Patents by Inventor Kenji Ohsawa

Kenji Ohsawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9240365
    Abstract: A cooling device is disclosed. The cooling device includes a thermal diffusing unit operable to radiate heat taken from a heating element, and a heat transporting part, laminated in a thickness direction of the heat diffusing unit and diffused thereby. The thermal diffusing unit has an upper plate, a lower plate opposite thereto, a vapor diffusion path to diffuse an evaporated refrigerant, and a capillary channel to circulate a condensed refrigerant. The heat transporting part has an upper plate, a lower plate opposite thereto, a vapor diffusion path to diffuse an evaporated refrigerant, and a capillary channel to circulate a condensed refrigerant. Either the upper plate or the lower plate is formed with the same member of the lower plate or the upper plate of the heat transporting part.
    Type: Grant
    Filed: March 12, 2010
    Date of Patent: January 19, 2016
    Assignee: Molex, LLC
    Inventors: Kenji Ohsawa, Katsuya Tsuruta
  • Patent number: 8988882
    Abstract: A circuit element is arranged on an organic substrate and connected to a wiring pattern arranged on the organic substrate. An internal connection electrode is formed on a conductive support body by electroforming so as to obtain a unitary block of the internal connection electrode and the support body. Each end of each of the internal connection electrodes connected into a unitary block by the support body is connected to the wiring pattern. After the circuit element is sealed by resin, the support body is peeled off, so as to obtain individual internal connection electrodes separately and the other end of each of the internal connection electrodes is used as an external connection electrode on the front surface while the external connection electrode on the rear surface is connected to the wiring pattern.
    Type: Grant
    Filed: March 24, 2010
    Date of Patent: March 24, 2015
    Assignees: Molex Japan Co., Ltd., Kagoshima University
    Inventors: Kenji Ohsawa, Rinkou Fukunaga, Katsuya Tsuruta, Kei Mizuta, Masamichi Ishihara
  • Patent number: 8982559
    Abstract: A heatsink is provided with a base body opposed to a heat generating body and absorbing heat from the heat generating body. Thermal resistance of that opposed portion of the base body which is opposed to the heat generating body is higher than thermal resistance of a surrounding portion surrounding the opposed portion.
    Type: Grant
    Filed: February 2, 2009
    Date of Patent: March 17, 2015
    Assignees: Fuchigami Micro Co., Ltd., Kagoshima University
    Inventors: Kenji Ohsawa, Katsuya Tsuruta, Toshiaki Kotani, Kei Mizuta
  • Patent number: 8611089
    Abstract: A heat pipe for cooling an exothermic body by the vaporization and condensation of an enclosed cooling medium is disclosed. The heat pipe comprises a flat plate-like upper plate, a flat plate-like lower plate opposed to the upper plate, and a plurality of flat plate-like intermediate plates overlaid on each other between the upper plate and the lower plate and having internal through-holes. The internal through-holes formed in each of a plurality of the intermediate plates are adapted such that only part of each through-hole is overlapped on each other to form capillary tube paths, each having a cross-sectional area smaller than the cross-sectional area of the through-hole in the flat surface direction.
    Type: Grant
    Filed: March 9, 2009
    Date of Patent: December 17, 2013
    Assignees: Fuchigami Micro Co., Ltd., Kagoshima University
    Inventors: Kei Mizuta, Katsuya Tsuruta, Toshiaki Kotani, Kenji Ohsawa
  • Publication number: 20130269913
    Abstract: A cooling unit main body having vapor diffusion flow paths which extend to the peripheral portion and capillary flow paths formed between the vapor diffusion flow paths and in a concave portion opposite region is provided with a thin concave portion in which an LED chip is mounted. Accordingly, heat from the LED chip can be easily transferred by what corresponds to the thinning of the concave portion, and successive circulating phenomenon caused by a refrigerant is repeated by the heat, and the heat is surely drawn from the LED chip by latent heat at a time when the refrigerant vaporizes, so that a heat pipe can maintain the light emitting state of the LED chip stably.
