Patents by Inventor Kenji Yanagisawa

Kenji Yanagisawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120155823
    Abstract: A two-layer optical waveguide includes a core layer having a first surface and a second surface opposite to the first surface, and a cladding layer laminated on the first surface of the core layer. The two-layer optical waveguide further includes a mirror structure provided at a plurality of positions on the first surface of the core layer, the mirror structure directing a light signal which travels in the core layer, toward the second surface of the core layer. Each mirror structure includes an inclined plane formed on the first surface of the core layer, and a metal film formed on the inclined plane.
    Type: Application
    Filed: December 14, 2011
    Publication date: June 21, 2012
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Kazunao YAMAMOTO, Hideki Yonekura, Kenji Yanagisawa, Takanori Yamamoto
  • Publication number: 20120141063
    Abstract: A method of manufacturing an optical waveguide, includes preparing a light path conversion component including a structure in which a protruding portion having a light path conversion inclined surface is covered with a metal layer and the metal layer serves as a light path conversion mirror, and a structural body in which a core layer is formed on a first cladding layer and an opening portion is provided in an end side of a light path of the core layer, arranging the light path conversion mirror of the light path conversion component in the opening portion of the core layer, and forming a second cladding layer covering the core layer, wherein a light path of a light that propagates through the core layer is converted toward a first cladding layer side by the light path conversion mirror.
    Type: Application
    Filed: December 1, 2011
    Publication date: June 7, 2012
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Kazunao YAMAMOTO, Hideki Yonekura, Kenji Yanagisawa, Takanori Yamamoto
  • Publication number: 20120134632
    Abstract: A method of manufacturing an optical waveguide, includes forming a first cladding layer on a substrate, forming a core layer on the first cladding layer, forming a groove portion including a light path conversion inclined surface by processing the core layer in a thickness direction, and forming a second cladding layer in which a light path conversion hole is arranged on the light path conversion inclined surface on the first cladding layer and the core layer.
    Type: Application
    Filed: November 22, 2011
    Publication date: May 31, 2012
    Inventors: Takanori YAMAMOTO, Hideki YONEKURA, Kenji YANAGISAWA, Kazunao YAMAMOTO
  • Publication number: 20110286692
    Abstract: A method of manufacturing an optical waveguide device, includes obtaining an optical waveguide by forming sequentially a first cladding layer, a core layer, and a second cladding layer on a substrate, forming a groove portion including a light path conversion inclined surface and a sidewall surface which intersects with it, and the groove portion dividing the second cladding layer and the core layer, on both end sides of the optical waveguide respectively, forming selectively a metal layer on the light path conversion inclined surface and the sidewall surface of the groove portion, forming a protection insulating layer sealing the metal layer on the optical waveguide, and obtaining a light path conversion mirror that the metal layer is formed on the light path conversion inclined surface, by forming a concave portion which penetrates the core layer from the protection insulating layer to remove the metal layer formed on the sidewall surface of the groove portion.
    Type: Application
    Filed: April 27, 2011
    Publication date: November 24, 2011
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Kenji YANAGISAWA
  • Patent number: 8041159
    Abstract: An optical/electrical hybrid substrate is provided. The optical/electrical substrate includes: a wiring substrate; an optical waveguide disposed on the wiring substrate and configured to transmit an optical signal; a mirror support bonded onto the wiring substrate with an adhesive and being made of glass or silicon; and a mirror which reflects the optical signal and which is formed on an inclined surface of the mirror support.
    Type: Grant
    Filed: January 23, 2009
    Date of Patent: October 18, 2011
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventor: Kenji Yanagisawa
  • Publication number: 20110188802
    Abstract: An optical waveguide board includes: an optical waveguide configured to transmit an optical signal to and from a light receiving element and a light emitting element; wiring patterns that are electrically connected with the light receiving and emitting elements, respectively; and supporting members disposed on the wiring patterns on sides of end parts of the optical waveguide, the supporting members supporting the light receiving and emitting elements, respectively; wherein each of the supporting members includes: a conduction portion that electrically connects a corresponding one of the light receiving and emitting elements and the wiring pattern; and a smooth surface configured to reflect the optical signal appearing between the corresponding one of the light receiving and emitting elements and the optical waveguide.
