Patents by Inventor Kenji Iwamasa
Kenji Iwamasa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10604643Abstract: The pipe articles with excellent stress crack resistance can be achieved by providing ethylene copolymer composition comprises ethylene and a C6-C10 ?-olefin comonomer; the ethylene copolymer having a total density of 0.945-0.980 g/cm3 and a MFR5 of 0.10-0.50 g/10 min; and the ethylene copolymer having a comonomer content of 1-5% wt. The ethylene copolymer has Mx/My in the range of not less than 14.0; gpcBR in the range of from 0.20 to 0.80; and strain hardening modulus <Gp> in the range of not less than 53.4.Type: GrantFiled: November 15, 2016Date of Patent: March 31, 2020Assignees: SCG Chemicals Co., Ltd., Mitsui Chemicals, Inc.Inventors: Natthaporn Suchao-in, Kenji Iwamasa, Eiji Shiba, Warachad Klomkamol, Patcharin Samphawamontri, Watcharee Cheevasrirungruang, Shinichi Kojoh, Yasunori Kaneko, Takashi Fukawa, Thipphaya Pathaweeisariyakul
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Publication number: 20190248991Abstract: The pipe articles with excellent stress crack resistance can be achieved by providing ethylene copolymer composition comprises ethylene and a C6-C10 ?-olefin comonomer; the ethylene copolymer having a total density of 0.945-0.980 g/cm3 and a MFR5 of 0.10-0.50 g/10 min; and the ethylene copolymer having a comonomer content of 1-5% wt. The ethylene copolymer has Mx/My in the range of not less than 14.0; gpcBR in the range of from 0.20 to 0.80; and strain hardening modulus <Gp> in the range of not less than 53.4.Type: ApplicationFiled: November 15, 2016Publication date: August 15, 2019Applicants: SCG Chemicals Co., Ltd., Mitsui Chemicals, Inc.Inventors: Natthaporn SUCHAO-IN, Kenji IWAMASA, Eiji SHIBA, Warachad KLOMKAMOL, Patcharin SAMPHAWAMONTRI, Watcharee CHEEVASRIRUNGRUANG, Shinichi KOJOH, Yasunori KANEKO, Takashi FUKAWA, Thipphaya PATHAWEEISARIYAKUL
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Patent number: 9000116Abstract: A blow molding ethylene resin composition satisfies the following requirements [a], [b], [c] and [d] at the same time: [a] the melt flow rate (MFR) at a temperature of 190° C. under a load of 21.6 kg is in the range of 1.0 to 15 g/10 min; [b] the density is in the range of 955 to 970 kg/m3; [c] the number of methyl branches per 1000 carbon atoms is less than 0.1 according to 13C-NMR; [d] the tensile impact strength measured at ?40° C. in accordance with JIS K 7160 is not less than 270 kJ/m2.Type: GrantFiled: April 2, 2012Date of Patent: April 7, 2015Assignees: Prime Polymer Co., Ltd., Mitsui Chemicals, Inc.Inventors: Yoshiyuki Hirase, Kenji Iwamasa
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Publication number: 20120189792Abstract: A blow molding ethylene resin composition satisfies the following requirements [a], [b], [c] and [d] at the same time: [a] the melt flow rate (MFR) at a temperature of 190° C. under a load of 21.6 kg is in the range of 1.0 to 15 g/10 min; [b] the density is in the range of 955 to 970 kg/m3; [c] the number of methyl branches per 1000 carbon atoms is less than 0.1 according to 13C-NMR; [d] the tensile impact strength measured at ?40° C. in accordance with JIS K 7160 is not less than 270 kJ/m2.Type: ApplicationFiled: April 2, 2012Publication date: July 26, 2012Inventors: Yoshiyuki HIRASE, Kenji IWAMASA
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Patent number: 8129489Abstract: The present invention provides an ethylene polymer that has excellent fluidity and moldability as well as gives a molded product having excellent mechanical strength. The ethylene polymer of the present invention contains 0.02 to 1.50 mol % of a constitutional unit derived from ?-olefin having 6 to 10 carbon atoms, and has the density of 945 to 975 kg/m3, which satisfies both of the following requirements [1] and [2] simultaneously: [1] in CFC, all the components having a molecular weight of 100,000 or more are eluted at a temperature of 85° C. or higher; and [2] the components eluted at a temperature of 80° C. or lower account for up to 5% of all the components eluted in CFC.Type: GrantFiled: August 12, 2005Date of Patent: March 6, 2012Assignee: Mitsui Chemicals, Inc.Inventors: Masahiko Okamoto, Tetsuji Kasai, Yasushi Tohi, Koji Endo, Shiro Otsuzuki, Takahiro Akashi, Kenji Iwamasa, Yoshiyuki Hirase, Keiko Fukushi, Shinichi Nagano
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Publication number: 20100227098Abstract: An ethylene-based resin satisfying simultaneously the following requirements [a] to [c] is excellent in strength and moldability and is suitably used for a blow molded article (a hollow molded article). [a] The environmental stress cracking resistance (ESCR), T, at 50° C. is 500 hours or more in the case of a flexural modulus of 1000 MPa to 1500 MPa and is 100 hours or more in the case of a flexural modulus of 1500 MPa to 2000 MPa, as measured according to ASTM-D-1693, [b] the melt tension at 190° C. is 50 (mN) or more and [c] the melt breaking drawing rate is 90 (m/min) or less.Type: ApplicationFiled: February 14, 2007Publication date: September 9, 2010Inventors: Keiko Fukushi, Kenji Iwamasa, Masahiko Okamoto
