Abstract: An electronic component includes a body formed of an insulator, a coil positioned in the body and including first and second coil conductors, an outer electrode including a first bottom-surface electrode and a first substantially columnar electrode (first electrode) and connected to the second conductor, and an outer electrode including a second bottom-surface electrode and a second substantially columnar electrode (second electrode) and connected to the first conductor. The second conductor is positioned between the first conductor and a bottom surface of the body. The second electrode is positioned to oppose the first electrode across the coil's central axis when viewed from the z-axis direction. An outermost peripheral portion of the first conductor is superposed with the first electrode when viewed from the z-axis direction. A smallest distance between the first conductor and a first side surface is smaller than that between the second conductor and a second side surface.

Abstract: An electronic component including a substrate, a capacitor lower electrode disposed on the substrate, an inorganic dielectric layer disposed on the substrate to cover the lower electrode, a capacitor upper electrode disposed directly on the inorganic dielectric layer and facing the lower electrode via the inorganic dielectric layer, and a coil disposed on the inorganic dielectric layer and electrically connected to the lower electrode or the upper electrode.

Abstract: An electronic component including a substrate, a capacitor lower electrode disposed on the substrate, an inorganic dielectric layer disposed on the substrate to cover the lower electrode, a capacitor upper electrode disposed directly on the inorganic dielectric layer and facing the lower electrode via the inorganic dielectric layer, and a coil electrically connected to the lower electrode or the upper electrode. The upper surface of the inorganic dielectric layer is flat.

Abstract: A coil component: including a first planar spiral wiring and a second planar spiral wiring located above the first planar spiral wiring in a laminated direction and interconnected through connection vias to the first planar spiral wiring. The second planar spiral wiring is wound in a direction different from a winding direction of the first planar spiral wiring when viewed in the laminated direction. The first planar spiral wiring and the second planar spiral wiring have respective innermost circumferential overlapping portions overlapping with each other at the innermost circumferential region when viewed in the laminated direction. At least both end parts of the innermost circumferential overlapping portion of the first planar spiral wiring are in an interconnection with at least both end parts of the innermost circumferential overlapping portion of the second planar spiral wiring through the connection vias.

Abstract: An electronic component includes a main body composed of an insulator, a coating film covering the main body, a circuit element located inside the main body, and outer electrodes. The insulator contains a metal magnetic powder. The coating film is composed of a resin and a cationic element contained in the insulator.

Abstract: A coil component includes a mounting surface that is a side mounted on a mounting board and a detecting surface that is a side generating a magnetic field to detect a distance from a detected conductor. The coil component has a coil conductor formed into a spiral shape, and a magnetic resin disposed on the mounting surface side of the coil conductor without being disposed on the detecting surface side of the coil conductor.

Abstract: The manufacture method of a coil component includes the steps of bonding a dummy metal layer onto one face of a mounting base, stacking a base insulating resin on the dummy metal layer, stacking a first spiral wiring and a first insulating resin in this order on the base insulating resin to cover the first spiral wiring with the first insulating resin and stacking a second spiral wiring and a second insulating resin in this order on the first insulating resin to cover the second spiral wiring with the second insulating resin to thereby form a coil substrate, detaching the mounting base from the dummy metal layer in a bonding face between the one face of the mounting base and the dummy metal layer, removing the dummy metal layer from the coil substrate, and covering the coil substrate with a magnetic resin.

Abstract: A coil component includes a core with a closed magnetic circuit structure, a primary-side coil wound around the core, and a secondary-side coil wound around the core, disposed in an axial direction of the primary-side coil, and magnetically coupled to the primary-side coil. The primary-side coil and the secondary-side coil each include a first coil portion, and a second coil portion electrically connected to the first coil portion. The second coil portion overlaps in an axial direction of the first coil portion and an axis of the second coil portion is eccentric from an axis of the first coil portion. A cross-sectional area of an inner magnetic path of the second coil portion in a direction orthogonal to the axis is smaller than a cross-sectional area of an inner magnetic path of the first coil portion in a direction orthogonal to the axis.

Abstract: [Object] A technology of designating a display position of a window to be displayed on an information processing device using another information processing device has been demanded. [Solution] According to the present disclosure, there is provided an information processing device including: a communication unit configured to receive display position designation information indicating a display position of a window from another information processing device; and a control unit configured to perform control of displaying a window at the display position indicated by the display position designation information in a display area of a display unit. According to the present disclosure, an information processing device can receive display position designation information from another information processing device and display a window at a display position indicated by the display position designation information.

Abstract: Provided is a control device including a detector configured to detect use of an application on a communication terminal, and a controller configured to control recording processing related to content that is being output from a content output device associated with the communication terminal in accordance with a detection result obtained by the detector.