    Type: Application
    Filed: December 16, 2010
    Publication date: August 4, 2011
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Kenji YANAGISAWA
  • Publication number: 20110129182
    Abstract: An optical waveguide device includes a wiring substrate, an optical waveguide bonded on the wiring substrate and having a light path conversion inclined surface on both ends, and a light path conversion mirror formed to contact the light path conversion inclined surface of the optical waveguide and formed of a light reflective resin layer or a metal paste layer. In case the light reflective resin layer is used as the light path conversion mirror, the light reflective resin layer may be formed partially only on the side of the light path conversion inclined surface, or may be formed on the whole of the wiring substrate to coat the optical waveguide.
    Type: Application
    Filed: November 15, 2010
    Publication date: June 2, 2011
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD
    Inventors: Takanori YAMAMOTO, Kenji Yanagisawa, Kazunao Yamamoto, Hideki Yonekura
  • Publication number: 20110007998
    Abstract: An optical waveguide includes first cores provided on a first clad layer, second cores provided on a second clad layer, and a common clad layer interposed between the first and second clad layers and opposing the first and second cores, and the first cores are separated from the second cores.
    Type: Application
    Filed: July 2, 2010
    Publication date: January 13, 2011
    Inventors: Takanori YAMAMOTO, Kenji Yanagisawa, Hideki Yonekura
  • Patent number: 7865052
    Abstract: An optical waveguide includes: a first clad layer; a core layer formed on the first clad layer; a second clad layer formed on the core layer; and an optical transmission direction changing part. The optical transmission direction changing part is configured and arranged to change a transmission direction of a light transmitting through the core layer. The optical transmission direction changing part penetrates through the core layer. An optical transmission direction changing surface of the optical transmission direction changing part inclines relative to a predetermined reference plane by a predetermined angle.
    Type: Grant
    Filed: March 27, 2009
    Date of Patent: January 4, 2011
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Hideki Yonekura, Takanori Yamamoto, Kazunao Yamamoto, Kenji Yanagisawa
  • Publication number: 20100323297
    Abstract: A via hole is formed in a first cladding layer laminated on a wiring board. A conductive material is filled in the via hole so as to form a first conductor portion (a portion of a conductive via) having a mushroom-like shape projecting from a surface of the first cladding layer. Then, a second cladding layer is formed to cover the first conductor portion, the first cladding layer and a core layer, and a via hole is formed in the second cladding layer. A conductive material is filled in the via hole so as to form a second conductor portion (a remaining portion of the conductive via) connected to the first conductor portion.
    Type: Application
    Filed: June 14, 2010
    Publication date: December 23, 2010
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Kenji YANAGISAWA
  • Patent number: 7796851
    Abstract: A manufacturing method of an optical waveguide, the optical waveguide including a first clad layer; a core layer formed on the first clad layer and configured to propagate light; a second clad layer formed on the first clad layer so as to cover the core layer; and a light propagation direction changing part configured to change a propagation direction of the light propagating in the core layer; the manufacturing method of the optical waveguide includes the steps of forming a concave part penetrating the first clad layer and the core layer; and inserting the light propagation direction changing part into the concave part so that a light propagation direction changing surface of the light propagation direction changing part forms a predetermined inclination angle to a predetermined reference plane.
    Type: Grant
    Filed: March 25, 2009
    Date of Patent: September 14, 2010
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Hideki Yonekura, Takanori Yamamoto, Kazunao Yamamoto, Kenji Yanagisawa
  • Patent number: 7747111
    Abstract: Openings are disposed in an insulating layer to expose a conductor layer. A lower cladding layer is formed, and a resist layer is formed on an insulating layer and the lower cladding layer. Electrolytic plating is performed with using the conductor layer which is connected to the external, as an electrode, to fill openings passing through the lower cladding layer and the resist layer with Cu. The resist layer is removed away to form projections configured by the filled Cu. The projections are processed to have an inclined face. Au layers are formed on the inclined faces of the projection. A core layer and an upper cladding layer are stacked.
