Patents by Inventor Kenji SUGAKAWA

Kenji SUGAKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10985132
    Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
    Type: Grant
    Filed: July 14, 2020
    Date of Patent: April 20, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yoshitaka Otsuka, Takashi Nakamitsu, Yosuke Omori, Kenji Sugakawa
  • Publication number: 20210035827
    Abstract: A substrate processing apparatus includes a holder having thereon an attraction surface configured to attract a substrate and including an outer attracting member configured to attract a peripheral portion of the substrate and an inner attracting member configured to attract a portion of the substrate inside the peripheral portion of the substrate attracted by the outer attracting member in a diametrical direction of the attraction surface; a moving device configured to move the outer attracting member with respect to the inner attracting member; and a controller configured to control a distortion, which is caused at the substrate attracted to the attraction surface, by controlling a movement of the outer attracting member with respect to the inner attracting member.
    Type: Application
    Filed: January 11, 2019
    Publication date: February 4, 2021
    Inventors: Kimio Motoda, Norifumi Kohama, Norio Wada, Yosuke Omori, Kenji Sugakawa
  • Patent number: 10847495
    Abstract: A bonding system includes a surface modifying apparatus, a surface hydrophilizing apparatus and a bonding apparatus. The surface modifying apparatus is configured to modify a bonding surface of a first substrate and a bonding surface of a second substrate with plasma. The surface hydrophilizing apparatus is configured to hydrophilize the modified bonding surfaces of the first substrate and the second substrate. The bonding apparatus includes a condensation suppressing gas discharge unit, and is configured to bond the hydrophilized bonding surfaces of the first substrate and the second substrate by an intermolecular force. The condensation suppressing gas discharge unit is configured to discharge a condensation suppressing gas toward a space between a peripheral portion of the bonding surface of the first substrate and a peripheral portion of the bonding surface of the second substrate facing each other.
    Type: Grant
    Filed: April 4, 2019
    Date of Patent: November 24, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Atsushi Nagata, Hiroshi Maeda, Kenji Sugakawa
  • Publication number: 20200365442
    Abstract: A substrate processing apparatus includes a holder having thereon an attraction surface configured to attract a substrate and including, as multiple regions in which attracting pressures for attracting the substrate are controlled independently, a first region having a circular shape and a second region having an annular shape and disposed at an outside of the first region in a diametrical direction; multiple attracting pressure generators configured to independently generate the attracting pressures respectively in the multiple regions forming the attraction surface; multiple attracting pressure adjusters configured to independently adjust the attracting pressures respectively generated by the attracting pressure generators; and a controller configured to control the multiple attracting pressure generators and the multiple attracting pressure adjusters. The controller generates different attracting pressures in at least a part of the first region and in at least a part of the second region.
    Type: Application
    Filed: January 9, 2019
    Publication date: November 19, 2020
    Inventors: Kenji Sugakawa, Yosuke Omori
  • Publication number: 20200343216
    Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
    Type: Application
    Filed: July 14, 2020
    Publication date: October 29, 2020
    Inventors: Yoshitaka OTSUKA, Takashi NAKAMITSU, Yosuke OMORI, Kenji SUGAKAWA
  • Patent number: 10756046
    Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: August 25, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yoshitaka Otsuka, Takashi Nakamitsu, Yosuke Omori, Kenji Sugakawa
  • Publication number: 20190385971
    Abstract: Deformation of substrates after the substrates are bonded can be suppressed. A bonding apparatus includes a first holding unit configured to attract and hold a first substrate from above; a second holding unit provided under the first holding unit and configured to attract and hold a second substrate from below; and a striker configured to press a central portion of the first substrate from above and bring the first substrate into contact with the second substrate. The first holding unit is configured to attract and hold a partial region of a peripheral portion of the first substrate, and the first holding unit attracts and holds the region which intersects with a direction, among directions from the central portion of the first substrate toward the peripheral portion thereof, in which a bonding region between the first substrate and the second substrate is expanded faster.
