Patents by Inventor Kenshi Terashima

Kenshi Terashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220149833
    Abstract: An object of the present invention is to provide a drive capability switching circuit for a semiconductor element and a drive device for a semiconductor element capable of suppressing a radiation noise while reducing a loss occurred in switching of the semiconductor element. An IGBT drive capability switching circuit includes a gate voltage detection unit that detects a voltage level of a gate voltage based on a gate signal which is input to an IGBT in a mirror period, and a gate signal switching unit that switches a voltage level of the gate signal based on the voltage level detected by the gate voltage detection unit.
    Type: Application
    Filed: January 25, 2022
    Publication date: May 12, 2022
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventor: Kenshi TERASHIMA
  • Publication number: 20220122920
    Abstract: A conductive plate includes a first slit formed in the space between a first chip area and a second chip area, a second slit formed in the space between the first chip area and a terminal area, and a third slit formed in the space between the second chip area and the terminal area. The first slit is a continuous line that penetrates through the conductive plate, whereas the second and third slits are continuous lines that do not penetrate through the conductive plate.
    Type: Application
    Filed: December 29, 2021
    Publication date: April 21, 2022
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventor: Kenshi TERASHIMA
  • Publication number: 20220102316
    Abstract: A semiconductor device includes a semiconductor unit, a printed circuit board and a case, including a bottom portion formed in a plate-like shape and a side wall portion surrounding an outer periphery of the bottom portion of the case. The bottom portion has a main circuit area having an opening, and a control circuit area adjacent to the main circuit area in a plan view. The semiconductor unit is attached in the main circuit area from a rear surface of the bottom portion such that an insulating plate of the semiconductor unit is exposed to inside the case through the opening. The printed circuit board is disposed in the control circuit area on the front surface of the bottom portion via a spacer, having a gap between the printed circuit board and the front surface of the bottom portion.
    Type: Application
    Filed: July 27, 2021
    Publication date: March 31, 2022
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventor: Kenshi TERASHIMA
  • Publication number: 20210288020
    Abstract: A semiconductor device includes a first semiconductor chip including an output electrode portion on a front surface thereof, the output electrode portion including a plurality of electrode regions, each of which is provided at a respective position of the output electrode portion, and a plurality of wires, each electrode region being connected to a different one or more wires among the plurality of wires, through which a respective amount of output current is output. A total number of the different one or more wires connected to each electrode region is set depending on the respective position of the electrode region of the output electrode portion, so that the electrode region has a respective current amount per wire that is equal to or less than a respective predetermined value.
    Type: Application
    Filed: May 27, 2021
    Publication date: September 16, 2021
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventor: Kenshi TERASHIMA
  • Patent number: 10944393
    Abstract: A drive device for a semiconductor element includes a drive circuit receiving from outside a pulsed drive signal for driving ON/OFF of the semiconductor element; and a protection circuit receiving a signal representing a chip temperature of the semiconductor element and, when the detected chip temperature exceeds an overheating threshold temperature, controlling operation of the drive circuit so as to adjust a drive control voltage that is provided to the semiconductor element; and a drive information output circuit externally outputting drive information corresponding to the adjusted drive control voltage that is provided to the semiconductor element by the drive circuit.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: March 9, 2021
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Kenshi Terashima
  • Patent number: 10561021
    Abstract: The area projections or a spacer occupies on the upper surface of a resin casing increases as the size of a power semiconductor module decreases, and therefore another means for defining a clearance between a control board and the resin casing is desired. A power semiconductor module is provided, including: a housing which houses a power semiconductor chip; and at least one control pin or guide pin which protrudes outward from an upper surface of the housing, wherein the at least one control pin or guide pin has at least one step in a height direction from the upper surface of the housing toward a tip farthest from the housing.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: February 11, 2020
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Kenshi Terashima
  • Patent number: 10432080
    Abstract: A driving device of a semiconductor device includes a plurality of protection factor detection units, an identification signal generation unit, a continuation signal generation unit, a signal selection unit, and an alarm signal output unit. The protection factor detection units detect an occurrence of a protection factor. The protection factor requires a protection operation of a semiconductor device. The protection factor detection units output a protection factor generation signal. When any protection factor detection units output the protection factor generation signal, the identification signal generation unit generates a protection factor identification signal. The continuation signal generation unit generates a protection factor continuation signal while the protection factor detection unit outputs the protection factor generation signal. The signal selection unit selects the protection factor identification signal and the protection factor continuation signal.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: October 1, 2019
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventor: Kenshi Terashima
  • Publication number: 20180367023
    Abstract: A driving device of a semiconductor device includes a plurality of protection factor detection units, an identification signal generation unit, a continuation signal generation unit, a signal selection unit, and an alarm signal output unit. The protection factor detection units detect an occurrence of a protection factor. The protection factor requires a protection operation of a semiconductor device. The protection factor detection units output a protection factor generation signal. When any protection factor detection units output the protection factor generation signal, the identification signal generation unit generates a protection factor identification signal. The continuation signal generation unit generates a protection factor continuation signal while the protection factor detection unit outputs the protection factor generation signal. The signal selection unit selects the protection factor identification signal and the protection factor continuation signal.
    Type: Application
    Filed: August 28, 2018
    Publication date: December 20, 2018
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventor: Kenshi TERASHIMA
  • Publication number: 20180338376
    Abstract: The area projections or a spacer occupies on the upper surface of a resin casing increases as the size of a power semiconductor module decreases, and therefore another means for defining a clearance between a control board and the resin casing is desired. A power semiconductor module is provided, including: a housing which houses a power semiconductor chip; and at least one control pin or guide pin which protrudes outward from an upper surface of the housing, wherein the at least one control pin or guide pin has at least one step in a height direction from the upper surface of the housing toward a tip farthest from the housing.
    Type: Application
    Filed: February 26, 2018
    Publication date: November 22, 2018
    Inventor: Kenshi TERASHIMA
  • Publication number: 20180269867
    Abstract: A drive device for a semiconductor element includes a drive circuit receiving from outside a pulsed drive signal for driving ON/OFF of the semiconductor element; and a protection circuit receiving a signal representing a chip temperature of the semiconductor element and, when the detected chip temperature exceeds an overheating threshold temperature, controlling operation of the drive circuit so as to adjust a drive control voltage that is provided to the semiconductor element; and a drive information output circuit externally outputting drive information corresponding to the adjusted drive control voltage that is provided to the semiconductor element by the drive circuit.
    Type: Application
    Filed: March 12, 2018
    Publication date: September 20, 2018
    Applicant: Fuji Electric Co., Ltd.
    Inventor: Kenshi TERASHIMA
  • Patent number: D705184
    Type: Grant
    Filed: September 24, 2013
    Date of Patent: May 20, 2014
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Hideaki Takahashi, Kenshi Terashima, Satoru Motohashi, Masahiro Taoka
  • Patent number: D724554
    Type: Grant
    Filed: May 22, 2014
    Date of Patent: March 17, 2015
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Satoru Motohashi, Hideaki Takahashi, Tatsuya Karasawa, Kenshi Terashima