Abstract: A production control process includes a method of highlighting pinholes in a surface layer (37), such as a photoresist layer, of an article (31), such as a semiconductor wafer. The photoresist typically covers a dielectric base layer, such as an oxide layer (28). After a typical photoresist application, a typical test wafer (31) is submitted to an etching operation wherein pinhole sized defects in the photoresist layer (37) cause like defects to be etched through the underlying oxide layer (28). Thereafter, the wafer is submitted to an electrolytic treatment step, wherein the preferred process involves treating a positive photoresist in an alcohol with the wafer being cathodically coupled into the treating circuit. Activating light can be used simultaneously with the treatment. As an alternative, the photoresist is exposed prior to the electrolytic treatment of the wafer.