Patents by Inventor Kenji Moriyama

Kenji Moriyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12080452
    Abstract: A shunt resistor having improved temperature characteristics has a resistive body, a pair of base materials integrally formed on the resistive body across the resistive body, and measurement terminals fixed onto the base materials. The base materials have a plurality of cutout portions along a longitudinal direction of the base materials, wherein the plurality of cutout portions do not communicate with each other and are provided in a stepped manner.
    Type: Grant
    Filed: April 27, 2022
    Date of Patent: September 3, 2024
    Assignee: SUNCALL CORPORATION
    Inventors: Yuu Moriyama, Kenji Murakami, Akio Mugishima
  • Publication number: 20230378114
    Abstract: To provide a display device that can suppress scattered light generated when light leaking downward from a semiconductor light-emitting element of one subpixel is scattered at a joint, from leaking to an adjacent subpixel. The display device includes a display panel including a plurality of semiconductor light-emitting elements each including a light-emitting layer, a drive substrate having a drive circuit and facing the display panel, and a plurality of joints each electrically connecting each of a plurality of the semiconductor light-emitting elements to the drive substrate, in which, in a case where a direction in which the display panel and the drive substrate face each other is a line-of-sight direction, a position of a center of a light-emitting region of the semiconductor light-emitting element and a position of a center of the joint to be joined to the semiconductor light-emitting element are shifted from each other.
    Type: Application
    Filed: October 19, 2021
    Publication date: November 23, 2023
    Inventors: YUICHI MIYAMORI, KENJI MORIYAMA
  • Publication number: 20230357011
    Abstract: A method for manufacturing Group-III nitride semiconductor nanoparticles includes synthesizing Group-III nitride semiconductor nanoparticles having a particle size of 16 nm or less by reacting materials containing one or more Group-III elements M in a liquid phase, wherein a coordination solvent is used, and trimethyl M is used as at least one Group-III element material among the materials containing one or more Group-III elements M.
    Type: Application
    Filed: September 13, 2021
    Publication date: November 9, 2023
    Applicant: STANLEY ELECTRIC CO., LTD.
    Inventors: Takuya KAZAMA, Wataru TAMURA, Yasuyuki MIYAKE, Kenji MORIYAMA, Atsushi MURAMATSU, Kiyoshi KANIE
  • Publication number: 20230335788
    Abstract: Provided are a method for producing an atomization sulfide solid electrolyte, including atomizing a raw material sulfide solid electrolyte together with a specific ketone compound, the raw material sulfide solid electrolyte containing a lithium atom, a sulfur atom, a phosphorus atom and a halogen atom; an atomization sulfide solid electrolyte; an electrode mixture containing the atomization sulfide solid electrolyte and an electrode active material; and a lithium ion battery containing at least one of the atomization sulfide solid electrolyte and the electrode mixture.
    Type: Application
    Filed: March 20, 2023
    Publication date: October 19, 2023
    Applicant: IDEMITSU KOSAN CO., LTD.
    Inventors: Kenji MORIYAMA, Shinji TANAKA, Katsuhito KONDO, Hironari KIMPARA, Atsushi YAO
  • Publication number: 20220388862
    Abstract: Single-phase manganese oxide particles having a wurtzite crystal structure. The particles can be obtained by thermally decomposing a compound containing manganese. In this procedure, a reducing agent consisting of at least one of a polyol-based material and an ethylene glycol stearate-based material is added as an additive to the reaction system. It is heated at a first temperature (200° C. or lower) under a reduced pressure atmosphere, then the temperature is raised, and the product is heated at a temperature higher than the first temperature under an inert gas atmosphere.
    Type: Application
    Filed: November 9, 2020
    Publication date: December 8, 2022
    Applicant: STANLEY ELECTRIC CO., LTD.
    Inventors: Takuya KAZAMA, Wataru TAMURA, Yasuyuki MIYAKE, Kenji MORIYAMA, Atsushi MURAMATSU, Kiyoshi KANIE
  • Patent number: 6708945
    Abstract: A flow rate control valve includes a second substrate having a flexible thin film and interposed between a first substrate having a heating mechanism and a third substrate having a sealing section. The first substrate and the second substrate close an internal space formed adjacent to the heating mechanism and filled with an expandable material. The sealing section and the flexible thin film function together as a valve. The heating mechanism heats and expands the expandable material whose pressure is detected by pressure-detecting sensors. The detected pressure value is fed back to a control mechanism of the heating mechanism for opening/closing a fluid flow passage and controlling the valve opening degree.
    Type: Grant
    Filed: July 12, 2002
    Date of Patent: March 23, 2004
    Assignee: SMC Kabushiki Kaisha
    Inventors: Toru Horiuchi, Akio Sato, Kenji Moriyama
  • Patent number: D609306
    Type: Grant
    Filed: April 23, 2009
    Date of Patent: February 2, 2010
    Assignee: SMC Corporation
    Inventor: Kenji Moriyama
  • Patent number: D609307
    Type: Grant
    Filed: April 23, 2009
    Date of Patent: February 2, 2010
    Assignee: SMC Corporation
    Inventor: Kenji Moriyama
  • Patent number: D857172
    Type: Grant
    Filed: February 22, 2018
    Date of Patent: August 20, 2019
    Assignee: SMC CORPORATION
    Inventors: Kenji Shinozaki, Kenji Moriyama, Tadaaki Saka
  • Patent number: D857851
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: August 27, 2019
    Assignee: SMC CORPORATION
    Inventors: Kenji Shinozaki, Kenji Moriyama, Tadaaki Saka
  • Patent number: D857852
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: August 27, 2019
    Assignee: SMC CORPORATION
    Inventors: Kenji Shinozaki, Kenji Moriyama, Tadaaki Saka
  • Patent number: D857853
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: August 27, 2019
    Assignee: SMC CORPORATION
    Inventors: Kenji Shinozaki, Kenji Moriyama, Tadaaki Saka
  • Patent number: D858713
    Type: Grant
    Filed: February 22, 2018
    Date of Patent: September 3, 2019
    Assignee: SMC CORPORATION
    Inventors: Kenji Shinozaki, Kenji Moriyama, Tadaaki Saka
  • Patent number: D871551
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: December 31, 2019
    Assignee: SMC CORPORATION
    Inventors: Kenji Shinozaki, Kenji Moriyama, Tadaaki Saka
  • Patent number: D872236
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: January 7, 2020
    Assignee: SMC CORPORATION
    Inventors: Kenji Shinozaki, Kenji Moriyama, Tadaaki Saka
  • Patent number: D886955
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: June 9, 2020
    Assignee: SMC CORPORATION
    Inventors: Kenji Shinozaki, Kenji Moriyama, Tadaaki Saka
  • Patent number: D896926
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: September 22, 2020
    Assignee: SMC CORPORATION
    Inventors: Kenji Shinozaki, Kenji Moriyama, Tadaaki Saka
  • Patent number: D897498
    Type: Grant
    Filed: February 21, 2018
    Date of Patent: September 29, 2020
    Assignee: SMC CORPORATION
    Inventors: Kenji Shinozaki, Kenji Moriyama, Tadaaki Saka
  • Patent number: D897499
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: September 29, 2020
    Assignee: SMC CORPORATION
    Inventors: Kenji Shinozaki, Kenji Moriyama, Tadaaki Saka
  • Patent number: D897500
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: September 29, 2020
    Assignee: SMC CORPORATION
    Inventors: Kenji Shinozaki, Kenji Moriyama, Tadaaki Saka