Abstract: A semiconductor module includes: a metal block; an insulation layer for heat radiation formed by directly depositing a ceramic material on at least a first surface of the metal block; an insulation layer for a relay electrode formed by directly depositing a ceramic material on a part of a second surface 1b of the metal block; a relay electrode formed by depositing a metal material on the upper surface of the insulation layer for the relay electrode; a circuit element bonded with the second surface of the metal block by solder; and an external lead terminal, wherein a bonding wire or a lead frame from the circuit element is bonded with the relay electrode, and the relay electrode and the external lead terminal are connected.

Abstract: A semiconductor device includes a molded body obtained by sealing, with a sealing material, a member including a semiconductor element, an insulating substrate which is bonded to one surface of the semiconductor element, and a printed circuit board which is used for a connection to an external circuit and is bonded to another surface of the semiconductor element. The sealing material includes a first sealing material which is a nanocomposite resin including an epoxy base resin, a curing agent, and an inorganic filler with an average particle size of 1 nm to 100 nm; and a second sealing material which is a thermosetting resin, a thermoplastic resin, or a mixture thereof without an inorganic filler. The sealing material is less likely to be degraded by thermal oxidation, even when the semiconductor element operates at a high temperature of 175° C. or higher, is crack resistant, and has high reliability and durability.

Abstract: A charge remaining in an electrostatic coater when power supply to the electrostatic coater is stopped is neutralized at an early stage. A rotary atomizing head 102 receives a high voltage of negative polarity from a cascade 104. An electrostatic coater 100 further includes a second high-voltage generator 110 that generates a high voltage of positive polarity. The second high-voltage generator 110 is composed of a Cockcroft-Walton circuit. The Cockcroft-Walton circuit is composed of diodes and capacitors. A high voltage of the electrostatic coater 100 is controlled by a controller 10. Immediately after running of the electrostatic coater 100 is stopped by stopping power supply to the cascade 104, power is supplied to the second high-voltage generator 110. The high voltage of positive polarity generated by the second high-voltage generator 110 is supplied to the rotary atomizing head 102 for a predetermined time period.

Abstract: A blade control system includes an angle obtaining part, an open ratio setting part and a lift cylinder controlling part. The angle obtaining part is configured to obtain an angle of a lift frame with respect to a designed surface. The open ratio setting part is configured to set an open ratio based on the angle. The lift cylinder controlling part is configured to open a proportional control valve at the open ratio for elevating the blade when a distance between the designed surface and an edge of a blade is determined to be less than or equal to a threshold.

Abstract: An electronic-component mounting system includes: mounting lines each including an electronic-component mounting apparatus; an operation information processor which collects operation information of the electronic-component mounting apparatus, applies a statistical process on the operation information, and produces operation quality information of the mounting lines; and a portable information terminal accessible to the operation information processor by wireless communication. An identification information transmission section which transmits identification information for identifying each of the mounting lines is disposed in each mounting line, and a reception section which receives the identification information is disposed in the portable information terminal.

Abstract: In mounting position correction of detecting a position of printed solder, calculating a positional-shift amount between a position of an electrode and the position of the printed solder, and correcting a mounting position based on the calculated positional-shift amount, when a correction amount based on the calculated positional-shift amount exceeds a limit value which indicates an upper limit of the correction amount which is defined and allowed in mounting information, the electronic component is mounted on the mounting position which is corrected by considering the limit value as the correction amount. Accordingly, it is possible to appropriately employ mounting position correction by considering a solder printing position as a reference in accordance with the degree of printing position shift, and to obtain an expected joint quality improvement effect.

Abstract: An electronic component is mounted on a substrate according to a mounting mode which is set in advance in the following mounting information when component mounting work is performed. In the mounting information, any one of a first mounting mode in which an electronic component is transferred and mounted to a mounting position which is corrected based on a positional-shift amount between a position of printed solder and a position of an electrode and a second mounting mode in which the electronic component is transferred and mounted to the mounting position by considering only the position of the electrode as a reference, is set as a mounting mode for performance for each electronic component.

Abstract: An optical pickup device includes a light source configured to output laser light, an objective lens configured to converge the laser light emitted from the light source onto an optical disc, a sensor lens including a lens surface on which return light reflected by the optical disc is incident and that is also configured to generate an astigmatism in the return light, and a light-receiving element configured to receive the return light which has passed through the sensor lens 40 and to generate a focus error signal based on the received return light. The lens surface includes a first curvature radius in a first direction and a second curvature radius different from the first curvature radius in a second direction that is perpendicular or substantially perpendicular to the first direction.

Abstract: A direct-viewing type display device (100) includes: first and second display panels (10a, 20a); and a joint region (10Jab) containing a linking portion (10ab) which links together the first frame region (10aF) and the second frame region (10bF) and containing the first and second frame regions (10aF, 10bF). The first display region (10aD) of the first display panel (10a) has a first peripheral display region (10aDPa) which adjoins the first frame region (10aF) and a first middle display region (10aDC) which adjoins the first peripheral display region (10aDPa). Each region has a plurality of unit-regions, and an average luminance LPa of a plurality of first peripheral unit-display regions (10aDPa-UA) contained in the first peripheral display region (10aDPa) is higher than an average luminance LCa of a plurality of first middle unit-display regions (10aDC-UA) contained in the first middle display region (10aDC).

