Abstract: There are provided a positioning method and a positioning device that can position workpieces by a simple method and configuration. A positioning method includes: gripping at least one of first and second workpieces; obtaining point group data of the at least one gripped workpiece of the first and second workpieces; calculating a translation matrix of shape fitting point group data obtained by adjusting a position of the point group data to reference data in a position adjustment state of the first and second workpieces; calculating an inverse matrix based on the translation matrix; and positioning the first and second workpieces by moving the at least one gripped workpiece of the first and second workpieces based on at least one of the translation matrix and the inverse matrix.

Abstract: A light guide includes light guiding members including first and second light guiding members, an optical entrance having a plane on which the light is incident, a light guiding unit to guide the light incident on the optical entrance with repeated reflection, a light beam ejection unit to eject the light to an outside of the light guide, and an extraction unit to reflect the light guided by the light guiding unit toward the light beam ejection unit. The light guiding members guide and eject a light, and the second light guiding member is bonded to, at least, the light guiding unit of the first light guiding member.

Abstract: A small diameter sheath heater with improved reliability is provided. The sheath heater according to one embodiment of the present invention includes a metal sheath, a heating wire having a band shape, the heating wire arranged with a gap within the metal sheath so as to rotate with respect to an axis direction of the metal sheath, an insulating material arranged in the gap, and connection terminals arranged at one end of the metal sheath, the connection terminals electrically connected with both ends of the heating wire respectively.

Abstract: The present disclosure is directed recombinant T cell receptors capable of binding a tyrosinase epitope, a MAGA-A1 epitope, a MART1 epitope, a MAGE-A3 epitope, or an SSX2 epitope and nucleic acid molecules encoding the same. In some embodiments, the nucleic acid molecules further comprise a second nucleotide sequence, wherein the second nucleotide sequence or the polypeptide encoded by the second nucleotide sequence inhibits the expression of an endogenous TCR. Other aspects of the disclosure are directed to vectors comprising the nucleic acid molecule and cells comprising the recombinant TCR, the nucleic acid molecule, or the vector. Still other aspects of the disclosure are directed to methods of using the same. In some embodiments, the methods comprise treating a cancer in a subject in need thereof.

Abstract: A method for manufacturing a circuit board, includes obtaining a second laminated body by laminating, in this order, an uncured second insulating substrate and a resin film on a second surface opposite to a first surface of a cured first insulating substrate of a first laminated body, and performing thermocompression bonding thereon. The first laminated body includes the first insulating substrate and a metal layer that is formed into a pattern shape on the first surface of the first insulating substrate. A third laminated body is obtained by forming a hole that reaches the metal layer, in the resin film, the second insulating substrate, and the first insulating substrate, from a resin film side of the second laminated body, filling conductive paste into the hole, and then peeling off the resin film. Thermocompression bonding is performed by stacking one third laminated body and another third laminated body.

Abstract: The present disclosure is directed to methods of identifying MHC class II-specific T cell receptors (TCRs). In certain aspects, the method comprises contacting a T cell with a complex comprising an (i) MHC class II molecule having a higher affinity for CD4 than naturally occurring MHC class II molecules and (ii) a peptide, e.g., an epitope. In certain aspects, the HLA class II molecule comprises a beta chain having one or more mutations relative to a wild-type beta chain sequence.

Abstract: The present disclosure is directed to HLA class II molecules having a higher affinity for CD4 than naturally occurring HLA class II molecules. In certain aspects, the HLA class II molecule comprises a DR beta chain having (i) an amino acid other than leucine at a position corresponding to amino acid residue 114 of SEQ ID NO: 1, (ii) an amino acid other than valine at a position corresponding to amino acid residue 143 of SEQ ID NO: 1, (iii) or both (i) and (ii). Certain aspects of the present disclosure are directed to nucleic acid molecules encoding the HLA class II molecules, vectors comprising the nucleic acid molecule, cells comprising the same, and methods of use thereof.

