Patents by Inventor Kenjiro Takanishi

Kenjiro Takanishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMPOSITE PRINTED WIRING BOARD AND METHOD OF MANUFACTURING COMPOSITE PRINTED WIRING BOARD
    Publication number: 20240334597
    Abstract: A composite printed wiring board includes a first printed wiring board, a second printed wiring board, an intermediate plate, a first bonding layer, and a second bonding layer. The intermediate plate is provided to surround a space. The first printed wiring board closes one side of the space and is bonded to the intermediate plate. The second printed wiring board closes the other side of the space and is bonded to the intermediate plate. At least any of the first printed wiring board and the second printed wiring board has a through hole. A cavity is provided that is the space surrounded by the first printed wiring board, the second printed wiring board, the intermediate plate, the first bonding layer, and the second bonding layer. The through hole in communication with the cavity.
    Type: Application
    Filed: September 14, 2022
    Publication date: October 3, 2024
    Applicant: Mitsubishi Electric Corporation
    Inventors: Tatsuya SAKAMOTO, Kenjiro TAKANISHI, Hitoshi ARAI, Hiroshi GOTO, Akihito HIRAI
  • Antenna
    Patent number: D1028951
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: May 28, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kei Yokokawa, Narihiro Nakamoto, Toru Fukasawa, Hitoshi Arai, Tomohiro Takahashi, Kensuke Iwaki, Takamichi Kono, Keisuke Fujiwara, Kenjiro Takanishi, Tatsuya Sakamoto, Naoya Noguchi