Patents by Inventor Kenneth P. Rodbell

Kenneth P. Rodbell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11927616
    Abstract: A method for measuring alpha particle emissions may include obtaining a wafer emission rate, wherein the wafer emission rate is measured with a counter. The method may further include covering the wafer with a metal mesh grounded to a cathode of the counter wherein the metal mesh is grounded to the cathode outboard of the wafer and obtaining a mesh and wafer emission rate, wherein the mesh and wafer emission rate is measured with the counter. The method may further include replacing the wafer with a wafer carcass, obtaining a wafer carcass and mesh emission rate, and calculating a wafer carcass emissivity.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: March 12, 2024
    Assignee: International Business Machines Corporation
    Inventors: Michael S. Gordon, Kenneth P. Rodbell, Conal Murray
  • Patent number: 11683995
    Abstract: Techniques regarding lithographic processes for fabricating Josephson junctions are provided. For example, one or more embodiments described herein can comprise a method that can include depositing a first resist layer onto a second resist layer. The first resist layer can include a bridge portion that defines an opening for forming a Josephson junction. The method can also comprise depositing a third resist layer onto the bridge portion. The third resist layer can shield the opening from an angled deposition of a superconducting material during fabrication of the Josephson junction.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: June 20, 2023
    Assignee: International Business Machines Corporation
    Inventors: Kenneth P. Rodbell, Leonidas Ernesto Ocola, Charles Thomas Rettner, Mary E Rothwell, Elbert Emin Huang
  • Publication number: 20230055258
    Abstract: A method comprising cleaning the top surface of a silicon substrate and forming a diffusion barrier by depositing a metal on top the top surface of the silicon substrate. The diffusion barrier is formed one monolayer at a time and wherein the diffusion barrier will have a height of about 1 to 3 nm. Forming a layer of crystalline Niobium on top of the diffusion barrier.
    Type: Application
    Filed: August 17, 2021
    Publication date: February 23, 2023
    Inventor: Kenneth P. Rodbell
  • Patent number: 11538977
    Abstract: Techniques regarding qubit structures comprising ion implanted Josephson junctions are provided. For example, one or more embodiments described herein can comprise an apparatus that can include a strip of superconducting material coupling a first superconducting electrode and a second superconducting electrode. The strip of superconducting material can have a first region comprising an ion implant and a second region that is free from the ion implant.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: December 27, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Ryan T. Gordon, Kenneth P. Rodbell, Robert L. Sandstrom, Jeffrey W. Sleight
  • Publication number: 20220317172
    Abstract: A method for measuring alpha particle emissions may include obtaining a wafer emission rate, wherein the wafer emission rate is measured with a counter. The method may further include covering the wafer with a metal mesh grounded to a cathode of the counter wherein the metal mesh is grounded to the cathode outboard of the wafer and obtaining a mesh and wafer emission rate, wherein the mesh and wafer emission rate is measured with the counter. The method may further include replacing the wafer with a wafer carcass, obtaining a wafer carcass and mesh emission rate, and calculating a wafer carcass emissivity.
    Type: Application
    Filed: March 30, 2021
    Publication date: October 6, 2022
    Inventors: Michael S. Gordon, Kenneth P. Rodbell, Conal Murray
  • Publication number: 20220181536
    Abstract: Techniques regarding qubit structures comprising ion implanted Josephson junctions are provided. For example, one or more embodiments described herein can comprise an apparatus that can include a strip of superconducting material coupling a first superconducting electrode and a second superconducting electrode. The strip of superconducting material can have a first region comprising an ion implant and a second region that is free from the ion implant.
    Type: Application
    Filed: December 9, 2020
    Publication date: June 9, 2022
    Inventors: Ryan T. Gordon, Kenneth P. Rodbell, Robert L. Sandstrom, Jeffrey W. Sleight
  • Publication number: 20220123195
    Abstract: Devices, systems, methods, and/or computer-implemented methods that can facilitate protection of a substrate in a qubit device using sacrificial material are provided. According to an embodiment, a device can comprise a superconducting lead provided on a pillar of a sacrificial material provided on a substrate. The device can further comprise a collapsed superconducting junction provided on the substrate and coupled to the superconducting lead.
