Patents by Inventor Kenneth D. Cornett
Kenneth D. Cornett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11034573Abstract: A fuel dispensing system includes a fuel tank adapted to contain a quantity of fuel. A fuel dispenser in is fluid communication with the fuel tank via piping. A pump is operative to transfer fuel from the fuel tank to the fuel dispenser. A corrosive detection assembly operative to identify presence of a corrosive substance in the fuel is also provided. The corrosive detection assembly has at least one thermoelectric detector positioned to be in contact with fuel vapor in the fuel dispensing system, the thermoelectric detector producing a detector signal indicating presence of the corrosive substance. Electronics are in electrical communication with the thermoelectric detector, the electronics being operative to interpret the detector signal and produce an output if the corrosive substance is present. The at least one thermoelectric detector may comprises a plurality of thermoelectric detectors at different locations in the fuel dispensing system.Type: GrantFiled: August 29, 2018Date of Patent: June 15, 2021Assignee: VEEDER-ROOT COMPANYInventors: James T. Bevins, Donald Kunz, Lawrence Hunter, Kenneth D. Cornett, Adriano Baglioni, Gaston Berrio
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Publication number: 20190281841Abstract: Flour compositions that are free of gluten, grain, eggs and dairy are disclosed using a macronutrient level process and choosing gluten free and grain free ingredients that provide a macronutrient level as close to wheat flour as possible. Disclosed are gluten free and grain free flour products that closely match the macronutrient level of the wheat flour as well as other desirable attributes of a flour composition and products made therefrom.Type: ApplicationFiled: December 9, 2018Publication date: September 19, 2019Inventors: LORI WEISENBACH CORNETT, KENNETH D. CORNETT
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Patent number: 10239745Abstract: Systems and methods for preventing biocorrosion of fuel handling components located in a sump in a fuel dispensing environment. One method includes exposing a hygroscopic material to moisture-laden air in the sump such that the hygroscopic material deliquesces into a liquid solution and exposing a buffer material to ethanol-blended fuel vapors in the sump. The method also includes collecting the liquid solution in a reservoir and monitoring the level of the liquid solution in the reservoir using a liquid level sensor. Further, the method includes notifying service personnel of the level of the liquid solution in the reservoir.Type: GrantFiled: January 18, 2017Date of Patent: March 26, 2019Assignee: Veeder-Root CompanyInventors: Kenneth D. Cornett, Kent Reid
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Publication number: 20190062142Abstract: A fuel dispensing system includes a fuel tank adapted to contain a quantity of fuel. A fuel dispenser in is fluid communication with the fuel tank via piping. A pump is operative to transfer fuel from the fuel tank to the fuel dispenser. A corrosive detection assembly operative to identify presence of a corrosive substance in the fuel is also provided. The corrosive detection assembly has at least one thermoelectric detector positioned to be in contact with fuel vapor in the fuel dispensing system, the thermoelectric detector producing a detector signal indicating presence of the corrosive substance. Electronics are in electrical communication with the thermoelectric detector, the electronics being operative to interpret the detector signal and produce an output if the corrosive substance is present. The at least one thermoelectric detector may comprises a plurality of thermoelectric detectors at different locations in the fuel dispensing system.Type: ApplicationFiled: August 29, 2018Publication date: February 28, 2019Inventors: James T. Bevins, Donald Kunz, Lawrence Hunter, Kenneth D. Cornett, Adriano Baglioni
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Patent number: 9718666Abstract: Systems and methods for regulating the flow rate of fluid at a fluid dispensing nozzle. In one embodiment, a nozzle includes a body, a spout coupled with the body, and at least one fluid flow path disposed within the body. The at least one fluid flow path is configured for fluid communication with a fluid dispensing hose. An ultrasonic transducer is disposed within the body and operatively coupled with the at least one flow path. Control electronics are in electronic communication with the ultrasonic transducer. The control electronics are operative to cause the ultrasonic transducer to transmit ultrasonic waves into the at least one fluid flow path. The ultrasonic waves are modulated with information representative of a desired fluid flow rate.Type: GrantFiled: December 9, 2015Date of Patent: August 1, 2017Assignee: Veeder-Root CompanyInventor: Kenneth D. Cornett
