Patents by Inventor Kenji Nakamizo

Kenji Nakamizo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240084458
    Abstract: A substrate processing apparatus includes: a mixer configured to mix sulfuric acid as a first component and a second component different from the first component to prepare an etchant; a nozzle configured to eject the etchant to a substrate; a first component supplier including a first flow path that supplies the first component to the mixer, a first instantaneous flowmeter and a first flow rate controller provided in the first flow path; a second component supplier including a second flow path different from the first flow path and configured to supply the second component to the mixer, a second instantaneous flowmeter and a second flow rate controller provided in the second flow path; and a controller configured to control the first and second flow rate controllers using average flow rates of the first component and the second component during the ejection of the etchant to the substrate.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 14, 2024
    Inventors: Takashi NAKAZAWA, Isamu MIYAMOTO, Keigo SATAKE, Kenji NAKAMIZO
  • Patent number: 11905603
    Abstract: A substrate processing apparatus includes: a mixer configured to mix sulfuric acid as a first component and a second component different from the first component to prepare an etchant; a nozzle configured to eject the etchant to a substrate; a first component supplier including a first flow path that supplies the first component to the mixer, a first instantaneous flowmeter and a first flow rate controller provided in the first flow path; a second component supplier including a second flow path different from the first flow path and configured to supply the second component to the mixer, a second instantaneous flowmeter and a second flow rate controller provided in the second flow path; and a controller configured to control the first and second flow rate controllers using average flow rates of the first component and the second component during the ejection of the etchant to the substrate.
    Type: Grant
    Filed: December 17, 2021
    Date of Patent: February 20, 2024
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Takashi Nakazawa, Isamu Miyamoto, Keigo Satake, Kenji Nakamizo
  • Publication number: 20220195609
    Abstract: A substrate processing apparatus includes: a mixer configured to mix sulfuric acid as a first component and a second component different from the first component to prepare an etchant; a nozzle configured to eject the etchant to a substrate; a first component supplier including a first flow path that supplies the first component to the mixer, a first instantaneous flowmeter and a first flow rate controller provided in the first flow path; a second component supplier including a second flow path different from the first flow path and configured to supply the second component to the mixer, a second instantaneous flowmeter and a second flow rate controller provided in the second flow path; and a controller configured to control the first and second flow rate controllers using average flow rates of the first component and the second component during the ejection of the etchant to the substrate.
    Type: Application
    Filed: December 17, 2021
    Publication date: June 23, 2022
    Inventors: Takashi NAKAZAWA, Isamu MIYAMOTO, Keigo SATAKE, Kenji NAKAMIZO
  • Patent number: 11135698
    Abstract: Disclosed is a processing apparatus that includes a chamber accommodating a workpiece, a nozzle provided within the chamber, a measuring unit measuring the supply flow rate of the processing fluid supplied to the nozzle, an opening/closing unit performing opening/closing of the flow path of the processing fluid, and a controller. The controller sends an opening/closing operation signal that causes the opening/closing unit to perform an opening/closing operation according to recipe information that indicates processing contents. After sending the opening/closing operation signal to the opening/closing unit according to the recipe information, the controller starts the integration of the supply flow rate based on the measurement result of the measuring unit, monitors the rise of the supply flow rate based on the calculated integrated amount, and when supplying a specific flow rate, monitors the supply flow rate based on a value actually measured by the measuring unit.
    Type: Grant
    Filed: June 14, 2016
    Date of Patent: October 5, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Keigo Satake, Kenji Nakamizo, Yuichi Douki
  • Patent number: 11118255
    Abstract: A Cu—Al—Mn-based alloy material (1) having a composition comprising: given contents of Al and Mn, and a given total content of at least one selected from Ni and the like; with the balance being Cu and unavoidable impurities, wherein the alloy material has a shape elongated in the working direction (RD), wherein a grain length ax in the RD is R/2 or less to the width or diameter (R), a grain length bx in a direction perpendicular to the RD is R/4 or less, and the amount of grains X (2) is 15% or less, and wherein a grain length a in the RD and a grain length b in the direction perpendicular to the RD satisfy: a?b, and an angle formed by the normal line of the (111) plane and the RD is 15° or larger, the amount of grains Y? (3) is 85% or more.
