Patents by Inventor Kentaro Ishii

Kentaro Ishii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220088653
    Abstract: Provided is a method for rolling a steel sheet and a method for manufacturing a steel sheet capable of preventing occurrence of defects in appearance of a steel sheet caused by oil spots of a coolant and preventing occurrence of defects in shape of a steel sheet by appropriately controlling thermal deformation of work rolls. The method for rolling a steel sheet according to the present invention is a method for rolling a steel sheet involving feeding of a coolant to rolls that form a rolling mill during the rolling. The method includes keeping a coolant feeding rate at or lower than a predetermined rate lower than an upper constant rate at a start of operation of the rolling mill, and increasing the coolant feeding rate to the upper constant rate in response to an amount of center buckles of the steel sheet reaching or exceeding an upper target value.
    Type: Application
    Filed: December 26, 2019
    Publication date: March 24, 2022
    Applicant: JFE Steel Corporation
    Inventors: Ken Kurisu, Kentaro Ishii, Kazuma Takeuchi
  • Patent number: 11127745
    Abstract: A method of forming an apparatus comprises forming a first metal nitride material over an upper surface of a conductive material within an opening extending through at least one dielectric material through a non-conformal deposition process. A second metal nitride material is formed over an upper surface of the first metal nitride material and side surfaces of the at least one dielectric material partially defining boundaries of the opening through a conformal deposition process. A conductive structure is formed over surfaces of the second metal nitride material within the opening. Apparatuses and electronic systems are also described.
    Type: Grant
    Filed: June 19, 2020
    Date of Patent: September 21, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Kentaro Ishii, Yongjun J. Hu, Amirhasan Nourbakhsh, Durai Vishak Nirmal Ramaswamy, Christopher W. Petz, Luca Fumagalli
  • Patent number: 10950496
    Abstract: A microelectronic device comprises a first conductive material comprising copper, a conductive plug comprising tungsten in electrical communication with the first conductive material, and manganese particles dispersed along an interface between the first conductive material and the conductive plug. Related electronic systems and related methods are also disclosed.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: March 16, 2021
    Assignee: Micron Technology, Inc.
    Inventor: Kentaro Ishii
  • Patent number: 10908368
    Abstract: An optical cable, in which a fiber optic core and tensile strength filaments are covered with a covering, is connected to a connecting element incorporated into a connector, wherein a clamping member clamps the end portion of the covering along its outer peripheral surface in a state where the covering has been removed from the end portion of the optical cable such that the fiber optic core and the tensile strength filaments are uncovered; a gripping member that grips the exposed tensile strength filaments in a state where the exposed fiber optic core passes therethrough; and a protective member that covers a range extending from the clamping member to the gripping member in the axial direction of the fiber optic core in a state where the exposed fiber optic core is connected to a connecting element of the connector while the gripping member is attached to the connector.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: February 2, 2021
    Assignee: HIROSE ELECTRIC CO., LTD.
    Inventors: Takeshi Yamazaki, Kentaro Ishii, Ryozo Koyama, Hiroshi Tanooka
  • Publication number: 20210020503
    Abstract: A microelectronic device comprises a first conductive material comprising copper, a conductive plug comprising tungsten in electrical communication with the first conductive material, and manganese particles dispersed along an interface between the first conductive material and the conductive plug. Related electronic systems and related methods are also disclosed.
    Type: Application
    Filed: April 23, 2020
    Publication date: January 21, 2021
    Inventor: Kentaro Ishii
  • Patent number: 10844215
    Abstract: A polyester resin composition containing a polyester resin and 1 to 500 ppm of ultramarine based on a total amount of the polyester resin composition, wherein the polyester resin contains dicarboxylic acid structural unit and diol structural unit, the diol structural unit contain structural unit derived from a diol having a cyclic acetal skeleton, and a content of the structural unit derived from a diol having a cyclic acetal skeleton is 1 to 60 mol % based on a total amount of the diol structural unit.
    Type: Grant
    Filed: May 9, 2017
    Date of Patent: November 24, 2020
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Takami Morishita, Takeshi Hirokane, Kentaro Ishii, Tomoe Morishita, Hirokatsu Arai
  • Publication number: 20200321340
    Abstract: A method of forming an apparatus comprises forming a first metal nitride material over an upper surface of a conductive material within an opening extending through at least one dielectric material through a non-conformal deposition process. A second metal nitride material is formed over an upper surface of the first metal nitride material and side surfaces of the at least one dielectric material partially defining boundaries of the opening through a conformal deposition process. A conductive structure is formed over surfaces of the second metal nitride material within the opening. Apparatuses and electronic systems are also described.
    Type: Application
    Filed: June 19, 2020
    Publication date: October 8, 2020
    Inventors: Kentaro Ishii, Yongjun J. Hu, Amirhasan Nourbakhsh, Durai Vishak Nirmal Ramaswamy, Christopher W. Petz, Luca Fumagalli
  • Publication number: 20200303203
    Abstract: A method of etching a film of a substrate is provided. The substrate includes an underlying region, the film and a mask. The film is provided on the underlying region. The mask is provided on the film. The method includes performing main etching on the film. The main etching is plasma etching of the film and exposes at least a part of the underlying region. The method further includes forming a protective layer on at least a side wall surface of the mask after the performing of the main etching. A material of the protective layer is different from a material of the film. The method further includes performing over-etching on the film after the forming of the protective layer. The over-etching is plasma etching of the film.
