Patents by Inventor Kenta KOBAYASHI

Kenta KOBAYASHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12291981
    Abstract: A blade ring assembly including: a turbine blade ring extending in a circumferential direction about an axis; a component to be cooled, disposed on an inner circumferential side of the turbine blade ring; and an outer circumferential side component disposed on an outer circumferential side of the turbine blade ring. The turbine blade ring has a cooling medium intake port leading from an outer circumferential surface to an inner circumferential surface of the turbine blade ring. The outer circumferential side component includes: a first wall portion which covers at least a portion of the cooling medium intake port from the outer circumferential side of the turbine blade ring; and a second wall portion which extends from an end portion of the first wall portion on the axially downstream thereof toward the outer circumferential side of the turbine blade ring.
    Type: Grant
    Filed: May 24, 2024
    Date of Patent: May 6, 2025
    Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Hiroaki Kobayashi, Norihiko Nagai, Kazuharu Hirokawa, Shinya Hashimoto, Naoki Taketa, Takeshi Umehara, Koji Watanabe, Yoshio Fukui, Kenta Nakamura
  • Patent number: 12283402
    Abstract: A suspension wiring module includes a suspension wiring member including a transmission line main body and at least one coating layer that covers the transmission line main body. At least one section of the suspension wiring member is defined as an exterior section that is provided outside of a cabin of a vehicle. In the exterior section, an arc-shaped groove is formed in an outer coating that is the outermost one of the at least one coating layer.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: April 22, 2025
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Takahiro Murata, Kenta Kobayashi
  • Patent number: 12275254
    Abstract: An inkjet printing method including: discharging ink contained in an ink storage unit, from a nozzle of a nozzle forming surface of a discharging unit; and supplying the ink from the ink storage unit to the discharging unit. The ink includes specific components and satisfies a specific relation between dynamic surface tension and time. The supplying includes: forming a closed space by covering the nozzle forming surface with a lid member, and freely controlling a pressure between the discharging unit and the ink storage unit; and forming an open space by opening the lid member on the nozzle forming surface, and setting the pressure to be the same as atmospheric pressure. A negative pressure difference between the ink storage unit and the discharging unit is 70-120 mmAq before discharge of the ink, 30-80 mmAq during the discharging, and the former is equal to or greater than the latter.
    Type: Grant
    Filed: May 25, 2023
    Date of Patent: April 15, 2025
    Assignee: Ricoh Company, Ltd.
    Inventors: Kenta Hagiwara, Shunsuke Horie, Hiroki Kobayashi
  • Publication number: 20250118909
    Abstract: Providing a grounding resistance reducing material that can contribute to the reduction in carbon dioxide emission and can be used in the same manner as the grounding resistance reducing material that uses coke, which is fossil fuel, and a grounding device using the grounding resistance reducing material, and also providing a grounding resistance reducing material whose weight can be trimmed. A grounding resistance reducing material 14 to be laid between a grounding electrode 11 buried in soil 12 and the soil 12 contains carbide granules obtained by incomplete combustion of biomass.
    Type: Application
    Filed: March 19, 2024
    Publication date: April 10, 2025
    Applicant: SANKOSHA CORPORATION
    Inventors: Koji Terashima, Kenta Kobayashi, Shuji Kurano
  • Publication number: 20250115736
    Abstract: The present invention is a composition for forming a metal-containing film, containing: (A) a metal compound containing at least one kind of metal selected from the group consisting of Ti, Zr, and Hf; (B) a crosslinking agent containing, per molecule, 2 or more and 4 or fewer cyclic ether structures having 2 to 13 carbon atoms; and (C) a solvent. This can provide: a composition for forming a metal-containing film having better dry etching resistance than conventional organic underlayer film materials and also having high filling and planarizing properties; and a patterning process in which the composition is used.
    Type: Application
    Filed: September 23, 2024
    Publication date: April 10, 2025
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Naoki KOBAYASHI, Kenta ISHIWATA, Daisuke KORI, Nobuhiro NAGAMACHI
  • Publication number: 20250102929
    Abstract: An electrophotographic photoreceptor includes a conductive substrate, and a photosensitive layer disposed on the conductive substrate, in which an outermost surface layer is a layer containing a charge transport material and a binder resin and having a breaking energy of 10 mJ/mm3 or greater, and an outer peripheral surface has a dynamic friction coefficient of 0.5 or greater and 1.0 or less.