    Type: Grant
    Filed: September 13, 2016
    Date of Patent: September 14, 2021
    Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA TECHNO MATERIAL CO., LTD., TOHOKU UNIVERSITY
    Inventors: Misato Fujii, Sumio Kise, Toyonobu Tanaka, Kenji Nakamizo, Koji Ishikawa, Toshihiro Omori, Ryosuke Kainuma
  • Patent number: 11094568
    Abstract: A processing apparatus includes a chamber configured to accommodate a substrate to be processed, a nozzle provided in the chamber and configured to supply a processing solution to the substrate, a flow rate measuring part configured to measure a flow rate of the processing solution supplied to the nozzle, a flow path opening/closing part configured to open and close a supply flow path of the processing solution to the nozzle, and a controller configured to output a close signal causing the flow path opening/closing part to perform a closing operation that closes the supply flow path. The controller is configured to detect an operation abnormality of the flow path opening/closing part based on an accumulated amount of the flow rate measured by the flow rate measuring part after outputting the close signal.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: August 17, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Kenji Nakamizo, Satoshi Morita, Akinori Tanaka, Hiroshi Komiya, Mikio Nakashima, Kousuke Fukuda, Youichi Masaki, Ryoji Ando, Ikuo Sunaka
  • Patent number: 10400311
    Abstract: A wrought material containing a Cu—Al—Mn-based alloy, in which an existence frequency of a coincidence grain boundary with a ? value of 3 or less is 35% or more but 75% or less, and which has a recrystallized microstructure substantially formed from a ? single phase; and the use thereof.
    Type: Grant
    Filed: January 15, 2016
    Date of Patent: September 3, 2019
    Assignees: FURUKAWA TECHNO MATERIAL CO., LTD., FURUKAWA ELECTRIC CO., LTD., TOHOKU UNIVERSITY
    Inventors: Sumio Kise, Toyonobu Tanaka, Kenji Nakamizo, Koji Ishikawa, Misato Fujii, Toshihiro Omori, Ryosuke Kainuma
  • Patent number: 10351939
    Abstract: A Cu—Al—Mn-based alloy having superelastic characteristics and having a recrystallized texture substantially formed of a ? single phase, in which 70% or more of crystal grains is within a range of 0° to 50° in a deviation angle from <001> orientation of a crystalline orientation measured in a working direction by electron back-scatter diffraction patterning.
    Type: Grant
    Filed: March 16, 2015
    Date of Patent: July 16, 2019
    Assignees: TOHOKU UNIVERSITY, FURUKAWA TECHNO MATERIAL CO., LTD., FURUKAWA ELECTRIC CO., LTD.
    Inventors: Toshihiro Omori, Shingo Kawata, Ryosuke Kainuma, Kiyohito Ishida, Toyonobu Tanaka, Kenji Nakamizo, Sumio Kise, Koji Ishikawa, Misato Nakano, Satoshi Teshigawara
  • Patent number: 10261521
    Abstract: Disclosed is a processing apparatus including a chamber, at least one nozzle, a measuring unit, an opening/closing unit, and a controller. The chamber accommodates a workpiece therein. The nozzle is provided in the chamber to supply a processing fluid toward the workpiece. The measuring unit measures a supply flow rate of the processing fluid supplied to the nozzle. The opening/closing unit performs opening/closing of a flow path of the processing fluid to be supplied to the nozzle. The controller outputs opening and closing operation signals at a preset timing. After outputting the opening operation signal, the controller calculates an integrated amount of the processing fluid based on a measurement result of the measuring unit, and performs an output timing change processing to change a timing of outputting the opening or closing operation signal from the preset timing based on the calculated integrated amount.
    Type: Grant
    Filed: June 14, 2016
    Date of Patent: April 16, 2019
    Assignee: Tokyo Electron Limited
    Inventors: Keigo Satake, Kenji Nakamizo, Yuichi Douki, Takuro Masuzumi
  • Publication number: 20180308730
    Abstract: A processing apparatus includes a chamber configured to accommodate a substrate to be processed, a nozzle provided in the chamber and configured to supply a processing solution to the substrate, a flow rate measuring part configured to measure a flow rate of the processing solution supplied to the nozzle, a flow path opening/closing part configured to open and close a supply flow path of the processing solution to the nozzle, and a controller configured to output a close signal causing the flow path opening/closing part to perform a closing operation that closes the supply flow path. The controller is configured to detect an operation abnormality of the flow path opening/closing part based on an accumulated amount of the flow rate measured by the flow rate measuring part after outputting the close signal.