    Type: Application
    Filed: March 19, 2020
    Publication date: September 24, 2020
    Inventors: Kosuke Ogasawara, Takahisa Iwasaki, Kentaro Ishii, Seiji Ide, Chiju Hsieh
  • Publication number: 20200264388
    Abstract: An optical cable, in which a fiber optic core and tensile strength filaments are covered with a covering, is connected to a connecting element incorporated into a connector, wherein a clamping member clamps the end portion of the covering along its outer peripheral surface in a state where the covering has been removed from the end portion of the optical cable such that the fiber optic core and the tensile strength filaments are uncovered; a gripping member that grips the exposed tensile strength filaments in a state where the exposed fiber optic core passes therethrough; and a protective member that covers a range extending from the clamping member to the gripping member in the axial direction of the fiber optic core in a state where the exposed fiber optic core is connected to a connecting element of the connector while the gripping member is attached to the connector.
    Type: Application
    Filed: February 14, 2020
    Publication date: August 20, 2020
    Applicant: Hirose Electric Co., Ltd.
    Inventors: Takeshi YAMAZAKI, Kentaro ISHII, Ryozo KOYAMA, Hiroshi TANOOKA
  • Patent number: 10707212
    Abstract: A method of forming an apparatus comprises forming a first metal nitride material over an upper surface of a conductive material within an opening extending through at least one dielectric material through a non-conformal deposition process. A second metal nitride material is formed over an upper surface of the first metal nitride material and side surfaces of the at least one dielectric material partially defining boundaries of the opening through a conformal deposition process. A conductive structure is formed over surfaces of the second metal nitride material within the opening. Apparatuses and electronic systems are also described.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: July 7, 2020
    Assignee: Micron Technology, Inc.
    Inventors: Kentaro Ishii, Yongjun J. Hu, Amirhasan Nourbakhsh, Durai Vishak Nirmal Ramaswamy, Christopher W. Petz, Luca Fumagalli
  • Publication number: 20200212046
    Abstract: A method of forming an apparatus comprises forming a first metal nitride material over an upper surface of a conductive material within an opening extending through at least one dielectric material through a non-conformal deposition process. A second metal nitride material is formed over an upper surface of the first metal nitride material and side surfaces of the at least one dielectric material partially defining boundaries of the opening through a conformal deposition process. A conductive structure is formed over surfaces of the second metal nitride material within the opening. Apparatuses and electronic systems are also described.
    Type: Application
    Filed: December 28, 2018
    Publication date: July 2, 2020
    Inventors: Kentaro Ishii, Yongjun J. Hu, Amirhasan Nourbakhsh, Durai Vishak Nirmal Ramaswamy, Christopher W. Petz, Luca Fumagalli
  • Patent number: 10651084
    Abstract: A microelectronic device comprises a first conductive material comprising copper, a conductive plug comprising tungsten in electrical communication with the first conductive material, and manganese particles dispersed along an interface between the first conductive material and the conductive plug. Related electronic systems and related methods are also disclosed.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: May 12, 2020
    Assignee: Micron Technology, Inc.
    Inventor: Kentaro Ishii
  • Patent number: 10562523
    Abstract: A vehicle control apparatus includes a thermal load priority calculator, a stability priority calculator, and a driving force distribution controller. The thermal load priority calculator is configured to calculate a thermal load priority that prioritizes a thermal load of a motor for driving a vehicle according to an operating state of the vehicle. The stability priority calculator is configured to calculate a stability priority that prioritizes a stability of the vehicle according to an operating state of the vehicle. The driving force distribution controller is configured to control a driving force distribution in a front and a rear of the vehicle, on a basis of a result of comparing the thermal load priority and the stability priority.
    Type: Grant
    Filed: October 26, 2018
    Date of Patent: February 18, 2020
    Assignee: SUBARU CORPORATION
    Inventors: Hiroshi Ienaga, Kentaro Ishii, Akihito Katsume, Fumiyuki Moriya
  • Patent number: 10428358
    Abstract: A method of producing a chemical product includes cultivating microorganisms or culture cells in a fermentation tank; transferring a culture liquid from the fermentation tank to a membrane separation tank to filter the culture liquid through a separation membrane; and collecting a fermentation product from a filtration liquid as the chemical product while refluxing an unfiltered culture liquid that has not been filtered to be joined to the culture liquid on an upstream side of the membrane separation tank, wherein one portion of the culture liquid to be transferred from the fermentation tank is allowed to bypass the membrane separation tank depending on a pressure at a culture liquid flow-in side of the membrane separation tank.
    Type: Grant
    Filed: February 24, 2016
    Date of Patent: October 1, 2019
    Assignee: Toray Industries, Inc.