    Type: Application
    Filed: February 5, 2007
    Publication date: October 17, 2013
    Applicant: MOLEX INCORPORATED
    Inventors: Susumu Ueda, Kenji Ohsawa, Katsuya Tsuruta, Toshiaki Kotani
  • Patent number: 8534348
    Abstract: A thin and flat type heat pipe with enhanced conductivity. Between an upper member 22 having a rectangular area 24b on a lower surface and a lower member 20 having a rectangular area 24a on an upper area are provided intermediate plate members 32, 30. The members 32, 30 are each formed with slits 8, constructing a vapor path extending a planar direction, communicating with the rectangular areas 24a, 24b of the members 22, 20, respectively. Thus, a sealed space is defined by the slits 8 and the rectangular areas 24a, 24b so that a refrigerant is enclosed in the sealed space. Capillary holes 10 are formed through non-slitted portions of the intermediate plate members 32, 30 so that each capillary hole 10 serves as a capillary path of flow extending vertically to communicate with the rectangular areas 24a, 24b of the members 22, 20.
    Type: Grant
    Filed: January 31, 2006
    Date of Patent: September 17, 2013
    Assignee: Molex Incorporated
    Inventors: Kenji Ohsawa, Katsuya Tsuruta
  • Publication number: 20130126139
    Abstract: The heat transporting unit according to the Present Disclosure comprises: an upper plate; a lower plate that faces the upper plate; an interior space that is formed by the upper plate and the lower plate and wherein a refrigerant can be sealed; a first region, that is a region that is part of the interior space and that is provided with a first column portion that forms a plurality of first ducts that extend in the X-axis direction; and a second region that is provided with a second column portion that forms a plurality of second ducts that extend in the X-axis direction and the Y-axis direction, that is a region that is other than the first region within the interior space; wherein: the first ducts and second ducts connect at a boundary between the first region and the second region.
    Type: Application
    Filed: April 18, 2011
    Publication date: May 23, 2013
    Applicant: MOLEX INCORPORATED
    Inventors: Katsuya Tsuruta, Kenji Ohsawa, Rinkou Fukunaga
  • Publication number: 20120211207
    Abstract: A heat transporting unit comprises an upper plate, a lower plate opposing the upper plate, an internal space formed by the upper plate and the lower plate and operable to enter a refrigerant, a plurality of paths dividing the internal space in a first direction, and a plurality of grooves being provided at a bottom surface of the internal space. The plurality of the paths and the plurality of the grooves are connected by capillary channels in a region, and are divided by sidewalls in another region.
    Type: Application
    Filed: August 11, 2010
    Publication date: August 23, 2012
    Applicant: MOLEX INCORPORATED
    Inventors: Kenji Ohsawa, Katsuya Tsuruta
  • Publication number: 20120127667
    Abstract: A circuit element is arranged on an organic substrate and connected to a wiring pattern arranged on the organic substrate. An internal connection electrode is formed on a conductive support body by electroforming so as to obtain a unitary block of the internal connection electrode and the support body. Each end of each of the internal connection electrodes connected into a unitary block by the support body is connected to the wiring pattern. After the circuit element is sealed by resin, the support body is peeled off, so as to obtain individual internal connection electrodes separately and the other end of each of the internal connection electrodes is used as an external connection electrode on the front surface while the external connection electrode on the rear surface is connected to the wiring pattern.
    Type: Application
    Filed: March 24, 2010
    Publication date: May 24, 2012
    Applicants: KAGOSHIMA UNIVERSITY, MOLEX JAPAN CO., LTD.
    Inventors: Kenji Ohsawa, Rinkou Fukunaga, Katsuya Tsuruta, Kei Mizuta, Masamichi Ishihara
  • Publication number: 20120106084
    Abstract: A heat pipe for cooling an exothermic body by the vaporization and condensation of an enclosed cooling medium is disclosed. The heat pipe comprises a flat plate-like upper plate, a flat plate-like lower plate opposed to the upper plate, and a plurality of flat plate-like intermediate plates overlaid on each other between the upper plate and the lower plate and having internal through-holes. The internal through-holes formed in each of a plurality of the intermediate plates are adapted such that only part of each through-hole is overlapped on each other to form capillary tube paths, each having a cross-sectional area smaller than the cross-sectional area of the through-hole in the flat surface direction.
