Abstract: An electronic circuit is made by selectively depositing an electrically conductive material seed layer conformally upon a three-dimensional substrate via the plurality of apertures of a three-dimensional mask. The substrate is then plated with more of the same electrically conductive material, or a different electrically conductive material, on the seed layer. In the case of electroplating, a nonconductive support structure is incorporated into a conductive clamp for making electrical connection to the seed layer. An environmentally protective layer may be deposited upon the electrically conductive material to such an extent that the electronic circuit remains solderable. The three-dimensional mask may be fabricated by an additive manufacturing technique.