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Publication number: 20170203952Abstract: Systems and methods for preventing biocorrosion of fuel handling components located in a sump in a fuel dispensing environment. One method includes exposing a hygroscopic material to moisture-laden air in the sump such that the hygroscopic material deliquesces into a liquid solution and exposing a buffer material to ethanol-blended fuel vapors in the sump. The method also includes collecting the liquid solution in a reservoir and monitoring the level of the liquid solution in the reservoir using a liquid level sensor. Further, the method includes notifying service personnel of the level of the liquid solution in the reservoir.Type: ApplicationFiled: January 18, 2017Publication date: July 20, 2017Inventors: Kenneth D. Cornett, Kent Reid
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Patent number: 9604838Abstract: A coupling comprising a first body member and a second body member. The first and second body members are operative to releasably connect together. The first and second body members define a fluid flow path therein when the first and second body members are connected together. The first and second body members are operative to disconnect from one another in response to a predetermined tensile force. At least one valve member is disposed within at least one of the first and second body members and is movable from an open position to a closed position with respect to the fluid flow path upon disconnection of the first body member from the second body member. A sensor is disposed within one of the first and second body members and is operative to sense whether the first and second body members are connected together.Type: GrantFiled: February 9, 2016Date of Patent: March 28, 2017Assignee: Veeder-Root CompanyInventors: Kenneth D. Cornett, Tim Campaigne, James C. Little, Niranjan Srinivasan, Andres Deogracias Viduya, Jeremy Baillargeon, Cameron D. Carmack
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Publication number: 20160229680Abstract: A coupling comprising a first body member and a second body member. The first and second body members are operative to releasably connect together. The first and second body members define a fluid flow path therein when the first and second body members are connected together. The first and second body members are operative to disconnect from one another in response to a predetermined tensile force. At least one valve member is disposed within at least one of the first and second body members and is movable from an open position to a closed position with respect to the fluid flow path upon disconnection of the first body member from the second body member. A sensor is disposed within one of the first and second body members and is operative to sense whether the first and second body members are connected together.Type: ApplicationFiled: February 9, 2016Publication date: August 11, 2016Inventors: Kenneth D. Cornett, Tim Campaigne, James C. Little, Niranjan Srinivasan, Andres Deogracias Viduya, Jeremy Baillargeon, Cameron D. Carmack
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Publication number: 20160167942Abstract: Systems and methods for regulating the flow rate of fluid at a fluid dispensing nozzle. In one embodiment, a nozzle includes a body, a spout coupled with the body, and at least one fluid flow path disposed within the body. The at least one fluid flow path is configured for fluid communication with a fluid dispensing hose. An ultrasonic transducer is disposed within the body and operatively coupled with the at least one flow path. Control electronics are in electronic communication with the ultrasonic transducer. The control electronics are operative to cause the ultrasonic transducer to transmit ultrasonic waves into the at least one fluid flow path. The ultrasonic waves are modulated with information representative of a desired fluid flow rate.Type: ApplicationFiled: December 9, 2015Publication date: June 16, 2016Inventor: Kenneth D. Cornett
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Patent number: 7321331Abstract: To reduce interference and increase battery life, a method and apparatus for transmitting location data within an ad-hoc communication system is provided herein. During operation, a portion of a beacon payload is reserved to broadcast location information (coordinates) for a node as well as other parameters that may be needed for location estimation. In addition to a node's location, an accuracy of the nodes location is also included within the beacon field. Because nodes will no longer have to awake outside their beacon transmit times to broadcast location information, battery life is extended. In addition, because nodes will no longer be transmitting location information outside their guaranteed time slot, system interference is also reduced.Type: GrantFiled: February 26, 2004Date of Patent: January 22, 2008Assignee: Motorola, Inc.Inventors: Oleg Andric, Vernon A. Allen, Minh T. Pham, Kenneth D. Cornett, Spyros Kyperountas