Abstract: A sheet feeder includes an air blower adapted to blow air onto an end face of a stacked sheet bundle to thereby float the sheets of the sheet bundle, a conveying section adapted to convey the uppermost floated sheet, a brightness measuring section adapted to measure brightness of light reflected from the end face of the sheet bundle at two or more points in the height direction of the sheet bundle, a determination unit adapted to determine, based on the brightness of each point measured by the brightness measuring section, whether or not the air blowing amount of the air blower is appropriate, and a controller adapted to control the air blowing amount of the air blower based on the determination of the determination unit.

Abstract: An electronic component mounting system includes a screen printing apparatus, a coating unit and an electronic component mounting apparatus. The screen printing apparatus supplies a solder paste to a plurality of first lands among lands of a board, using a mask plate including pattern holes formed so as to correspond to the plurality of first lands. The coating unit includes a discharge port for discharging the solder paste, and coats the solder paste through the discharge port on a plurality of second lands other than the plurality of first lands on the board to which the solder paste is supplied through the screen printing apparatus. The electronic component mounting apparatus mounts the electronic components on the first and second lands to which the solder paste is supplied through the screen printing apparatus and the coating unit.

Abstract: An electronic component mounting system includes a screen printing apparatus, a coating unit and an electronic component mounting apparatus. The screen printing apparatus supplies a solder paste to first specific lands of a board, using a mask plate that includes a stepped portion and pattern holes formed so as to correspond to the first specific lands. The coating unit coats the solder paste on second specific lands of the board which are positioned in a region of the board overlapping the stepped portion of the mask plate and a vicinity of the stepped portion when the screen printing apparatus supplies the solder paste using the mask plate. The electronic component mounting apparatus mounts the electronic components on the first and second specific lands to which the solder paste is supplied through the screen printing apparatus and the coating unit.

Abstract: A resin composition for obtaining a cured resin material exhibiting improved heat resistance and a higher glass transition temperature is disclosed. The resin composition contains a resin selected from a) a thermosetting resin and a curing agent, or b) a thermoplastic resin, and an inorganic filler with an average particle diameter of 1000 nm or less.

Abstract: A highly thermally conductive printed circuit board prevents electrochemical migration by inhibiting elution of copper ions. The printed circuit board is a metal-base printed circuit board including a metal base plate having an insulating resin layer and a copper foil layer stacked thereon in this order. In the printed circuit board, the insulating resin layer contains a first inorganic filler made of inorganic particles having particle diameters of 0.1 nm to 600 nm with an average particle diameter (D50) of 1 nm to 300 nm, and a second inorganic filler made of inorganic particles having particle diameters of 100 nm to 100 ?m with an average particle diameter (D50) of 500 nm to 20 ?m, and the first inorganic filler and the second inorganic filler are uniformly dispersed in the insulating resin layer.

Abstract: A blood flow image diagnosis device which diagnoses a blood flow map by separating, on the basis of a plurality of blood flow maps covering a specified time including one or more cardiac beats, a blood flow of a surface layer blood vessel observed in a surface layer in an observation region of a body tissue from a background blood flow of a peripheral background region. The device distinguishably displays a first blood flow map of the surface layer blood vessel and a second blood flow map of the background blood flow. The device calculates and compares information on a blood flow including blood flow value, blood flow waveform, or blood vessel diameter in the first and second blood flow maps, and displays the calculated information.

Abstract: When a blade load is reduced from a value greater than or equal to a first set load value to a value less than the first set load value, a blade control device is configured to set a virtual designed surface to be closer to a blade than a designed surface is, and is configured to allow the blade to pivot above the virtual designed surface.

Abstract: A time period required for replacement work of a divided cable is shortened. An electrostatic coating cable (6) includes a power supply line (12) that supplies power to a high voltage generator (2), a signal line (14) that controls the high voltage generator (2), and a ground line (16). The power supply line (12) and the ground line (16) are connected by a first inspection line (18), the signal line (14) and the ground wire (16) are connected by a second inspection line (20), a first diode (22) is interposed in the first inspection line (18), and a second diode (24) is interposed in the second inspection line (20). The first and the second diodes (22) and (24) inhibit a current from flowing through the first and the second inspection lines (18) and (20) during an operation of the electrostatic coater (1).

Abstract: A semiconductor module includes: a metal block; an insulation layer for heat radiation formed by directly depositing a ceramic material on at least a first surface of the metal block; an insulation layer for a relay electrode formed by directly depositing a ceramic material on a part of a second surface 1b of the metal block; a relay electrode formed by depositing a metal material on the upper surface of the insulation layer for the relay electrode; a circuit element bonded with the second surface of the metal block by solder; and an external lead terminal, wherein a bonding wire or a lead frame from the circuit element is bonded with the relay electrode, and the relay electrode and the external lead terminal are connected.

Abstract: A soldering flux is disclosed which exhibits improved shape retention properties during printing, can inhibit sagging upon heating, and exhibits high electrical reliability between conductors. The soldering flux contains an epoxy resin, an organic carboxylic acid and, as a heat-resistant shape-retaining agent, and a plastic having a linear structure, wherein the epoxy resin and the organic carboxylic acid are blended so that the quantity of carboxyl groups in the organic carboxylic acid is 0.8 to 2.0 equivalents relative to 1.0 equivalent of epoxy groups in the epoxy resin, and the total quantity of the epoxy resin, the organic carboxylic acid and the plastic having a linear structure is 70 mass % or more relative to the total mass of the flux.

Abstract: When a blade load is reduced from a value greater than or equal to a first set load value to a value less than the first set load value, a blade control device is configured to set a virtual designed surface to be closer to a blade than a designed surface is, and is configured to allow the blade to pivot above the virtual designed surface.