    Type: Application
    Filed: April 24, 2018
    Publication date: October 25, 2018
    Inventors: Kenji NAKAMIZO, Satoshi MORITA, Akinori TANAKA, Hiroshi KOMIYA, Mikio NAKASHIMA, Kousuke FUKUDA, Youichi MASAKI, Ryoji ANDO, Ikuo SUNAKA
  • Publication number: 20160376688
    Abstract: A Cu—Al—Mn-based alloy material (1) having a composition comprising: given contents of Al and Mn, and a given total content of at least one selected from Ni and the like; with the balance being Cu and unavoidable impurities, wherein the alloy material has a shape elongated in the working direction (RD), wherein a grain length ax in the RD is R/2 or less to the width or diameter (R), a grain length bx in a direction perpendicular to the RD is R/4 or less, and the amount of grains X (2) is 15% or less, and wherein a grain length a in the RD and a grain length b in the direction perpendicular to the RD satisfy: a?b, and an angle formed by the normal line of the (111) plane and the RD is 15° or larger, the amount of grains Y? (3) is 85% or more.
    Type: Application
    Filed: September 13, 2016
    Publication date: December 29, 2016
    Applicants: FURUKAWA ELECTRIC CO., LTD., FURUKAWA TECHNO MATERIAL CO., LTD., Tohoku University
    Inventors: Misato FUJII, Sumio KISE, Toyonobu TANAKA, Kenji NAKAMIZO, Koji ISHIKAWA, Toshihiro OMORI, Ryosuke KAINUMA
  • Publication number: 20160368114
    Abstract: Disclosed is a processing apparatus that includes a chamber accommodating a workpiece, a nozzle provided within the chamber, a measuring unit measuring the supply flow rate of the processing fluid supplied to the nozzle, an opening/closing unit performing opening/closing of the flow path of the processing fluid, and a controller. The controller sends an opening/closing operation signal that causes the opening/closing unit to perform an opening/closing operation according to recipe information that indicates processing contents. After sending the opening/closing operation signal to the opening/closing unit according to the recipe information, the controller starts the integration of the supply flow rate based on the measurement result of the measuring unit, monitors the rise of the supply flow rate based on the calculated integrated amount, and when supplying a specific flow rate, monitors the supply flow rate based on a value actually measured by the measuring unit.
    Type: Application
    Filed: June 14, 2016
    Publication date: December 22, 2016
    Inventors: Keigo Satake, Kenji Nakamizo, Yuichi Douki
  • Publication number: 20160370810
    Abstract: Disclosed is a processing apparatus including a chamber, at least one nozzle, a measuring unit, an opening/closing unit, and a controller. The chamber accommodates a workpiece therein. The nozzle is provided in the chamber to supply a processing fluid toward the workpiece. The measuring unit measures a supply flow rate of the processing fluid supplied to the nozzle. The opening/closing unit performs opening/closing of a flow path of the processing fluid to be supplied to the nozzle. The controller outputs opening and closing operation signals at a preset timing. After outputting the opening operation signal, the controller calculates an integrated amount of the processing fluid based on a measurement result of the measuring unit, and performs an output timing change processing to change a timing of outputting the opening or closing operation signal from the preset timing based on the calculated integrated amount.
    Type: Application
    Filed: June 14, 2016
    Publication date: December 22, 2016
    Inventors: Keigo Satake, Kenji Nakamizo, Yuichi Douki, Takuro Masuzumi
  • Publication number: 20160130683
    Abstract: A wrought material containing a Cu—Al—Mn-based alloy, in which an existence frequency of a coincidence grain boundary with a ? value of 3 or less is 35% or more but 75% or less, and which has a recrystallized microstructure substantially formed from a ? single phase; and the use thereof.
    Type: Application
    Filed: January 15, 2016
    Publication date: May 12, 2016
    Applicants: FURUKAWA TECHNO MATERIAL CO., LTD., FURUKAWA ELECTRIC CO., LTD., Tohoku University
    Inventors: Sumio KISE, Toyonobu TANAKA, Kenji NAKAMIZO, Koji ISHIKAWA, Misato FUJII, Toshihiro OMORI, Ryosuke KAINUMA
  • Publication number: 20160060740
    Abstract: A Cu—Al—Mn-based alloy rod having superelastic characteristics and having a recrystallized microstructure substantially formed of a ? single phase, wherein, for a longitudinal direction cross section of the rod, a region, in which a grain size of each of grains is a radius of the rod or more, is 90% or more of the longitudinal direction cross section at any location of the rod, and wherein an average grain size of the grains, in which the grain size is the radius of the rod or more, is 80% or more of a diameter of the rod; a Cu—Al—Mn-based alloy sheet; a production method thereof; a vibration damping material using thereof; a vibration damping structure constructed by using the vibration damping material.
