Abstract: A thermal management module comprising a heat exchanger and an expansion valve assembly is disclosed. The heat exchanger includes a plurality of first plates and a plurality of second plates disposed between two end plates. The first and second plates are alternatingly arranged in a stacked relationship. A divider plate is disposed between one of the first plates and an adjacent one of the second plates to divide the heat exchanger into a first portion (e.g., internal heat exchanger) and a second portion (e.g., chiller). When in the stacked relationship, the plates define at least a first flow path for a relatively high-pressure, high-temperature first fluid from a first circuit (e.g., a liquid refrigerant), a second flow path for a relatively low-pressure, low-temperature first fluid from the first circuit (e.g., liquid refrigerant), and a third flow path for a second fluid from a second circuit (e.g., coolant).

Abstract: A heat exchanger comprising a plurality of first plates and a plurality of second plates disposed between two end plates. The first plates and the second plates are alternatingly arranged in a stacked relationship. When in the stacked relationship, the first and second plates form at least a first flow path for a first fluid/medium, a second flow path for a second fluid/medium, and a third flow path for a third fluid/medium.

Abstract: A heat exchanger comprising a plurality of first plates and a plurality of second plates disposed between two end plates. The first plates and the second plates are alternatingly arranged in a stacked relationship. When in the stacked relationship, the arrangement of the first and second plates defines a first flow path for a first fluid and at least one of a second flow path for a second fluid and a third flow path for a third fluid.

Abstract: A cold plate assembly includes a cold plate block having a first surface and a second surface opposite the first surface. The cold plate block is configured to mount a heat source thereto. A channel is formed in the first surface of the cold plate block. A cover plate covers the channel. A thermal interface material layer is disposed on the cover plate.