    Type: Application
    Filed: March 9, 2009
    Publication date: May 3, 2012
    Applicants: Kagoshima University, Fuchigami Micro Co. Ltd
    Inventors: Kei Mizuta, Katsuya Tsuruta, Toshiaki Kotani, Kenji Ohsawa
  • Publication number: 20120002370
    Abstract: A cooling device comprising a thermal diffusing unit operable to radiate heat taken from a heating element, and a heat transporting part, laminated in a thickness direction of the heat diffusing unit and diffused thereby. The thermal diffusing unit has an upper plate, a lower plate opposite thereto, a vapor diffusion path to diffuse an evaporated refrigerant, and a capillary channel to circulate a condensed refrigerant. The heat transporting part has an upper plate, a lower plate opposite thereto, a vapor diffusion path to diffuse an evaporated refrigerant, and a capillary channel to circulate a condensed refrigerant. Either the upper plate or the lower plate is formed with the same member of the lower plate or the upper plate of the heat transporting part.
    Type: Application
    Filed: March 12, 2010
    Publication date: January 5, 2012
    Applicant: MOLEX INCORPORATED
    Inventors: Kenji Ohsawa, Katsuya Tsuruta
  • Publication number: 20110214904
    Abstract: A heatsink is provided with a base body opposed to a heat generating body and absorbing heat from the heat generating body. Thermal resistance of that opposed portion of the base body which is opposed to the heat generating body is higher than thermal resistance of a surrounding portion surrounding the opposed portion.
    Type: Application
    Filed: February 2, 2009
    Publication date: September 8, 2011
    Applicant: Fuchigami Micro Co., Ltd
    Inventors: Kenji Ohsawa, Katsuya Tsuruta, Toshiaki Kotani, Kei Mizuta
  • Publication number: 20100189415
    Abstract: [Problems] An object of the present invention is to perform switching of audio and subtitle and so on automatically or by simple operation when a recording medium such as a DVD, on which a plurality of streams of audio and subtitle are recorded, is reproduced. [Means for Solving Problems] A playback pattern based on combination of streams of video, audio, and subtitle which was reproduced in the past is stored in a flash memory 12. Then, a microcontroller 10 makes an audio/video/subtitle processing section 7 reproduce a playback pattern based on combination of the streams different from the playback pattern stored in the flash memory 12.
    Type: Application
    Filed: January 16, 2007
    Publication date: July 29, 2010
    Applicant: PIONEER CORPORATION
    Inventor: Kenji Ohsawa
  • Publication number: 20080135214
    Abstract: A small and thin heat pipe with enhanced heat conductivity. Between an upper member having a grid-like upper concave portion on an inside lower surface and a lower member having a grid-like lower concave portion on an inside upper surface are provided intermediate plate members. The members are each formed with multiple vapor diffusion flow paths extending in a planar direction, communicating with the concave portions of the members, respectively. Thus, a sealed space is defined therebetween so that a refrigerant is enclosed therein. Capillary flow paths are formed through a portion of the members except where the vapor diffusion flow paths are formed such that the capillary flow paths extend vertically or both vertically and horizontally, communicating with the concave portions of the members.
    Type: Application
    Filed: August 31, 2006
    Publication date: June 12, 2008
    Applicant: FUCHIGAMI MICRO CO., LTD.
    Inventors: Kenji Ohsawa, Katsuya Tsuruta
  • Patent number: 7374104
    Abstract: In a memory card with a newly-added module for performing data communication, data communication is stably performed without receiving a noise effect. As an embodiment of the present invention, a memory card 100 has a thin-plate-shaped holding member 20, a memory section 24 provided as buried in the holding member 20, plural first connection pieces 2-10 connected to the memory section 24, a data communication section 26 provided as buried in the holding member 20, and two connection pieces 11, 12 connected to the data communication section 26. The two second connection pieces 11, 12 are disposed at the end of a row part R1 on which only the plural first connection pieces 2-10 are aligned. One first connection piece 10 positioned at the end of the row part R1 is a ground terminal. That is to say, in the plural first connection pieces 2-10, the first connection piece 10 adjacent to the second connection piece 11 is a ground terminal.