    Type: Application
    Filed: October 15, 2020
    Publication date: April 21, 2022
    Inventors: Vivekananda P. Adiga, Martin S. Sandberg, Jeng-Bang Yau, David L. Rath, John Bruley, Cihan Kurter, Kenneth P. Rodbell, Hongwen Yan
  • Patent number: 11257866
    Abstract: A reactive material erasure element comprising a reactive material is located between PCM cells and is in close proximity to the PCM cells. The reaction of the reactive material is trigger by a current applied by a bottom electrode which has a small contact area with the reactive material erasure element, thereby providing a high current density in the reactive material erasure element to ignite the reaction of the reactive material. Due to the close proximity of the PCM cells and the reactive material erasure element, the heat generated from the reaction of the reactive material can be effectively directed to the PCM cells to cause phase transformation of phase change material elements in the PCM cells, which in turn erases data stored in the PCM cells.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: February 22, 2022
    Assignee: International Business Machines Corporation
    Inventors: Matthew J. BrightSky, Cyril Cabral, Jr., Kenneth P. Rodbell
  • Publication number: 20220037578
    Abstract: Techniques regarding lithographic processes for fabricating Josephson junctions are provided. For example, one or more embodiments described herein can comprise a method that can include depositing a first resist layer onto a second resist layer. The first resist layer can include a bridge portion that defines an opening for forming a Josephson junction. The method can also comprise depositing a third resist layer onto the bridge portion. The third resist layer can shield the opening from an angled deposition of a superconducting material during fabrication of the Josephson junction.
    Type: Application
    Filed: August 3, 2020
    Publication date: February 3, 2022
    Inventors: Kenneth P. Rodbell, Leonidas Ernesto Ocola, Charles Thomas Rettner, Mary E. Rothwell, Elbert Emin Huang
  • Patent number: 11152378
    Abstract: An integrated circuit package with a buffer providing radiation protection to memory elements and components is described. The integrated circuit packages and the incorporated buffers provide a protective distance between potential sources of internal radiation particles within the integrated circuit package and any memory elements/components which may be sensitive to radiation such as alpha particles. This protective distance allows for the integrated circuit packages to be completed or assembled without needing added more expensive or redundant memory components.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: October 19, 2021
    Assignee: International Business Machines Corporation
    Inventors: Daniel L. Stasiak, Hassan Naser, Michael J. Mueller, Kenneth P. Rodbell, Philip J. Oldiges
  • Publication number: 20210305257
    Abstract: An integrated circuit package with a buffer providing radiation protection to memory elements and components is described. The integrated circuit packages and the incorporated buffers provide a protective distance between potential sources of internal radiation particles within the integrated circuit package and any memory elements/components which may be sensitive to radiation such as alpha particles. This protective distance allows for the integrated circuit packages to be completed or assembled without needing added more expensive or redundant memory components.
    Type: Application
    Filed: March 25, 2020
    Publication date: September 30, 2021
    Inventors: Daniel L. STASIAK, Hassan NASER, Michael J. MUELLER, Kenneth P. RODBELL, Philip J. OLDIGES
  • Publication number: 20210257410
    Abstract: A reactive material erasure element comprising a reactive material is located between PCM cells and is in close proximity to the PCM cells. The reaction of the reactive material is trigger by a current applied by a bottom electrode which has a small contact area with the reactive material erasure element, thereby providing a high current density in the reactive material erasure element to ignite the reaction of the reactive material. Due to the close proximity of the PCM cells and the reactive material erasure element, the heat generated from the reaction of the reactive material can be effectively directed to the PCM cells to cause phase transformation of phase change material elements in the PCM cells, which in turn erases data stored in the PCM cells.
    Type: Application
    Filed: November 22, 2019
    Publication date: August 19, 2021
    Inventors: Matthew J. BrightSky, Cyril Cabral, JR., Kenneth P. Rodbell
  • Patent number: 11055459
    Abstract: A method of forming an electrical device is provided that includes forming microprocessor devices on a microprocessor die; forming memory devices on an memory device die; forming component devices on a component die; and forming a plurality of packing devices on a packaging die. Transferring a plurality of each of said microprocessor devices, memory devices, component devices and packaging components to a supporting substrate, wherein the packaging components electrically interconnect the memory devices, component devices and microprocessor devices in individualized groups. Sectioning the supporting substrate to provide said individualized groups of memory devices, component devices and microprocessor devices that are interconnected by a packaging component.