    Type: Grant
    Filed: September 11, 2008
    Date of Patent: June 29, 2010
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventor: Kenji Yanagisawa
  • Publication number: 20100142904
    Abstract: An optical waveguide is provided. The optical waveguide includes: a layered structure including: a first cladding layer; a second cladding layer; and a core layer that is sandwiched between the first cladding layer and the second cladding layer, wherein an inclined surface is formed on at least one longitudinal end of the layered structure; and an outer cladding layer that seals at least a portion of the inclined surface corresponding to the core layer, wherein a refractive index of the outer cladding layer is smaller than that of the core layer.
    Type: Application
    Filed: December 7, 2009
    Publication date: June 10, 2010
    Applicant: Shinko Electric Industries Co., Ltd.
    Inventor: Kenji YANAGISAWA
  • Patent number: 7734124
    Abstract: An optical waveguide includes an optical waveguide main body and mirrors. The optical waveguide main body includes a first cladding layer, a second cladding layer and a core portion provided between the first cladding layer and the second cladding layer. The optical waveguide main body has a first region in which the core portion and the mirrors are arranged and the light signal is transmitted, and a second region arranged on both sides of the first region and not contributing to a transmission of a light signal. Through vias that pass through the optical waveguide main body is provided in the second region. The first region on a side that faces the light emitting element or the light receiving element is protruded larger than the second region on a side that faces the light emitting element or the light receiving element.
    Type: Grant
    Filed: May 9, 2008
    Date of Patent: June 8, 2010
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Hideki Yonekura, Kazunao Yamamoto, Takanori Yamamoto, Kenji Yanagisawa
  • Patent number: 7720327
    Abstract: A lower cladding layer is formed on a surface of an electrical circuit substrate. A UV curable resin layer is stacked on the lower cladding layer. The resin layer is partly cured, and the other uncured resin layer is removed, thereby forming resin projections. The resin projections are processed so as to have an inclined face. Metal reflecting layers are formed on the inclined faces. A core layer is stacked on the lower cladding layer and the metal reflecting layers, and an upper cladding layer is stacked on the core layer.
    Type: Grant
    Filed: September 12, 2008
    Date of Patent: May 18, 2010
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventor: Kenji Yanagisawa
  • Patent number: D614693
    Type: Grant
    Filed: October 7, 2008
    Date of Patent: April 27, 2010
    Assignee: Seiko Epson Corporation
    Inventors: Hideki Kato, Mugio Kawasaki, Manabu Kawahara, Kenji Yanagisawa, Kenji Oshima
  • Patent number: D630679
    Type: Grant
    Filed: September 10, 2009
    Date of Patent: January 11, 2011
    Assignee: Seiko Epson Corporation
    Inventors: Ichiro Yoshioka, Kenji Yanagisawa, Hiroto Miyauchi, Tomoyuki Mokuo, Hidenori Harada
  • Patent number: D634358
    Type: Grant
    Filed: September 10, 2009
    Date of Patent: March 15, 2011
    Assignee: Seiko Epson Corporation
    Inventors: Ichiro Yoshioka, Kenji Yanagisawa, Hiroto Miyauchi, Tomoyuki Mokuo, Hidenori Harada
  • Patent number: D648378
    Type: Grant
    Filed: October 18, 2010
    Date of Patent: November 8, 2011
    Assignee: Seiko Epson Corporation
    Inventors: Takaaki Ishikawa, Yukiko Koshi, Kenji Yanagisawa
  • Patent number: D648379
    Type: Grant
    Filed: October 18, 2010
    Date of Patent: November 8, 2011
    Assignee: Seiko Epson Corporation
    Inventors: Takaaki Ishikawa, Kenji Yanagisawa, Yukiko Koshi