Patents by Inventor Kenji Minowa

Kenji Minowa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5622585
    Abstract: In order to properly hold a number of miniaturized electronic component chips so that processing such as formation of external electrodes can be efficiently performed, a holder having an adhesive face to be stuck to first end surfaces of a number of electronic component chips for holding the electronic component chips is employed. The number of electronic component chips being held by the holder are dipped in electrode paste, so that external electrodes are formed on second end surfaces thereof. Then, an adhesive face of another holder having stronger adhesion than the adhesive face of the first holder is stuck to the electronic component chips, whereby the number of electronic component chips are simultaneously transferred to this holder. The first end surfaces are then also dipped in electrode paste to from external electrodes thereon.
    Type: Grant
    Filed: April 17, 1995
    Date of Patent: April 22, 1997
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kenji Minowa, Norio Sakai, Tetsuro Saito, Toshimi Yoshimura
  • Patent number: 5571594
    Abstract: In order to properly hold a number of miniaturized electronic component chips so that processing such as formation of external electrodes can be efficiently performed, a holder having an adhesive face to be stuck to first end surfaces of a number of electronic component chips for holding the electronic component chips is employed. The number of electronic component chips being held by the holder are dipped in electrode paste, so that external electrodes are formed on second end surfaces thereof. Then, an adhesive face of another holder having stronger adhesion than the adhesive face of the first holder is stuck to the electronic component chips, whereby the number of electronic component chips are simultaneously transferred to this holder. The first end surfaces are then also dipped in electrode paste to form external electrodes thereon.
    Type: Grant
    Filed: November 14, 1994
    Date of Patent: November 5, 1996
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kenji Minowa, Norio Sakai, Tetsuro Saito, Toshimi Yoshimura
  • Patent number: 5383997
    Abstract: In order to properly hold a number of miniaturized electronic component chips so that processing such as formation of external electrodes can be efficiently performed, a holder having an adhesive face to be stuck to first end surfaces of a number of electronic component chips for holding the electronic component chips is employed. The number of electronic component chips being held by the holder are dipped in electrode paste, so that external electrodes are formed on second end surfaces thereof. Then, an adhesive face of another holder having stronger adhesion than the adhesive face of the first holder is stuck to the electronic component chips, whereby the number of electronic component chips are simultaneously transferred to this holder. The first end surfaces are then also dipped in electrode paste to form external electrodes thereon.
    Type: Grant
    Filed: May 9, 1994
    Date of Patent: January 24, 1995
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kenji Minowa, Norio Sakai, Tetsuro Saito, Toshimi Yoshimura
  • Patent number: 5274916
    Abstract: A ceramic green sheet is formed on a carrier film; both the ceramic green sheet and the carrier film are cut into prescribed dimensions; a hole to serve as a via hole is provided in the ceramic green sheet while the ceramic green sheet is maintained in the state backed with the carrier film; the hole is filled up with a conductive paste while the ceramic green sheet is in this state; an interconnection pattern is formed on the ceramic green sheet which is still backed up with the carrier film; and the ceramic green sheet is then separated from the carrier film and is then immediately stacked in order on other ceramic green sheets. Thus, it is possible to improve the accuracy in stacking of ceramic green sheets in a method of manufacturing a ceramic multilayer circuit board having portions electrically connected through via holes.
    Type: Grant
    Filed: December 17, 1992
    Date of Patent: January 4, 1994
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shoichi Kawabata, Norio Sakai, Kenji Minowa
  • Patent number: 5262729
    Abstract: In order to enable measurement of insulation resistance values of a number of electronic parts such as chip capacitors with high accuracy and without the reducing measurement efficiency of characteristics, such as the capacitance, capacitance values of chip capacitors which are held by respective holding portions of a turntable are first measured in a capacitance measuring position during intermittent feeding of the turntable. When an insulation resistance measuring region is filled with those of the chip capacitors whose capacitance values have been measured the turntable is stopped. In this stopped state, a plurality of chip capacitors being located in the insulation resistance measuring region are simultaneously charged and subjected to the measurement of insulation resistance values.
    Type: Grant
    Filed: February 4, 1992
    Date of Patent: November 16, 1993
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shoichi Kawabata, Norio Sakai, Kenji Minowa, Akihiko Takahashi, Miki Kurabe, Mitsuro Hamuro
  • Patent number: 5185040
    Abstract: Disclosed herein is a method of forming strip-shaped electrodes over an end surface of a plate-shaped electronic component and two major surfaces which are in series with the end surface. A slit plate, which is provided with through slits having widths corresponding to the width of electrodes to be formed, is located above an electrode paste bath while an electronic component is arranged above the slit plate so that its end surface extends across the through slits. Before or after this step, the electrode paste is made to swell to a constant level beyond the upper surface of the slit plate, thereby applying the electrode paste to the end surface of the electronic component and the two major surfaces which are in series with the end surface in the form of strips.
    Type: Grant
    Filed: November 15, 1991
    Date of Patent: February 9, 1993
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Norio Sakai, Kenji Minowa, Shinji Morihiro
  • Patent number: 5120577
    Abstract: An electronic component chip holder employed for coating metallized surfaces on both longitudinal ends of a plurality of electronic component chips with a metal such as solder, while holding the same. The holder comprises a plurality of holding portions for holding the electronic component chips one by one. Each of the holding portions is defined by a through hole, and each of the electronic component chips is inserted in the holding so as to be longitudinally aligned with the axis of the through hole. An elastic member is formed on an inner peripheral surface defining each holding portion, to elastically hold a longitudinal intermediate portion of each electronic component chip. A plurality of electronic component chips thus held by the holder are collectively dipped in a molten bath of a metal such as solder, so that coating films of such a metal are formed on the metallized surfaces.
    Type: Grant
    Filed: April 30, 1990
    Date of Patent: June 9, 1992
    Inventors: Masami Yamaguchi, Kenji Minowa
  • Patent number: 5091212
    Abstract: Disclosed herein is a method of forming strip-shaped electrodes over an end surface of a plate-shaped electronic component and two major surfaces which are in series with the end surface. A slit plate, which is provided with through slits having width corresponding to the width of electrodes to be formed, is located above an electrode paste bath while an electronic component is arranged above the slit plate so that its end surface extends across the through slits. Before or after this step, the electrodes paste is made to swell to a constant level beyond the upper surface of the slit plate, thereby applying the electrode paste to the end surface of the electronic component and the two major surfaces which are in series with the end surface in the form of strips.
    Type: Grant
    Filed: December 19, 1989
    Date of Patent: February 25, 1992
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Norio Sakai, Kenji Minowa, Shinji Morihiro
  • Patent number: 5007534
    Abstract: A retainer for chip-type electronic parts comprising an elastic retainer plate formed of elastic material and having a plurality of retaining holes formed therein for retaining chip-type electronic parts. The elastic retainer plate is arranged such that chip-type electronic parts are elastically held by elastic holding power applied by inner surfaces of the retaining holes.
    Type: Grant
    Filed: September 27, 1989
    Date of Patent: April 16, 1991
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kuniaki Tamaki, Norio Sakai, Kenji Minowa