Abstract: A heat exchanger includes a heating fluid flow path through which a heating fluid flows, a heated fluid flow path through which a heated fluid flows, a heat radiation unit that stacks a plurality of heat radiation plates in a thickness direction to thereby form a heat radiation flow path communicating with the heating fluid flow path between a plurality of heat radiation plates, a heat receiving unit provided stacked in the thickness direction of the heat radiation plates forming the heat radiation unit, that stacks a plurality of heat receiving plates in the thickness direction to form a heat receiving flow path communicating with a heated fluid flow path between the plurality of heat receiving plates, a heat storage unit formed of a space between the heat radiation unit and the heat receiving unit and a heat storage material filled inside the heat storage unit.

Abstract: A heat management system includes an outdoor heat exchanger that exchanges heat between a heat medium and outdoor air, a compressor that compresses the heat medium heat-exchanged by the outdoor heat exchanger, an indoor heat exchanger that exchanges heat between the heat medium compressed by the compressor and the indoor air, and an external device heat exchanger provided between the outdoor heat exchanger and the compressor, that exchanges heat between the heat generated by an external device and the heat medium.

Abstract: The disclosure prevents, with improved reliability, an IC tag from being broken, while ensuring overall flexibility of the IC tag. The IC tag 100 is provided with a covering 140 made of an elastic material, which covers at least the side of the IC tag 100 on which an IC chip 130 is mounted and has a thickness that is larger in its portion 140a that covers a region about the IC chip 130 than in its portion 140b that covers a region outside the region about the IC chip 130. The covering 140 is configured in such a way that at least a part of a boundary of the portion 140a of the covering that covers the region about the IC chip 130 and the portion 140b of the covering that covers the region outside the region about the IC chip 130 has a curved shape.

Abstract: The disclosure prevents, with improved reliability, an IC tag from being broken, while ensuring overall flexibility of the IC tag. The IC tag 100 is provided with a covering 140 made of an elastic material, which covers at least the side of the IC tag 100 on which an IC chip 130 is mounted and has a thickness that is larger in its portion 140a that covers a region about the IC chip 130 than in its portion 140b that covers a region outside the region about the IC chip 130. The covering 140 is configured in such a way that at least a part of a boundary of the portion 140a of the covering that covers the region about the IC chip 130 and the portion 140b of the covering that covers the region outside the region about the IC chip 130 has a curved shape.

Abstract: The present invention relates to a hermetic structure having a flat cable. Liquid rubber is charged into a gap to be sealed, the charged liquid rubber is subjected to a physical action at the normal temperature and under the normal pressure, and the liquid rubber is cured to form a seal. By forming the seal in this manner, the limitation of heat resistance and pressure resistance is moderated, the flexibility of selection of materials for various constituent members is enhanced, and the structure is simplified.

Abstract: The present invention relates to a hermetic structure having a flat cable. Liquid rubber is charged into a gap to be sealed, the charged liquid rubber is subjected to a physical action at the normal temperature and under the normal pressure, and the liquid rubber is cured to form a seal. By forming the seal in this manner, the limitation of heat resistance and pressure resistance is moderated, the flexibility of selection of materials for various constituent members is enhanced, and the structure is simplified.