Abstract: An image display apparatus includes a display unit displaying an image, a touch detecting unit detecting a touch operation by a touch pen, a control unit executing a process allocated to the detected touch operation, and a communication unit receiving an ID transmitted from a touch pen when the touch pen is detected to be held by a user. In response to the communication unit receiving the ID, the display unit displays a partial image indicating a state of settings related to the process allocated to the touch operation by the touch pen, and in response to a touch to the partial image, the display unit displays a menu allowing a change of settings. Thus, the user can easily confirm the state of settings related to the touch operation, and can easily change the settings.

Abstract: An image display apparatus includes a display unit displaying an image, a touch detecting unit detecting a touch operation by a touch pen, a control unit executing a process allocated to the detected touch operation, and a communication unit receiving an ID transmitted from a touch pen when the touch pen is detected to be held by a user. In response to the communication unit receiving the ID, the display unit displays a partial image indicating a state of settings related to the process allocated to the touch operation by the touch pen, and in response to a touch to the partial image, the display unit displays a menu allowing a change of settings. Thus, the user can easily confirm the state of settings related to the touch operation, and can easily change the settings.

Abstract: In a multilayer board, a stacked body includes thermoplastic resin films and low-fluidity resin films with conductive patterns, which are alternately stacked. The stacked body and a resin base film are integrated by hot pressing. The base film has a terminal-connecting through hole for receiving an electrode terminal of an electronic component to be connected to a conductive pattern of the low-fluidity resin film disposed at an end of the stacked body. An electronic component mounting section of the stacked body, which is an area corresponding to the electronic component mounted on the base film in a stacking direction, is configured such that a number of the conductive patterns located in a corresponding section that corresponds to the through hole in the stacking direction is greater than a number of the conductive patterns located in a non-corresponding section without corresponding to the through hole in the stacking direction.

Abstract: In a multilayer board, a stacked body includes thermoplastic resin films and low-fluidity resin films with conductive patterns, which are alternately stacked. The stacked body and a resin base film are integrated by hot pressing. The base film has a terminal-connecting through hole for receiving an electrode terminal of an electronic component to be connected to a conductive pattern of the low-fluidity resin film disposed at an end of the stacked body. An electronic component mounting section of the stacked body, which is an area corresponding to the electronic component mounted on the base film in a stacking direction, is configured such that a number of the conductive patterns located in a corresponding section that corresponds to the through hole in the stacking direction is greater than a number of the conductive patterns located in a non-corresponding section without corresponding to the through hole in the stacking direction.

Abstract: The invention relates to the fabrication of a cylindrical storage node in a stacked capacitor cell of DRAM. A fine, cylindrical slit is formed in an oxide layer on a conductor layer by electron beam lithography using a positive resist which undergoes a reversal to negative by a slight overexposure. By using a local reversal of the exposed resist layer to negative, a fine cylindrical pattern is easily produced in the resist layer, and the pattern is transferred to the oxide layer by etching. Then a conductor such as polysilicon is deposited on the oxide layer to fill the cylindrical slit with the deposited conductor. The conductor in the cylindrical slit appears as a cylindrical part of the storage node when the conductor film on the oxide layer surface and the oxide layer are successively removed. In the case of forming a storage node in the shape of double or multiple cylinder, cylindrical patterning of the resist layer is repeated before etching the underlying oxide layer.