    Type: Application
    Filed: February 29, 2024
    Publication date: March 27, 2025
    Applicant: FUJIFILM Business Innovation Corp.
    Inventors: Yoichi KIGOSHI, Keisuke KUSANO, Yuki OYAMADA, Hiroko KOBAYASHI, Kenta IDE
  • Publication number: 20250102930
    Abstract: An electrophotographic photoreceptor includes an outermost layer that contains a charge transport material and a binder resin, in which the binder resin includes a polyester resin PA having an elastic deformation rate XA of 53.0% or greater and a polycarbonate resin PB having an elastic deformation rate XB that is less than the elastic deformation rate XA of the polyester resin PA by a range of 5% or greater and 12% or less.
    Type: Application
    Filed: February 29, 2024
    Publication date: March 27, 2025
    Applicant: FUJIFILM Business Innovation Corp.
    Inventors: Keisuke KUSANO, Kenta IDE, Hiroko KOBAYASHI, Yoichi KIGOSHI, Yuki OYAMADA
  • Publication number: 20250085636
    Abstract: The present invention is a compound for forming a metal-containing film, being a reaction product between a compound having two or more diol structures per molecule and a Sn compound, and being a monomolecular compound containing two or more Sn atoms per molecule. This can provide: a metal compound having better dry etching resistance than conventional organic underlayer film materials and also having high filling and planarizing properties; a composition for forming a metal-containing film containing the compound; and a patterning process in which the composition is used as a resist underlayer film material.
    Type: Application
    Filed: August 28, 2024
    Publication date: March 13, 2025
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Shohei IWAMORI, Naoki KOBAYASHI, Daisuke KORI, Kenta ISHIWATA
  • Publication number: 20250087495
    Abstract: The present invention is a compound for forming a metal-containing film, where the compound is represented by the following general formula (M), where R1 and R2 each independently represent an organic group or a halogen atom; and W represents a divalent organic group represented by the following general formula (W-1) or (W-2). This can provide: a compound for forming a metal-containing film having excellent dry etching resistance and also having high filling and planarizing properties; a composition for forming a metal-containing film containing the compound; and a patterning process in which the composition is used.
    Type: Application
    Filed: August 28, 2024
    Publication date: March 13, 2025
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Shohei IWAMORI, Naoki KOBAYASHI, Daisuke KORI, Kenta ISHIWATA
  • Publication number: 20250076756
    Abstract: The present invention aims to provide: a compound for forming a metal-containing film that yields a resist middle layer film enabling to obtain a favorable pattern shape and having high adhesiveness to a resist upper layer film to prevent collapse of a fine pattern in a fine patterning process in a semiconductor device manufacturing process; a composition for forming a metal-containing film using the compound; and a patterning process using the composition. A compound for forming a metal-containing film contains: at least one metal atom selected from a group consisting of Ti, Zr, and Hf; and a multidentate ligand coordinated to the metal atom and containing a cyclic ether structure having 2 to 13 carbon atoms.
    Type: Application
    Filed: August 14, 2024
    Publication date: March 6, 2025
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Naoki KOBAYASHI, Nobuhiro NAGAMACHI, Daisuke KORI, Kenta ISHIWATA
  • Patent number: 12233863
    Abstract: A vehicle driving assist device comprises: an oncoming moving body recognizer configured to recognize an oncoming moving body; a risk determination region setting unit configured to set a risk determination region for calculating a risk degree that decreases as a distance outward from a center of the oncoming moving body in a width direction of the oncoming moving body increases; a risk degree calculator configured to calculate the risk degree for the oncoming moving body in accordance with an overlap state between the target traveling path of the vehicle and the risk determination region; and a preliminary collision avoidance controller configured to recognize the oncoming moving body as the obstacle in accordance with the risk degree, and perform preliminary collision avoidance control in response to the oncoming moving body recognized as the obstacle prior to the emergency collision avoidance control.