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Patent number: 6734762Abstract: A first type of MEMS resonator adapted to be fabricated on a SOI wafer is provided. A second type of MEMS resonator that is fabricated using deep trench etching and occupies a small area of a semiconductor chip is taught. Overtone versions of the resonators that provide for differential input and output signal coupling are described. In particular resonators suited for differential coupling that are physically symmetric as judged from center points, and support anti-symmetric vibration modes are provided. Such resonators are robust against signal noise caused by jarring. The MEMS resonators taught by the present invention are suitable for replacing crystal oscillators, and allowing oscillators to be integrated on a semiconductor chip. An oscillator using the MEMS resonator is also provided.Type: GrantFiled: April 9, 2001Date of Patent: May 11, 2004Assignee: Motorola, Inc.Inventors: Kenneth D. Cornett, Feng Niu
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Patent number: 6673667Abstract: A method for manufacturing a monolithic apparatus including a plurality of materials presenting a plurality of coplanar lands includes the steps of: (a) providing a substrate constructed of a first material and presenting a first land; (b) trenching the substrate to effect a cavity appropriately dimensioned to receive a semiconductor structure in an orientation presenting a second land generally coplanar with the first land; (c) depositing an accommodating layer constructed of a second material on the substrate and within the cavity to establish a workpiece; (d) depositing a composition layer constructed of a third material on the substrate; (e) selectively removing portions of the composition layer and the accommodating layer to establish the semiconductor structure; (f) depositing a cap layer constructed of a fourth material on the workpiece; and (g) removing the cap layer to establish a substantially planar face displaced from the plurality of lands by a predetermined distance.Type: GrantFiled: August 15, 2001Date of Patent: January 6, 2004Assignee: Motorola, Inc.Inventors: Jonathan F. Gorrell, Kenneth D. Cornett
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Patent number: 6624726Abstract: Microelectromechanical resonators that can be fabricated on a semiconductor die by processes normally used in fabricating microelectronics (e.g., CMOS) circuits are provided. The resonators comprises at least two vibratable members that are closely spaced relative to a wavelength associated with their vibrating frequency, and driven to vibrate one-half a vibration period out of phase with each other, i.e. to mirror each others motion. Driving the vibratable members as stated leads to destructive interference effects that suppress leakage of acoustic energy from the vibratable members into the die, and improve the Q-factor of the resonator. Vibratable members in the form of vibratable plates that are formed by deep anisotropic etching one or more trenches in the die are disclosed. Embodiments in which two sets of vibratable plates are spaced by ½ the aforementioned wavelength to further suppress acoustic energy leakage, and improve the Q-factor of the resonator are disclosed.Type: GrantFiled: August 31, 2001Date of Patent: September 23, 2003Assignee: Motorola, Inc.Inventors: Feng Niu, Kenneth D. Cornett
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Publication number: 20030052742Abstract: Microelectromechanical resonators that can be fabricated on a semiconductor die by processes normally used in fabricating microelectronics (e.g., CMOS) circuits are provided. The resonators comprises at least two vibratable members that are closely spaced relative to a wavelength associated with their vibrating frequency, and driven to vibrate one-half a vibration period out of phase with each other, i.e. to mirror each others motion. Driving the vibratable members as stated leads to destructive interference effects that suppress leakage of acoustic energy from the vibratable members into the die, and improve the Q-factor of the resonator. Vibratable members in the form of vibratable plates that are formed by deep anisotropic etching one or more trenches in the die are disclosed. Embodiments in which two sets of vibratable plates are spaced by ½ the aforementioned wavelength to further suppress acoustic energy leakage, and improve the Q-factor of the resonator are disclosed.Type: ApplicationFiled: August 31, 2001Publication date: March 20, 2003Inventors: Feng Niu, Kenneth D. Cornett
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Publication number: 20030034535Abstract: High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. In addition, formation of a compliant substrate may include utilizing surfactant enhanced epitaxy, epitaxial growth of single crystal silicon onto single crystal oxide, and epitaxial growth of Zintl phase materials.Type: ApplicationFiled: August 15, 2001Publication date: February 20, 2003Applicant: MOTOROLA, INC.Inventors: Barbara Foley Barenburg, Jonathan F. Gorrell, Kenneth D. Cornett
