Patents by Inventor Kenpei YAMASAKI

Kenpei YAMASAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board and method for manufacturing the same
    Patent number: 11014336
    Abstract: A circuit board according to the present invention includes: a first layer containing a fiber base material, and fusible fluororesin with which the fiber base material is impregnated; and second layers containing non-fusible fluororesin that are arranged on the two surfaces of the first layer.
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: May 25, 2021
    Assignee: NIPPON PILLAR PACKING CO., LTD.
    Inventors: Takeshi Okunaga, Miyuki Kobayashi, Tatsuya Tamaki, Kenpei Yamasaki, Tomoki Hayashi
  • CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20210060902
    Abstract: A circuit board according to the present invention includes: a first layer containing a fiber base material, and fusible fluororesin with which the fiber base material is impregnated; and second layers containing non-fusible fluororesin that are arranged on the two surfaces of the first layer.
    Type: Application
    Filed: July 19, 2018
    Publication date: March 4, 2021
    Applicant: NIPPON PILLAR PACKING CO., LTD.
    Inventors: Takeshi OKUNAGA, Miyuki KOBAYASHI, Tatsuya TAMAKI, Kenpei YAMASAKI, Tomoki HAYASHI