    Type: Application
    Filed: August 30, 2019
    Publication date: December 19, 2019
    Inventors: Yosuke Omori, Kenji Sugakawa
  • Publication number: 20190385973
    Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
    Type: Application
    Filed: August 28, 2019
    Publication date: December 19, 2019
    Inventors: Yoshitaka OTSUKA, Takashi NAKAMITSU, Yosuke OMORI, Kenji SUGAKAWA
  • Publication number: 20190312007
    Abstract: A bonding system includes a surface modifying apparatus, a surface hydrophilizing apparatus and a bonding apparatus. The surface modifying apparatus is configured to modify a bonding surface of a first substrate and a bonding surface of a second substrate with plasma. The surface hydrophilizing apparatus is configured to hydrophilize the modified bonding surfaces of the first substrate and the second substrate. The bonding apparatus includes a condensation suppressing gas discharge unit, and is configured to bond the hydrophilized bonding surfaces of the first substrate and the second substrate by an intermolecular force. The condensation suppressing gas discharge unit is configured to discharge a condensation suppressing gas toward a space between a peripheral portion of the bonding surface of the first substrate and a peripheral portion of the bonding surface of the second substrate facing each other.
    Type: Application
    Filed: April 4, 2019
    Publication date: October 10, 2019
    Inventors: Atsushi Nagata, Hiroshi Maeda, Kenji Sugakawa
  • Patent number: 10438920
    Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: October 8, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yoshitaka Otsuka, Takashi Nakamitsu, Yosuke Omori, Kenji Sugakawa
  • Patent number: 10438918
    Abstract: Deformation of substrates after the substrates are bonded can be suppressed. A bonding apparatus includes a first holding unit configured to attract and hold a first substrate from above; a second holding unit provided under the first holding unit and configured to attract and hold a second substrate from below; and a striker configured to press a central portion of the first substrate from above and bring the first substrate into contact with the second substrate. The first holding unit is configured to attract and hold a partial region of a peripheral portion of the first substrate, and the first holding unit attracts and holds the region which intersects with a direction, among directions from the central portion of the first substrate toward the peripheral portion thereof, in which a bonding region between the first substrate and the second substrate is expanded fastest.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: October 8, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Yosuke Omori, Kenji Sugakawa
  • Publication number: 20180158796
    Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
    Type: Application
    Filed: November 27, 2017
    Publication date: June 7, 2018
    Inventors: Yoshitaka OTSUKA, Takashi NAKAMITSU, Yosuke OMORI, Kenji SUGAKAWA
  • Publication number: 20180047699
    Abstract: Deformation of substrates after the substrates are bonded can be suppressed. A bonding apparatus includes a first holding unit configured to attract and hold a first substrate from above; a second holding unit provided under the first holding unit and configured to attract and hold a second substrate from below; and a striker configured to press a central portion of the first substrate from above and bring the first substrate into contact with the second substrate. The first holding unit is configured to attract and hold a partial region of a peripheral portion of the first substrate, and the first holding unit attracts and holds the region which intersects with a direction, among directions from the central portion of the first substrate toward the peripheral portion thereof, in which a bonding region between the first substrate and the second substrate is expanded fastest.
    Type: Application
    Filed: August 7, 2017
    Publication date: February 15, 2018
    Inventors: Yosuke Omori, Kenji Sugakawa
  • Patent number: 9741595
    Abstract: There is provided a method of bonding substrates to each other, which includes: holding a first substrate on a lower surface of a first holding part; adjusting a temperature of a second substrate by a temperature adjusting part to become higher than a temperature of the first substrate; holding the second substrate on an upper surface of a second holding part; inspecting a state of the second substrate by imaging a plurality of reference points of the second substrate with a first imaging part, measuring positions of the reference points, and comparing a measurement result with a predetermined permissible range; and pressing a central portion of the first substrate with a pressing member, bringing the central portion of the first substrate into contact with a central portion of the second substrate, and sequentially bonding the first substrate and the second substrate.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: August 22, 2017
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Kenji Sugakawa, Yuji Mimura, Shuhei Matsumoto, Takahiro Masunaga, Makoto Tsukishima
  • Publication number: 20160155721
    Abstract: There is provided a method of bonding substrates to each other, which includes: holding a first substrate on a lower surface of a first holding part; adjusting a temperature of a second substrate by a temperature adjusting part to become higher than a temperature of the first substrate; holding the second substrate on an upper surface of a second holding part; inspecting a state of the second substrate by imaging a plurality of reference points of the second substrate with a first imaging part, measuring positions of the reference points, and comparing a measurement result with a predetermined permissible range; and pressing a central portion of the first substrate with a pressing member, bringing the central portion of the first substrate into contact with a central portion of the second substrate, and sequentially bonding the first substrate and the second substrate.
    Type: Application
    Filed: November 24, 2015
    Publication date: June 2, 2016
    Inventors: Kenji SUGAKAWA, Yuji MIMURA, Shuhei MATSUMOTO, Takahiro MASUNAGA, Makoto TSUKISHIMA