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Publication number: 20030036224Abstract: A method for manufacturing a monolithic apparatus including a plurality of materials presenting a plurality of coplanar lands includes the steps of: (a) providing a substrate constructed of a first material and presenting a first land; (b) trenching the substrate to effect a cavity appropriately dimensioned to receive a semiconductor structure in an orientation presenting a second land generally coplanar with the first land; (c) depositing an accommodating layer constructed of a second material on the substrate and within the cavity to establish a workpiece; (d) depositing a composition layer constructed of a third material on the substrate; (e) selectively removing portions of the composition layer and the accommodating layer to establish the semiconductor structure; (f) depositing a cap layer constructed of a fourth material on the workpiece; and (g) removing the cap layer to establish a substantially planar face displaced from the plurality of lands by a predetermined distance.Type: ApplicationFiled: August 15, 2001Publication date: February 20, 2003Applicant: MOTOROLA, INC.Inventors: Jonathan F. Gorrell, Kenneth D. Cornett
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Publication number: 20030022412Abstract: An epitaxial layer of crystalline piezoelectric material such as lithium niobate and lithium tantalate can be grown overlying a silicon wafer by first growing an intermediate strain-relief layer on the silicon wafer. Early in the growth of the piezoelectric layer, the strain-relief layer is a crystalline metal oxide, which helps bridge the lattice mismatch between silicon and the piezoelectric material. After growth of a thin crystalline piezoelectric layer, the strain-relief layer is amorphized to decouple the silicon and piezoelectric crystal lattices. Growth of the piezoelectric layer may then be resumed to obtain a good quality thicker layer suitable for electro-acoustic device fabrication. Passive and active electro-acoustic devices may be fabricated using the epitaxial piezoelectric layer. In particular, acoustic charge transport devices that utilize device elements in both silicon and the piezoelectric epitaxial overlayer are designed and fabricated.Type: ApplicationFiled: July 25, 2001Publication date: January 30, 2003Applicant: MOTOROLA, INC.Inventors: Robert J. Higgins, Kenneth D. Cornett
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Publication number: 20030022438Abstract: A composite semiconductor structure may be processed to form a compound semiconductor dynamic threshold-voltage field effect transistor. The compound semiconductor dynamic threshold-voltage field effect transistor may be provided by forming a compound semiconductor field effect transistor using a compound semiconductor region of the composite semiconductor structure and providing an electrical tie between a node at the gate of the transistor and a node at the body of the transistor. The node at the body may be a node that is coupled to a channel that is formed in the body when the transistor is conducting electricity. Dielectric isolation may be provided through an insulation layer that is in between the compound semiconductor region and non-compound semiconductor region of the composite semiconductor structure. Lateral isolation may be provided through trenches on the sides of the transistor that are filled with an insulator.Type: ApplicationFiled: July 24, 2001Publication date: January 30, 2003Applicant: MOTOROLA, INC.Inventors: Edgar H. Callaway, Kenneth D. Cornett
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Publication number: 20030020132Abstract: A composite semiconductor structure includes a thermal circuit device that is used to regulate the operation of a heat-sensitive semiconductor device. The thermal circuit device may be a non-compound semiconductor device such as a Group IV monocrystalline semiconductor device that is formed from a non-compound semiconductor portion of the composite semiconductor structure. The heat-sensitive device may be a compound semiconductor device such a monocrystalline compound semiconductor device that is formed from a compound semiconductor portion of the composite semiconductor structure. The thermal circuit device may be formed to be in a heat-sensing relationship with the heat-sensitive semiconductor device. The thermal circuit device may have an output current that may be used to regulate how the heat-sensitive semiconductor device is operated. The compound semiconductor portion may be epitaxially formed over the non-compound semiconductor portion with a compliant film in between to relieve lattice mismatches.Type: ApplicationFiled: July 25, 2001Publication date: January 30, 2003Applicant: MOTOROLA, INC.Inventor: Kenneth D. Cornett
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Publication number: 20030020565Abstract: Electromechanical resonating devices such as MEMS resonators are provided in semiconductor structures and devices having high-quality monocrystalline semiconductor layers formed by utilizing compliant substrates. The semiconductor layer is patternwise etched to define a vibrational mode resonator member with one or more supports mechanically coupled to the member. A portion beneath the member is etched to provide clearance for vibrational mode operation of the resonating member. The semiconductor layer is selectively doped to define one or more conductive pathways to the resonating member.Type: ApplicationFiled: July 24, 2001Publication date: January 30, 2003Applicant: MOTOROLA, INC.Inventors: Kenneth D. Cornett, Joseph P. Heck