Abstract: An electronic component includes a body formed of an insulator, a coil positioned in the body and including first and second coil conductors, an outer electrode including a first bottom-surface electrode and a first substantially columnar electrode (first electrode) and connected to the second conductor, and an outer electrode including a second bottom-surface electrode and a second substantially columnar electrode (second electrode) and connected to the first conductor. The second conductor is positioned between the first conductor and a bottom surface of the body. The second electrode is positioned to oppose the first electrode across the coil's central axis when viewed from the z-axis direction. An outermost peripheral portion of the first conductor is superposed with the first electrode when viewed from the z-axis direction. A smallest distance between the first conductor and a first side surface is smaller than that between the second conductor and a second side surface.

Abstract: Provided is a control device including a detector configured to detect use of an application on a communication terminal, and a controller configured to control recording processing related to content that is being output from a content output device associated with the communication terminal in accordance with a detection result obtained by the detector.

Abstract: A surface acoustic wave device includes a piezoelectric substrate, at least one interdigital transducer (IDT) electrode provided on the piezoelectric substrate, and an insulator layer to improve a temperature characteristic arranged so as to cover the IDT electrode. When a surface of the insulator layer is classified into a first surface region under which the IDT electrode is positioned and a second surface region under which no IDT electrode is positioned, the surface of the insulator layer in at least one portion of the second surface region is higher than the surface of the insulator layer from the piezoelectric substrate in at least one portion of the first surface region by at least about 0.001?, where the wavelength of an acoustic wave is ?.

Abstract: A method for fabricating an acoustic wave device includes the steps of forming an insulating material layer on a piezoelectric substrate, forming a patterned photoresist on the insulating material layer, patterning the insulating material layer, and forming a piezoelectric-substrate exposed depression corresponding to a region where an interdigital transducer electrode is to be formed on a first insulator layer composed of the insulating material layer, depositing a metallic material on the piezoelectric substrate to form the interdigital transducer electrode in the piezoelectric-substrate exposed depression such that the overall interdigital transducer electrode is thinner than the first insulator layer and coating the photoresist with a metallic material, removing the photoresist and the metallic material on the photoresist, and depositing a second insulator layer so as to cover the interdigital transducer electrode and the first insulator layer.

Abstract: An information processing system includes a receiving unit, a risk control matrix storage unit and a dummy control setting unit. The receiving unit receives assumed risks and controls corresponding to the assumed risks. The risk control matrix storage unit stores a risk control matrix in which a correspondence relation between the risks and the controls is described. If evaluation of design effectiveness is performed to check a document regarding an operation to be controlled in an internal control of operations and if the dummy control setting unit determines that there is a risk having no control corresponding thereto in the risk control matrix stored in the risk control matrix storage unit, the dummy control setting unit sets a dummy control for the risk having no corresponding control in the risk control matrix and stores the risk control matrix.

Abstract: A surface acoustic wave device prevents a decrease in yield and a decrease in reliability, such as an impulse withstand voltage, and achieves good frequency characteristics, even when using higher frequencies. The surface acoustic wave device includes an IDT electrode disposed on a piezoelectric substrate, and a first insulating film and at least one second insulating film disposed on the IDT electrode, and utilizes a higher-order mode of an SH wave, in which the acoustic velocity of a surface acoustic wave in the first insulating film located closer to the IDT electrode than the insulating film at an outermost surface is higher than the acoustic velocity of a surface acoustic wave in the second insulating film located at the outermost surface.

Abstract: A document processing system includes: an activity storage; a business process narrative storage; a risk storage; a control storage; an information extracting unit; and a document preparing and outputting unit.

Abstract: A surface acoustic wave sensor that achieves increased detection sensitivity includes a piezoelectric substrate, an IDT electrode provided on the piezoelectric substrate, and a protection layer arranged on the piezoelectric substrate so as to cover the IDT electrode. The surface acoustic wave sensor is arranged so as to be excited by the IDT electrode in a high-order mode of an SH wave in which displacement at a surface of the protection layer and displacement near a boundary between the piezoelectric substrate and the IDT electrode have opposite directions, and the maximum displacement occurs at the surface of the protection layer.

Abstract: A document processing system includes: an activity storage; a business process narrative storage; a risk storage; a control storage; an information extracting unit; and a document preparing and outputting unit.

Abstract: A surface acoustic wave device prevents a decrease in yield and a decrease in reliability, such as an impulse withstand voltage, and achieves good frequency characteristics, even when using higher frequencies. The surface acoustic wave device includes an IDT electrode disposed on a piezoelectric substrate, and a first insulating film and at least one second insulating film disposed on the IDT electrode, and utilizes a higher-order mode of an SH wave, in which the acoustic velocity of a surface acoustic wave in the first insulating film located closer to the IDT electrode than the insulating film at an outermost surface is higher than the acoustic velocity of a surface acoustic wave in the second insulating film located at the outermost surface.