    Type: Grant
    Filed: October 21, 2005
    Date of Patent: May 20, 2008
    Assignees: Sony Corporation, Renesas Technology Corporation
    Inventors: Yoshitaka Aoki, Hideaki Bando, Keiichi Tsutsui, Hirotaka Nishizawa, Kenji Ohsawa, Takashi Totsuka
  • Publication number: 20070056711
    Abstract: A thin and flat type heat pipe with aced conductivity. Between an upper member 22 having a rectangular area 24b on a lower surface and a lower member 20 having a rectangular area 24a on an upper area are provided intermediate plate members 32, 30. The members 32, 30 are each formed with slits 8, constructing a vapor path extending a planar direction, communicating with e rectangular areas 24a, 24b of the members 22, 20, respectively. Thus, a sealed space is defined by the slits 8 and the rectangular areas 24a, 24b so tat a refrigerant is enclosed in the sealed space. Capillary holes 10 are formed through non-slitted portions of the intermediate plate members 32, 30 so that each capillary hole 10 serves as a capillary path of flow extending vertically to communicate with the rectangular areas 24a, 24b of the members 22, 20.
    Type: Application
    Filed: January 31, 2006
    Publication date: March 15, 2007
    Applicant: Fuchigami Mirco Co., Ltd.
    Inventor: Kenji Ohsawa
  • Publication number: 20060097060
    Abstract: In a memory card with a newly-added module for performing data communication, data communication is stably performed without receiving a noise effect. As an embodiment of the present invention, a memory card 100 has a thin-plate-shaped holding member 20, a memory section 24 provided as buried in the holding member 20, plural first connection pieces 2-10 connected to the memory section 24, a data communication section 26 provided as buried in the holding member 20, and two connection pieces 11, 12 connected to the data communication section 26. The two second connection pieces 11, 12 are disposed at the end of a row part R1 on which only the plural first connection pieces 2-10 are aligned. One first connection piece 10 positioned at the end of the row part R1 is a ground terminal. That is to say, in the plural first connection pieces 2-10, the first connection piece 10 adjacent to the second connection piece 11 is a ground terminal.
    Type: Application
    Filed: October 21, 2005
    Publication date: May 11, 2006
    Inventors: Yoshitaka Aoki, Hideaki Bando, Keiichi Tsutsui, Hirotaka Nishizawa, Kenji Ohsawa, Takashi Totsuka
  • Patent number: 6838368
    Abstract: In a semiconductor device, a plurality of wiring films are formed on a front surface of a base comprising an insulating resin and having electrode-forming holes, the surfaces of the wiring films and the surface of the base being positioned on the same plane and at least parts of the wiring films overlapping with the electrode-forming holes; a conductive material is embedded into the electrode-forming holes to form external electrodes on the back surface, away from the wiring films, of the base; a semiconductor element is positioned on the front surface of the base with an insulating film therebetween, the back surface of the semiconductor element being bonded to said front surface of the base; wires bond the electrodes of the semiconductor element to the corresponding wiring films; and a resin seals the wiring films and the wires.
    Type: Grant
    Filed: November 10, 2000
    Date of Patent: January 4, 2005
    Assignee: Sony Corporation
    Inventors: Kenji Ohsawa, Tomoshi Ohde
  • Patent number: 6563202
    Abstract: Metal films (for instance, gold films or palladium films) to constitute bumps are formed on a metal base by electrolytic plating. Then, a circuit wiring including inner leads is formed by electrolytic plating with a metal so that the inner leads are connected to the respective metal films.
    Type: Grant
    Filed: January 26, 2000
    Date of Patent: May 13, 2003
    Assignee: Sony Corporation
    Inventors: Kenji Ohsawa, Hidetoshi Kusano, Haruhiko Makino, Hideyuki Takahashi
  • Patent number: 6514847
    Abstract: In a semiconductor device, a plurality of wiring films are formed on a front surface of a base comprising an insulating resin and having electrode-forming holes, the surfaces of the wiring films and the surface of the base being positioned on the same plane and at least parts of the wiring films overlapping with the electrode-forming holes; a conductive material is embedded into the electrode-forming holes to form external electrodes on the back surface, away from the wiring films, of the base; a semiconductor element is positioned on the front surface of the base with an insulating film therebetween, the back surface of the semiconductor element being bonded to said front surface of the base; wires bond the electrodes of the semiconductor element to the corresponding wiring films; and a resin seals the wiring films and the wires.
    Type: Grant
    Filed: July 25, 2000
    Date of Patent: February 4, 2003
    Assignee: Sony Corporation
    Inventors: Kenji Ohsawa, Tomoshi Ohde