Patents by Inventor Kenneth Patrick Reilich

Kenneth Patrick Reilich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for recycling a substrate from an integrated circuit package
    Patent number: 6271048
    Abstract: An integrated circuit package is processed by a grinding step, a dissolving step, and a disintegrating step. The grinding step grinds an IC-chip completely off of a substrate, and it also grinds a first portion of a filler layer and a first portion of a set of solder balls which attach the IC-chip to the substrate. This leaves a partial filler layer and partial solder balls on the substrate. The dissolving step dissolves the partial filler layer off of the substrate after the grinding step; and the disintegration step disintegrates at least part of each partial solder ball by subjecting the partial solder balls on the substrate to ultrasonic vibration after the dissolving step. These steps leave the substrate with small solder mounds that can be easily attached to another IC-chip with another set of solder balls.
    Type: Grant
    Filed: October 20, 2000
    Date of Patent: August 7, 2001
    Assignee: Unisys Corporation
    Inventors: Kenneth Patrick Reilich, Ronald Allen Norell, Elvira Widyani Preecha, Joel Elwood Wing, Lorraine Lo-Lan Wing