Abstract: The present disclosure is directed recombinant T cell receptors capable of binding a CCND1 epitope and nucleic acid molecules encoding the same. In some aspects, the nucleic acid molecules further comprise a second nucleotide sequence, wherein the second nucleotide sequence or the polypeptide encoded by the second nucleotide sequence inhibits the expression of an endogenous TCR. Other aspects of the disclosure are directed to vectors comprising the nucleic acid molecule and cells comprising the recombinant TCR, the nucleic acid molecule, or the vector. Still other aspects of the disclosure are directed to methods of using the same. In some aspects, the methods comprise treating a cancer in a subject in need thereof.

Abstract: The present disclosure is directed recombinant T cell receptors capable of binding a MUC5AC epitope and nucleic acid molecules encoding the same. In some aspects, the nucleic acid molecules further comprise a second nucleotide sequence, wherein the second nucleotide sequence or the polypeptide encoded by the second nucleotide sequence inhibits the expression of an endogenous TCR. Other aspects of the disclosure are directed to vectors comprising the nucleic acid molecule and cells comprising the recombinant TCR, the nucleic acid molecule, or the vector. Still other aspects of the disclosure are directed to methods of using the same. In some aspects, the methods comprise treating a cancer in a subject in need thereof.

Abstract: The present disclosure is directed to HLA class II molecules having a higher affinity for CD4 than naturally occurring HLA class II molecules. In certain aspects, the HLA class II molecule comprises a DQ beta chain having (i) an amino acid other than leucine at a position corresponding to amino acid residue 114 of SEQ ID NO: 1, (ii) an amino acid other than valine at a position corresponding to amino acid residue 143 of SEQ ID NO: 1, (iii) or both (i) and (ii). Certain aspects of the present disclosure are directed to nucleic acid molecules encoding the HLA class II molecules, vectors comprising the nucleic acid molecule, cells comprising the same, and methods of use thereof.

Abstract: The present disclosure is directed recombinant T cell receptors capable of binding a MAGE-A2 epitope and nucleic acid molecules encoding the same. In some aspects, the nucleic acid molecules further comprise a second nucleotide sequence, wherein the second nucleotide sequence or the polypeptide encoded by the second nucleotide sequence inhibits the expression of an endogenous TCR. Other aspects of the disclosure are directed to vectors comprising the nucleic acid molecule and cells comprising the recombinant TCR, the nucleic acid molecule, or the vector. Still other aspects of the disclosure are directed to methods of using the same. In some aspects, the methods comprise treating a cancer in a subject in need thereof.

Abstract: A lens unit includes: a lens group including: an object-side lens closest to an object side in the lens group; an image-side lens closest to an image side in the lens group; and an intermediate lens between the object-side lens and the image-side lens, the object-side lens, the image-side lens, and the intermediate lens being arranged along an optical axis; a first holder holding an edge surface of the object-side lens and an edge surface of the intermediate lens; and a second holder separate from the first holder, the second holder holding the edge surface of the intermediate lens and an edge surface of the image-side lens.

Abstract: There is provided herein, the use of mammalian derived HLA class I molecule for in vitro peptide exchange. For example, there is provided a method of producing an HLA class I molecule complexed to a pre-selected peptide comprising: (a) providing a mammalian derived HLA class I molecule complexed to an existing peptide; (b) incubating, in vitro, the HLA class I molecule complexed to the existing peptide with the pre-selected peptide, wherein the pre-selected peptide is at a concentration sufficient to replace the existing peptide to produce the HLA class I molecule complexed to the pre-selected peptide; and the HLA class I molecule comprises ?1, ?2, ?3 and ?2m domains.