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Publication number: 20100028578Abstract: A blow molding ethylene resin composition satisfies the following requirements [a], [b], [c] and [d] at the same time: [a] the melt flow rate (MFR) at a temperature of 190° C. under a load of 21.6 kg is in the range of 1.0 to 15 g/10 min; [b] the density is in the range of 955 to 970 kg/m3; [c] the number of methyl branches per 1000 carbon atoms is less than 0.1 according to 13C-NMR; [d] the tensile impact strength measured at ?40° C. in accordance with JIS K 7160 is not less than 270 kJ/m2.Type: ApplicationFiled: January 15, 2008Publication date: February 4, 2010Inventors: Yoshiyuki Hirase, Kenji Iwamasa
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Publication number: 20090036584Abstract: Disclosed is an environmental stress cracking resistance improver that is composed of a compound that has in the molecule thereof a structure represented by the following general formula (I) and a molecular weight of from 200 to 2,000. Also disclosed are a method for improving environmental stress cracking resistance properties that uses the environmental stress cracking resistance improver, and a resin composition with improved environmental stress cracking resistance properties that contains the environmental stress cracking resistance improver. In the above general formula, R1 and R2 are each a hydrocarbon group having 1 to 6 carbon atoms, and may be the same or different from each other.Type: ApplicationFiled: February 15, 2007Publication date: February 5, 2009Inventors: Keiko Fukushi, Kenji Iwamasa, Masahiko Okamoto
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Patent number: 7452946Abstract: An ethylene-based polymer which is a copolymer obtained from ethylene and a C3 to C10?-olefin and satisfies the following requirements (i), (ii), (iii) and (iv) simultaneously provides a blow-molded product and an extrusion-molded product excellent in moldability, mechanical strength and outward appearance. (i) melt flow rate [MFR2 (g/10 min)] under a loading of 2.16 kg at 190° C. is in the range of 0.01 to 10, (ii) melt tension [MT (g)] and the above melt flow rate [MFR2 (g/10 min)] satisfy the following relationship: MT?3.2×MFR2?0.55, (iii) an activation energy [Ea] of fluidization is less than 30 (KJ/mol), and (iv) swell ratio is 1.36 or more.Type: GrantFiled: May 19, 2004Date of Patent: November 18, 2008Assignee: Mitsui Chemicals, Inc.Inventors: Sadahiko Matsuura, Naoto Matsukawa, Makoto Mitani, Junji Saito, Terunori Fujita, Yasushi Tohi, Koji Endo, Kenji Iwamasa, Keiko Takahashi
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Publication number: 20070244286Abstract: The present invention provides an ethylene polymer that has excellent fluidity and moldability as well as gives a molded product having excellent mechanical strength. The ethylene polymer of the present invention contains 0.02 to 1.50 mol % of a constitutional unit derived from ?-olefin having 6 to 10 carbon atoms, and has the density of 945 to 975 kg/m3, which satisfies both of the following requirements [1] and [2] simultaneously: [1] in CFC, all the components having a molecular weight of 100,000 or more are eluted at a temperature of 85° C. or higher; and [2] the components eluted at a temperature of 80° C. or lower account for up to 5% of all the components eluted in CFC.Type: ApplicationFiled: August 12, 2005Publication date: October 18, 2007Inventors: Masahiko Okamoto, Tetsuji Kasai, Yasushi Tohi, Koji Endo, Shiro Otsuzuki, Takahiro Akashi, Kenji Iwamasa, Yoshiyuki Hirase, Keiko Fukushi, Shinichi Nagano
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Publication number: 20060199925Abstract: An ethylene-based polymer which is a copolymer obtained from ethylene and a C3 to C10?-olefin and satisfies the following requirements (i), (ii), (iii) and (iv) simultaneously provides a blow-molded product and an extrusion-molded product excellent in moldability, mechanical strength and outward appearance. (i) melt flow rate [MFR2 (g/10 min)] under a loading of 2.16 kg at 190° C. is in the range of 0.01 to 10, (ii) melt tension [MT (g)] and the above melt flow rate [MFR2 (g/10 min)] satisfy the following relationship: MT?3.2×MFR2?0.55, (iii) an activation energy [Ea] of fluidization is less than 30 (KJ/mol), and (iv) swell ratio is 1.36 or more.Type: ApplicationFiled: May 19, 2004Publication date: September 7, 2006Inventors: Sadahiko Matsuura, Naoto Matsukawa, Makoto Mitani, Junji Saito, Terunori Fujita, Yasushi Tohi, Koji Endo, Kenji Iwamasa, Keiko Takahashi
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Patent number: 6524520Abstract: A method for manufacturing a hollow molded article by extruding a parison of an ethylene/&agr;-olefin copolymer whose density, melt flow rate, melt tension, decane soluble matter content and melting point are controlled within particular ranges, while controlling the resin pressure in the extruder within a certain range, and then blow-molding such parison. This method makes it possible to improve the drawdown characteristic of the parison and to provide a container showing high mechanical strength and only a small amount of extraction into the contents of the article.Type: GrantFiled: June 14, 2000Date of Patent: February 25, 2003Assignee: Mitsui Chemicals, Inc.Inventors: Yoichiro Tsuji, Kenji Iwamasa