication number: 20130062734Abstract: Provided are a crystalline film in which variations in the crystal axis angle after separation from a substrate for epitaxial growth have been eliminated, and various devices in which the properties thereof have been improved by including the crystalline film. And the crystalline film has a thickness of 300 ?m or more and 10 mm or less and reformed region pattern is formed in an internal portion of the crystalline film.Type: ApplicationFiled: March 4, 2011Publication date: March 14, 2013Applicants: DISCO CORPORATION, NAMIKI SEIMITSU HOUSEKI KABUSHIKI KAISHAInventors: Hideo Aida, Natsuko Aota, Hitoshi Hoshino, Kenji Furuta, Tomosaburo Hamamoto, Keiji Honjo
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Publication number: 20130041093Abstract: An object is to provide a thermally conductive adhesive sheet capable of making a heat generating body and a heat radiating body adhere to each other easily and with a sufficient adhesive force. Provided is a thermally conductive adhesive sheet including an adhesive agent layer formed by molding a thermally conductive adhesive agent composition including an acrylic polymer component into a sheet-like shape, wherein the adhesive force at the time of 180° peeling is 1 N/20 mm or more and the contact thermal resistance is 0.6 cm2·K/W or less when the adhesive sheet is pressure bonded to an adherend with a pressure of 200 kPa.Type: ApplicationFiled: May 13, 2011Publication date: February 14, 2013Applicant: NITTO DENKO CORPORATIONInventors: Junichi Nakayama, Tatsuya Tsukagoshi, Yoshio Terada, Akira Shouji, Kenji Furuta, Midori Tojo
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Publication number: 20120309879Abstract: Provided is a method for producing a thermally-conductive adhesive sheet including a thermally-conductive adhesive agent layer by performing: a composition preparation step of preparing a thermally-conductive adhesive agent composition including a thermally-conductive particle and an acrylic polymer component; and an adhesive agent layer formation step of forming a sheet-shaped thermally-conductive adhesive agent layer with the thermally-conductive adhesive agent composition, wherein in the composition preparation step, a cyclic organic compound of 8 or less carbon atoms, or an organic compound of 3 or less carbon atoms having a hydroxy, ketone, aldehyde, carboxyl or nitrile group is mixed as a constitutional component of the thermally-conductive adhesive agent composition.Type: ApplicationFiled: January 27, 2011Publication date: December 6, 2012Applicant: NITTO DENKO CORPORATIONInventors: Kenji Furuta, Junichi Nakayama, Yoshio Terada, Takashi Wano
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Publication number: 20120301716Abstract: Provided is a thermally-conductive double-sided adhesive sheet capable of improving the workability when adherends are bonded to or detached from each other. The thermally-conductive double-sided adhesive sheet includes an adhesive agent layer formed of a thermally-conductive adhesive agent composition formed into a sheet, which composition including a thermally-conductive material and an acrylic polymer component, wherein a strong adhesive agent layer forming one side and a weak adhesive agent layer forming the other side of the thermally-conductive double-sided adhesive sheet are laminated in such a way that the adhesive force of the one side of the thermally-conductive double-sided adhesive sheet to an adherend is stronger than the adhesive force of the other side of the thermally-conductive double-sided adhesive sheet to the adherend.Type: ApplicationFiled: January 24, 2011Publication date: November 29, 2012Applicant: NITTO DENKO CORPORATIONInventors: Yoshio Terada, Junichi Nakayama, Kenji Furuta, Akira Shouji, Tatsuya Tsukagoshi, Midori Tojo
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Publication number: 20120219838Abstract: An object is to, in a battery pack device in which battery cells are lined up, provide a thermally conductive member that can reduce the risk of heat being conducted to an adjacent battery cell in order to make the cooling property of each battery cell uniform, and a battery pack device using this thermally conductive member. Provided is a thermally conductive member arranged between battery cells when assembling the battery cells into a battery pack, wherein the thermally conductive member includes thermally conductive layers each having a thermal conductivity of 0.5 W/mK or more provided respectively on both sides of a backing layer having a thermal conductivity of less than 0.5 W/mK. Especially, it is preferred that a resin member forming the backing layer has a flexural modulus of 1 GPa or more.Type: ApplicationFiled: September 29, 2010Publication date: August 30, 2012Applicants: NITTO SHINKO CORPORATION, NITTO DENKO CORPORATIONInventors: Yoshio Terada, Akira Shouji, Kouki Tomioka, Kenji Furuta, Midori Tojo, Kazunori Hayashi, Shoujirou Moriki
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Publication number: 20120086797Abstract: A method of detecting an object of detection formed in the inside of or on a non-exposed surface of a workpiece having a rugged exposed surface, the detection being made on the exposed surface side of the workpiece by use of an imaging unit. The detecting method includes: a flattening step of coating the exposed surface of the workpiece with a liquid resin transmissive to the wavelength of light to be detected by the imaging unit so as to flatten the exposed surface of the workpiece; and a detecting step of detecting the object of detection formed in the inside of or on the non-exposed surface of the workpiece by use of the imaging unit on the exposed surface side of the workpiece coated with the liquid resin, after the flattening step.Type: ApplicationFiled: October 7, 2011Publication date: April 12, 2012Applicant: DISCO CORPORATIONInventor: Kenji Furuta