    Inventors: Takashi Mimitsuka, Kentaro Ishii, Ken Morita, Masashi Higasa, Kenji Sawai, Hideki Sawai, Katsushige Yamada, Shinichi Minegishi
  • Publication number: 20190168744
    Abstract: A vehicle control apparatus includes a thermal load priority calculator, a stability priority calculator, and a driving force distribution controller. The thermal load priority calculator is configured to calculate a thermal load priority that prioritizes a thermal load of a motor for driving a vehicle according to an operating state of the vehicle. The stability priority calculator is configured to calculate a stability priority that prioritizes a stability of the vehicle according to an operating state of the vehicle. The driving force distribution controller is configured to control a driving force distribution in a front and a rear of the vehicle, on a basis of a result of comparing the thermal load priority and the stability priority.
    Type: Application
    Filed: October 26, 2018
    Publication date: June 6, 2019
    Inventors: Hiroshi IENAGA, Kentaro ISHII, Akihito KATSUME, Fumiyuki MORIYA
  • Patent number: 10300648
    Abstract: The production method for a polyolefin-based structure of the present invention produces a polyolefin-based structure from a mixed source material containing a polyolefin (A), an acid-modified polyolefin (B) and a gas barrier resin (C) using a molding machine 10, under the condition mentioned below. The molding machine 10 is equipped with a single-screw extruder 11, a die head 12, and an adaptor 13 for feeding the mixed source material from the single-screw extruder 11 to the die head 12. Am+10° C.?T1?Cm?10° C. (1), Cm?30° C.?T2?Cm+30° C. (2), Cm?10° C.?T3?Cm+50° C. (3), Cm?30° C.?T4?Cm+30° C. (4). T1 is a cylinder temperature in a section corresponding to a supply zone 21A and a compression zone 21B, T2 is a cylinder temperature in a section corresponding to a metering zone 21C, T3 is a temperature of an adaptor 13, T4 is a temperature of a die head, Am is the melting point of the component (A), and Cm is the melting point of the component (C).
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: May 28, 2019
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kentaro Ishii, Tomonori Kato, Jun Mitadera, Kenji Kouno
  • Publication number: 20190144662
    Abstract: A polyester resin composition containing a polyester resin and 1 to 500 ppm of ultramarine based on a total amount of the polyester resin composition, wherein the polyester resin contains dicarboxylic acid structural unit and diol structural unit, the diol structural unit contain structural unit derived from a diol having a cyclic acetal skeleton, and a content of the structural unit derived from a diol having a cyclic acetal skeleton is 1 to 60 mol % based on a total amount of the diol structural unit.
    Type: Application
    Filed: May 9, 2017
    Publication date: May 16, 2019
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Takami MORISHITA, Takeshi HIROKANE, Kentaro ISHII, Tomoe MORISHITA, Hirokatsu ARAI
  • Patent number: 10273359
    Abstract: Disclosed is a polyamide resin composition, including: a polyamide (A) containing a diamine unit including 70 mol % or more of a p-xylylenediamine unit and a dicarboxylic acid unit including 70 mol % or more of a linear aliphatic dicarboxylic acid unit having 6 to 18 carbon atoms; and a filler (B), in which the polyamide (A) includes a polyamide having a phosphorus atom concentration of 50 to 1,000 ppm and a YI value of 10 or less in a color difference test in accordance with JIS-K-7105, and a content of the filler (B) is 1 to 200 parts by mass with respect to 100 parts by mass of the polyamide (A).
    Type: Grant
    Filed: September 14, 2010
    Date of Patent: April 30, 2019
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Shun Ogawa, Hisayuki Kuwahara, Shinichi Ayuba, Takahiko Sumino, Kentaro Ishii
  • Publication number: 20190048136
    Abstract: Provided is a polyester resin including a diol structural unit and a dicarboxylic acid structural unit, wherein the diol structural unit includes a structural unit derived from a diol having a cyclic acetal skeleton, a content of the structural unit derived from the diol having the cyclic acetal skeleton is 1 to 80 mol % based on the total amount of the diol structural unit, and a amount of crosslinking points in the resin chain is 1.0 wt % or less.
    Type: Application
    Filed: March 9, 2017
    Publication date: February 14, 2019
    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Takeshi HIROKANE, Takami MORISHITA, Kentaro ISHII
  • Patent number: 9886802
    Abstract: A vehicle power supply device including a power storage device includes: an inlet that is coupled to an external power supply via a charging cable when the power storage device is charged using the external power supply; an outlet that is coupled to an external device when power is supplied from the power storage device to the external device; a first power converter that is formed between the inlet and the power storage device and converts alternating current (AC) power into direct current (DC) power; a second power converter that is formed between the outlet and the power storage device and converts DC power into AC power; and a malfunction diagnosis unit that diagnoses malfunction of a power supply path in a state in which the inlet and the outlet are coupled to each other using the charging cable.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: February 6, 2018
    Assignee: SUBARU CORPORATION
    Inventors: Kentaro Ishii, Yo Masuda