Patents by Inventor Kenta ISHIBASHI

Kenta ISHIBASHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11854919
    Abstract: A first sealing composition includes an epoxy resin, a curing agent, an inorganic filler, and an unbaked hydrotalcite compound having a mole ratio of Mg ion to Al ion (Mg/Al) of 2.4 or more. A second sealing composition includes an epoxy resin, a curing agent, a hydrotalcite compound represented by Formula (1): Mg1-xAlx(OH)2(CO3)x/2·mH2O, in which each of x and m independently represents a positive number, and a magnesium-containing compound that is different from the hydrotalcite compound. A third sealing composition includes an epoxy resin, a curing agent, a hydrotalcite compound represented by Formula (I), and a magnesium oxide, and a content of the magnesium oxide is from 1 part by mass to 50 parts by mass parts with respect to 100 mass parts of the epoxy resin.
    Type: Grant
    Filed: May 29, 2017
    Date of Patent: December 26, 2023
    Assignee: RESONAC CORPORATION
    Inventors: Dongchul Kang, Takahiro Horie, Kenta Ishibashi, Naoki Namai, Kazuhide Sekiguchi, Keichi Hori
  • Publication number: 20210061986
    Abstract: An epoxy resin composition includes an epoxy resin; a curing agent; alumina particles; and a silane compound which does not have a functional group that is reactive with an epoxy group and which has a functional group that is unreactive with an epoxy group, wherein the silane compound has a structure in which the functional group that is unreactive with an epoxy resin is bound to a silicon atom, or is bound to a silicon atom via a chain hydrocarbon group having 1 to 5 carbon atoms.
    Type: Application
    Filed: March 11, 2019
    Publication date: March 4, 2021
    Inventors: Dongchul KANG, Masashi YAMAURA, Kenta ISHIBASHI, Takuya KODAMA, Keichi HORI, Mika TANAKA
  • Publication number: 20200335409
    Abstract: A first sealing composition includes an epoxy resin, a curing agent, an inorganic filler, and an unbaked hydrotalcite compound having a mole ratio of Mg ion to Al ion (Mg/Al) of 2.4 or more. A second sealing composition includes an epoxy resin, a curing agent, a hydrotalcite compound represented by Formula (1): Mg1-xAlx(OH)2(CO3)x/2.mH2O, in which each of x and m independently represents a positive number, and a magnesium-containing compound that is different from the hydrotalcite compound. A third sealing composition includes an epoxy resin, a curing agent, a hydrotalcite compound represented by Formula (I), and a magnesium oxide, and a content of the magnesium oxide is from 1 part by mass to 50 parts by mass parts with respect to 100 mass parts of the epoxy resin.
    Type: Application
    Filed: May 29, 2017
    Publication date: October 22, 2020
    Applicant: Hitachi ChemicalCompany, Ltd.
    Inventors: Dongchul KANG, Takahiro HORIE, Kenta ISHIBASHI, Naoki NAMAI, Kazuhide SEKIGUCHI, Keichi HORI
  • Publication number: 20200190293
    Abstract: An object of the present disclosure is to provide a rubber composition having satisfactorily low hysteresis loss, while maintaining high wear resistance. In order to achieve the object, a rubber composition contains: a rubber component having diene-based rubber therein; and a tetrazine compound.
    Type: Application
    Filed: April 4, 2018
    Publication date: June 18, 2020
    Applicant: BRIDGESTONE CORPORATION
    Inventors: Takumi TODA, Kenta ISHIBASHI, Hidenobu AKAHANE, Seiichi TAHARA, Ryota SONE