    Type: Grant
    Filed: June 6, 2019
    Date of Patent: July 6, 2021
    Assignee: International Business Machines Corporation
    Inventors: Qianwen Chen, Li-Wen Hung, Wanki Kim, John U. Knickerbocker, Kenneth P. Rodbell, Robert L. Wisnieff
  • Patent number: 10943875
    Abstract: A method comprising bonding a first substrate to a second substrate. The first substrate includes a layer of one or more pairs of reactive material. The method comprising triggering a reaction between the one or more pairs of reactive material and fragmenting the second substrate.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: March 9, 2021
    Assignee: International Business Machines Corporation
    Inventors: Cyril Cabral, Jr., Kenneth P. Rodbell
  • Patent number: 10901010
    Abstract: An apparatus and method for measuring flux, current, or integrated charge of a beam are provided. The apparatus and method include a cup on which the beam is incident. The cup includes an inner cylinder, a coaxial cylinder, and an aperture. The coaxial cylinder surrounds the inner cylinder and is electrically insulated therefrom. An offset current source is in electrical communication with the inner cylinder. An electrometer, a charge integrator, or a counter may be electrically connected to the cup and the offset current source. When the beam is incident on the cup and aligned with the aperture, the electrometer can measure the beam current and the charge integrator can measure the integrated charge of the beam.
    Type: Grant
    Filed: May 26, 2019
    Date of Patent: January 26, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Matthew W. Copel, Michael S. Gordon, Kenneth P. Rodbell
  • Patent number: 10784200
    Abstract: Methods of blocking ionizing radiation to reduce soft errors and resulting IC chips are disclosed. One embodiment includes forming a front end of line (FEOL) for an integrated circuit (IC) chip; and forming at least one back end of line (BEOL) dielectric layer including ionizing radiation blocking material therein. Another embodiment includes forming a front end of line (FEOL) for an integrated circuit (IC) chip; and forming an ionizing radiation blocking layer positioned in a back end of line (BEOL) of the IC chip. The ionizing radiation blocking material or layer absorbs ionizing radiation and reduces soft errors within the IC chip.
    Type: Grant
    Filed: March 1, 2012
    Date of Patent: September 22, 2020
    Assignee: International Business Machines Corporation
    Inventors: Mukta G. Farooq, Ian D. Melville, Kevin S. Petrarca, Kenneth P. Rodbell
  • Patent number: 10727121
    Abstract: The present disclosure relates to integrated circuits and to methods of manufacturing interconnects of integrated circuits. For example, an integrated circuit includes a surface of the integrated circuit and an interconnect formed on the surface and comprising a metal. An average grain size of the metal of the interconnect is greater than or equal to at least half of a line width of the interconnect. In another example, a method for manufacturing an interconnect of an integrated circuit includes depositing a layer of a metal onto a surface of the integrated circuit, annealing the metal, patterning a first hard mask for placement over the metal and forming a line of the interconnect and a first via of the interconnect by performing a timed etch of the metal using the first hard mask.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: July 28, 2020
    Assignee: ELPIS TECHNOLOGIES INC.
    Inventors: Robert L. Bruce, Cyril Cabral, Jr., Gregory M. Fritz, Eric A. Joseph, Michael F. Lofaro, Hiroyuki Miyazoe, Kenneth P. Rodbell, Ghavam Shahidi
  • Patent number: 10634797
    Abstract: A radiation exposure system having a beam source is provided. The system further includes a variable thickness degrader, positioned between the beam source and an object to be exposed, for providing varying degrees of degradation to a radiation beam emitted from the beam source onto the object. The system also includes a set of detectors, positioned between the variable thickness degrader and the object, for receiving and measuring only a portion of the radiation beam remaining after the degradation of the radiation beam by the variable thickness degrader.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: April 28, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Michael S. Gordon, John G. Massey, Kenneth P. Rodbell
  • Patent number: 10633280
    Abstract: In one aspect, a method for use in preparing a glass includes performing an ion exchange process by treating the glass with a eutectic mixture including at least a first rubidium salt. In another aspect, a glass is prepared at least in part by performing an ion exchange process by treating the glass with a eutectic mixture including at least a first rubidium salt.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: April 28, 2020
    Assignee: International Business Machines Corporation
    Inventors: Qiang Huang, Kenneth P. Rodbell, Asli Sahin
  • Patent number: 10627529
    Abstract: A radiation exposure system having a beam source is provided. The system further includes a variable thickness degrader, positioned between the beam source and an object to be exposed, for providing varying degrees of degradation to a radiation beam emitted from the beam source onto the object. The system also includes a set of detectors, positioned between the variable thickness degrader and the object, for receiving and measuring only a portion of the radiation beam remaining after the degradation of the radiation beam by the variable thickness degrader.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: April 21, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Michael S. Gordon, John G. Massey, Kenneth P. Rodbell