Abstract: A method for manufacturing a semiconductor device includes the steps of: preparing a semiconductor substrate including a first semiconductor layer and a second semiconductor layer; and irradiating the semiconductor substrate with laser light from the first semiconductor layer side to divide the semiconductor substrate into individual semiconductor chips. The first semiconductor layer includes a semiconductor material transparent to the laser light. The second semiconductor layer includes a semiconductor material opaque to the laser light. In the step of irradiating with the laser light, laser light having intensity that makes the semiconductor material of the first semiconductor layer opaque to the laser light is irradiated.

Abstract: A semiconductor element manufacturing method according to the invention is such that a focal spot form of a laser light is an ellipse, and irradiation with the laser light is concentrated on a projected division line of an interface between a semiconductor substrate and a fixing sheet, which is a vaporizing pressure confining sheet, and vaporizing pressure generated by the irradiation is confined between the semiconductor substrate and the fixing sheet, and caused to act as a bending force on the semiconductor substrate, and an initial crack is extended. Because of this, energy of the laser light can be reduced, heat damage to an element region of the semiconductor substrate and debris can be reduced, and a division face with good flatness can be stably obtained.

Abstract: A first aspect of the present invention is carbon fiber wherein the surface of a monofilament has a center line average roughness Ra of 6.0 nm or more and 13 nm or less, and the monofilament has a long diameter/short diameter ratio of 1.11 or more and 1.245 or less. A second aspect of the present invention is carbon fiber precursor acrylic fiber wherein the surface of a monofilament has a center line average roughness Ra of 18 nm or more and 27 nm or less, and the monofilament has a long diameter/short diameter ratio of 1.11 or more and 1.245 or less. The carbon fiber according to the first aspect is obtained by stabilizing and carbonizing under specific conditions the carbon fiber precursor acrylic fiber according to the second aspect.

Abstract: A method for manufacturing a semiconductor device includes the steps of: preparing a semiconductor substrate including a first semiconductor layer and a second semiconductor layer; and irradiating the semiconductor substrate with laser light from the first semiconductor layer side to divide the semiconductor substrate into individual semiconductor chips. The first semiconductor layer includes a semiconductor material transparent to the laser light. The second semiconductor layer includes a semiconductor material opaque to the laser light. In the step of irradiating with the laser light, laser light having intensity that makes the semiconductor material of the first semiconductor layer opaque to the laser light is irradiated.

Abstract: A semiconductor element manufacturing method according to the invention is such that a focal spot form of a laser light is an ellipse, and irradiation with the laser light is concentrated on a projected division line of an interface between a semiconductor substrate and a fixing sheet, which is a vaporizing pressure confining sheet, and vaporizing pressure generated by the irradiation is confined between the semiconductor substrate and the fixing sheet, and caused to act as a bending force on the semiconductor substrate, and an initial crack is extended. Because of this, energy of the laser light can be reduced, heat damage to an element region of the semiconductor substrate and debris can be reduced, and a division face with good flatness can be stably obtained.

Abstract: An annealing method according to the present invention is an annealing method of annealing a molded body (1) which is molded from a molding material in a molding step, and the method includes the steps of: (I) releasing stress from the molded body (1) by heating the molded body (1); and (II) correcting a warp of the molded body (1), by simultaneously heating the molded body (1) and applying a load to the molded body (1). This achieves an annealing method which makes it possible to obtain a molded body that is free from residual stress and distortion.

Abstract: Provided are a memory device and waveform data editing method and editing program thereof. Waveform data obtained by sampling a musical sound is acquired, and a difference between a harmonic frequency of an nth harmonic of the waveform data and a resonance sound frequency of the nth harmonic sound of a resonance sound generation circuit is calculated, and if the difference is 1 Hz or more, a waveform of a frequency component of 20 Hz centered on a central of the frequency of the nth harmonic of a frequency spectrum is clipped. The difference calculated in regard to the clipped waveform is reduced. The waveform and the clipped original waveform are combined to edit the waveform data. Thus, in the waveform data, the difference between the harmonic frequencies of the resonance characteristic is eliminated, and resonance is facilitated and occurrence of beat of the sound is prevented.