    Type: Grant
    Filed: January 3, 2023
    Date of Patent: February 25, 2025
    Assignee: SUBARU CORPORATION
    Inventors: Shingo Ugajin, Kazuaki Ueda, Takuya Iwase, Kazuo Nomoto, Toshihiro Hayashi, Hiroto Kobayashi, Kenta Someya, Takumi Funabashi
  • Publication number: 20250060670
    Abstract: The present invention provides a method for forming by plasma irradiation a resist underlayer film with excellent dry etching resistance and film thickness uniformity, the method including: (i) applying a composition containing (A) a polymer and (B) an organic solvent, and performing heat treatment; and (ii) forming a resist underlayer film by plasma irradiation, where the polymer (A) contains a constitutional unit of formula (1) and has a weight-average molecular weight of 2,500 to 20,000: where Ar1 and Ar2 represent a benzene ring or naphthalene ring, X represents a structure of formula (1A), Y represents an organic group, “k” represents 0 or 1, where “n1” represents 0 or 1, “n2” represents 1 or 2, R2 represents a hydrogen atom, an organic group, or a structure of formula (1B), R3 represents a hydrogen atom, an alkyl group, an aryl group, or a group of formula (1C), “n3” represents 0 to 2, where RA represents an organic group, RB represents a hydrogen atom or an organic group, and where R4 r
    Type: Application
    Filed: July 29, 2024
    Publication date: February 20, 2025
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Naoki KOBAYASHI, Kenta Ishiwata, Daisuke Kori, Toshiharu Yano
  • Publication number: 20250036029
    Abstract: The present invention is a method for forming a resist underlayer film on a substrate, the method including the steps of: (i) forming an underlayer-film-precursor film by coating a substrate with a composition for forming a resist underlayer film, containing (A) a polymer and an organic solvent, to obtain a coating film and subjecting the coating film to heat treatment at a temperature of 100° C. or higher and 800° C. or lower for 10 seconds to 7,200 seconds to cure the coating film; and (ii) forming a resist underlayer film by curing the underlayer-film-precursor film by plasma irradiation, where the polymer (A) is an aromatic ring-containing resin containing no hydroxy groups or organic groups represented by the following general formulae (1) in a repeating unit contained in the polymer, where “p” represents 0 or 1, and “*” represents an attachment point.
    Type: Application
    Filed: July 2, 2024
    Publication date: January 30, 2025
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Naoki KOBAYASHI, Kenta ISHIWATA, Daisuke KORI, Toshiharu YANO
  • Publication number: 20250036024
    Abstract: The present invention is a compound for forming a metal-containing film, containing: at least one metal atom selected from the group consisting of Ti, Zr, and Hf; and a ligand coordinated to the metal atom, where the ligand contains a group represented by any of the following formulae (a-1) to (a-3), where R1 represents a hydrogen atom or an organic group having 1 to 10 carbon atoms, and “*” represents an attachment point. This can provide: a compound for forming a metal-containing film that gives a metal-containing film that makes it possible to obtain an excellent pattern profile, has high adhesiveness to a resist upper layer film, and suppresses fine-pattern collapse in a fine patterning process of a semiconductor device manufacturing process; a composition for forming a metal-containing film, containing the compound; and a patterning process using the composition.
    Type: Application
    Filed: June 17, 2024
    Publication date: January 30, 2025
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Naoki KOBAYASHI, Nobuhiro Nagamachi, Kenta Ishiwata, Daisuke Kori
  • Publication number: 20250028246
    Abstract: The present invention is a composition for forming a resist underlayer film, containing: (A) a polymer having a structure represented by the following general formula (1) as a repeating unit; and (B) an organic solvent, where the polymer (A) has a molecular weight of 300 to 3,000, and the polymer (A) contains neither a repeating unit containing a hydroxy group as a substituent nor a repeating unit containing a heteroaromatic ring, and where Ar represents an unsubstituted divalent aromatic group having 6 to 30 carbon atoms. This can provide a composition for forming a resist underlayer film with which it is possible to form a resist underlayer film that exhibits much better dry etching resistance than those of conventional organic underlayer film materials.