    Type: Application
    Filed: November 10, 2015
    Publication date: March 3, 2016
    Applicants: TOHOKU UNIVERSITY, FURUKAWA ELECTRIC CO., LTD., FURUKAWA TECHNO MATERIAL CO., LTD.
    Inventors: Toshihiro OMORI, Tomoe KUSAMA, Ryosuke KAINUMA, Kiyohito ISHIDA, Toyonobu TANAKA, Sumio KISE, Kenji NAKAMIZO, Koji ISHIKAWA, Misato FUJII, Satoshi TESHIGAWARA
  • Publication number: 20150225826
    Abstract: A Cu—Al—Mn-based alloy having superelastic characteristics and having a recrystallized texture substantially formed of a ? single phase, in which 70% or more of crystal grains is within a range of 0° to 50° in a deviation angle from <001> orientation of a crystalline orientation measured in a working direction by electron back-scatter diffraction patterning.
    Type: Application
    Filed: March 16, 2015
    Publication date: August 13, 2015
    Applicants: TOHOKU UNIVERSITY, FURUKAWA ELECTRIC CO., LTD, FURUKAWA TECHNO MATERIAL CO., LTD.
    Inventors: Toshihiro OMORI, Shingo KAWATA, Ryosuke KAINUMA, Kiyohito ISHIDA, Toyonobu TANAKA, Kenji NAKAMIZO, Sumio KISE, Koji ISHIKAWA, Misato NAKANO, Satoshi TESHIGAWARA
  • Patent number: 9039863
    Abstract: Disclosed is a liquid processing apparatus capable of accurately determining a holding state of a substrate without being influenced by, for example, material or surface condition of a substrate. The liquid processing apparatus includes a substrate holding unit that holds a substrate, a camera that photographs a region where a peripheral edge portion of substrate is present when substrate is properly held by the substrate holding unit, and a control unit that determines a holding state of the substrate held by the substrate holding unit based on an image photographed by the camera.
    Type: Grant
    Filed: November 15, 2012
    Date of Patent: May 26, 2015
    Assignee: Tokyo Electron Limited
    Inventors: Shuhei Matsumoto, Shuji Iwanaga, Hiroshi Tomita, Kenji Nakamizo, Satoshi Morita
  • Patent number: 8654325
    Abstract: Provided is a substrate processing apparatus including a placement table on which a substrate is disposed; a light source configured to irradiate light on the surface of the substrate on the placement unit; a detector configured to detect the light amount reflected from the substrate; and a control unit configured to perform a determination process of determining whether a detection value of the light amount is smaller than a predetermined value at a plurality of positions, and to determine that a holding state of the substrate is abnormal when the total number of times of determination in which it is determined that the detection value is smaller than the predetermined value reaches a predetermined number of times.
    Type: Grant
    Filed: July 3, 2012
    Date of Patent: February 18, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Kenji Nakamizo, Satoshi Morita
  • Publication number: 20130334172
    Abstract: Disclosed is a liquid processing apparatus capable of accurately determining a holding state of a substrate without being influenced by, for example, material or surface condition of a substrate. The liquid processing apparatus includes a substrate holding unit that holds a substrate, a camera that photographs a region where a peripheral edge portion of substrate is present when substrate is properly held by the substrate holding unit, and a control unit that determines a holding state of the substrate held by the substrate holding unit based on an image photographed by the camera.
    Type: Application
    Filed: November 15, 2012
    Publication date: December 19, 2013
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Shuhei Matsumoto, Shuji Iwanaga, Hiroshi Tomita, Kenji Nakamizo, Satoshi Morita
  • Publication number: 20130010289
    Abstract: Provided is a substrate processing apparatus including a placement table on which a substrate is disposed; a light source configured to irradiate light on the surface of the substrate on the placement unit; a detector configured to detect the light amount reflected from the substrate; and a control unit configured to perform a determination process of determining whether a detection value of the light amount is smaller than a predetermined value at a plurality of positions, and to determine that a holding state of the substrate is abnormal when the total number of times of determination in which it is determined that the detection value is smaller than the predetermined value reaches a predetermined number of times.
    Type: Application
    Filed: July 3, 2012
    Publication date: January 10, 2013
    Inventors: Kenji Nakamizo, Satoshi Morita