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Publication number: 20120088354Abstract: In a semiconductor wafer with a supporting tape attached to the back side of the wafer, a coating member having a refractive index close to that of the supporting tape is formed on a pear-skin surface of the supporting tape to thereby planarize the pear-skin surface. Thereafter, a pulsed laser beam is applied from the upper side of the coating member to the semiconductor wafer in the condition where the focal point of the pulsed laser beam is set at a predetermined depth in the semiconductor wafer. Accordingly, the pulsed laser beam can be sufficiently focused inside the semiconductor wafer to thereby well form a modified layer inside the semiconductor wafer.Type: ApplicationFiled: October 5, 2011Publication date: April 12, 2012Applicant: DISCO CORPORATIONInventor: Kenji Furuta
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Publication number: 20110290769Abstract: A workpiece including an irregularly shaped portion on a dividing line is divided along the dividing line by detecting the location of the irregularly shaped portion, applying a detecting laser beam to an area of the workpiece except for the detected location, along the dividing line to detect the height of a surface of the workpiece except for the location, applying and focusing a machining laser beam having a wavelength which permeates the workpiece within the workpiece while moving a focused spot of the machining laser beam based on the detected height of the surface of the workpiece to form a modified layer in an area of the workpiece except for at least the location of the irregularly shaped portion along the dividing line, and applying an external force to the modified layer to divide the workpiece along the dividing line.Type: ApplicationFiled: May 23, 2011Publication date: December 1, 2011Applicant: DISCO CORPORATIONInventors: Kenji FURUTA, Satoshi USUDA
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Publication number: 20110290468Abstract: An object is to provide a heat conductive adhesive composition containing boron nitride particles and an acrylic polymer, which is capable of forming a molding having a good heat conductivity, and a heat conductive adhesive sheet with the heat conductive adhesive composition therein, which has a good heat conductivity and bond strength. Provided is the heat conductive adhesive composition which contains boron nitride particles and an acrylic polymer component, and the above boron nitride particles contain boron nitride particles having a particle size of 3 ?m or more and 300 ?m or less, wherein the boron nitride particles contain 5 to 45% by volume of boron nitride particles having a particle size of 3 ?m or more and 20 ?m or less, 30 to 70% by volume of boron nitride particles having a particle size of more than 20 ?m and 60 ?m or less, 1.0 to 40% by volume of boron nitride particles having a particle size of more than 60 ?m and 300 ?m or less.Type: ApplicationFiled: January 13, 2010Publication date: December 1, 2011Applicant: NITTO DENKO CORPORATIONInventors: Junichi Nakayama, Yoshio Terada, Kenji Furuta, Takashi Wano
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Publication number: 20110226747Abstract: A workpiece dividing method for dividing a workpiece having an uneven incident surface upon which a pulsed laser beam falls. The workpiece dividing method includes a coating step of applying a coating member to the incident surface of the workpiece, thereby planarizing the incident surface of the workpiece, the coating member transmitting the pulsed laser beam and having a refractive index close to that of the workpiece for the pulsed laser beam, a modified layer forming step of applying the pulsed laser beam to the workpiece from the side of the incident surface in the condition where a focal point of the pulsed laser beam is set inside the workpiece after performing the coating step, thereby forming a modified layer inside the workpiece, and a dividing step of applying an external force to the workpiece after performing the modified layer forming step, thereby dividing the workpiece as starting from the modified layer formed inside said workpiece as a break start point.Type: ApplicationFiled: March 15, 2011Publication date: September 22, 2011Applicant: DISCO CORPORATIONInventor: Kenji Furuta
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Patent number: 7927974Abstract: First, mapping data storing interrupted areas is obtained. In a first modified-layer forming step, before a stacked article is stacked on a front surface of a substrate, a laser beam is directed to the interrupted areas based on the mapping data to form modified layers only at the interrupted areas. After the stacked articles have been stacked on the substrate, in a second modified-layer forming step, the laser beam is directed at least to the predetermined dividing line formed with no modified layer in the first modified-layer forming step to form a modified layer.Type: GrantFiled: November 13, 2008Date of Patent: April 19, 2011Assignee: Disco CorporationInventors: Yosuke Watanabe, Kenji Furuta, Kiyoshi Ohsuga
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Patent number: 7883992Abstract: A laser beam is applied to an intersection area of each second street of a wafer by using a dicing apparatus to thereby form a first modified layer along the intersection area. Thereafter, the wafer is divided along each first street intersecting each second street at right angles to obtain a plurality of wafer strips. Thereafter, the laser beam is applied along the remaining area of each second street other than the intersection area to form a second modified layer along the remaining area of each second street. Thereafter, an external force is applied to each wafer strip in which the first and second modified layers have been formed along each second street, thereby dividing each wafer strip along each second street to obtain a plurality of devices.Type: GrantFiled: November 21, 2008Date of Patent: February 8, 2011Assignee: Disco CorporationInventor: Kenji Furuta