    Type: Application
    Filed: July 2, 2024
    Publication date: January 23, 2025
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Kenta ISHIWATA, Daisuke KORI, Toshiharu YANO, Naoki KOBAYASHI, Keisuke NIIDA
  • Publication number: 20240254911
    Abstract: A cooling device of a vehicle is provided, which includes a transmission, a first coolant circuit where a first coolant which cools the internal combustion engine circulates, a second coolant circuit independent from the first coolant circuit, where a second coolant which cools the electric drive system circulates, and a fluid circuit where fluid which lubricates and cools friction engagement elements in the transmission circulates. The fluid circuit includes a first heat exchanger which exchanges heat between the fluid and the first coolant, a second heat exchanger in-series with the first heat exchanger which exchanges heat between the fluid and the second coolant, a first adjuster which changes a flow rate of the fluid passing through the first heat exchanger, and a second adjuster which changes a flow rate of the fluid passing through the second heat exchanger.
    Type: Application
    Filed: January 11, 2024
    Publication date: August 1, 2024
    Inventors: Keitaro Kageyama, Shinichi Hikitani, Tomohiro Koguchi, Yukio Jo, Daisuke Shimo, Masahiro Miyazaki, Daisuke Fukuda, Akira Tsuda, Kenji Tanaka, Kazufumi Kumakura, Hiroaki Gotan, Takahiro Okazaki, Kenta Honda, Yoshie Kakuda, Toshiaki Tohoda, Kenta Kobayashi, Aki Murai, Michiyuki Miura, Yusaku Takahashi, Masaki Yamamoto
  • Patent number: 11886006
    Abstract: The present invention provides a polymer optical waveguide having a core, an under cladding and an over cladding, in which: the polymer optical waveguide has a first section on one end side in the light propagation direction where no portion of the over cladding exists and the core and the under cladding are exposed, and a second section on the other end side in the light propagation direction where the core is covered with the under cladding and the over cladding; and a relative refractive index difference among the core, the under cladding and the over cladding, a core width and core height in an end surface at the one end side of the first section, and a core width and core height in an end surface at the other end side of the second section satisfy predetermined relationships.
    Type: Grant
    Filed: November 8, 2021
    Date of Patent: January 30, 2024
    Assignee: AGC Inc.
    Inventors: Naoya Wada, Shotaro Takenobu, Kenta Kobayashi, Seiki Ohara
  • Publication number: 20230420158
    Abstract: A cable with an abnormality precursor detection function includes: one or more target electric wires each including a corresponding one of electric wire conductors and an electric wire coating that covers an outer periphery of the electric wire conductor; one or more detection wires each including a corresponding one of detection wire conductors and a detection wire coating that covers an outer periphery of the detection wire conductor; and a sheath that covers an outer periphery of an electric wire group including the one or more target electric wires and the one or more detection wires.
    Type: Application
    Filed: June 3, 2021
    Publication date: December 28, 2023
    Inventors: Hirokazu KOMORI, Makoto HIGASHIKOZONO, Fujio SONODA, Takahiro MURATA, Kenta KOBAYASHI
  • Publication number: 20230231326
    Abstract: The present disclosure provides an electric wire including: a plurality of conductors that have been twisted together; and an insulation coating that covers an outer circumference of the plurality of conductors, wherein the plurality of conductors include: a plurality of outer conductors that are arranged along an outermost circumference; and at least one inner conductor that is provided on an inner side of the plurality of outer conductors, the at least one inner conductor includes one or more first strands, the one or more first strands are copper wires, each copper wire including a tin-plating layer, each of the plurality of outer conductors includes one or more second strands, and the one or more second strands are copper wires, each copper wire not including a plating layer.
    Type: Application
    Filed: June 24, 2021
    Publication date: July 20, 2023
    Inventors: Kenta KOBAYASHI, Yusuke ARAKI, Yuto HAYASHI
  • Publication number: 20230154651
    Abstract: Disclosed is a covered wire including: a tubular member through which a coolant flows; a conductor provided on an outer circumference of the tubular member; and a covering member covering an outer circumference of the conductor, wherein the tubular member and the covering member are insulating, and the tubular member has a higher resistance to the coolant than the covering member.
    Type: Application
    Filed: April 27, 2021
    Publication date: May 18, 2023
    Inventors: Kenta KOBAYASHI, Takeo MARUCHI, Hiroyuki YOSHIKAWA