Abstract: In a cover of a buckle device, an engagement hook of a side wall of an upper cover is fit together with an engagement groove of a side wall of a lower cover to assemble the upper cover to the lower cover. When the side wall of the upper cover receives an external force, a holder of a buckle switch is sandwiched between a side plate of a buckle body and a rib of the lower cover such that the side plate receives the external force. Accordingly, the rigidity at the engagement hook of the cover is able to be increased.

Abstract: A thermal analysis apparatus includes: a cylindrical heating furnace extending in an axial direction; a weight detector arranged on a rear-end side in the axial direction of the cylindrical heating furnace and including levers extending in the axial direction to detect a weight; a connecting portion for connecting the cylindrical heating furnace and the weight detector to communicate an internal space of the cylindrical heating furnace with an internal space of the weight detector and positioning the levers from the weight detector into the cylindrical heating furnace; sample holding portions connected to tip ends of the levers and arranged inside the cylindrical heating furnace and holding a sample; resistance heaters arranged to cover the weight detector and energized by an electric current of 6 A or less; and a heater control part for controlling an energization state of the resistance heaters to maintain the weight detector at a constant temperature.

Abstract: A hopper includes a receiving member having a guide surface that guides a non-flat strip-shaped sheet and a posture adjusting unit that adjusts a posture of the falling sheet and sends it to the guide surface, and a discharge unit that discharges the sheet. The posture adjusting unit may have a posture adjusting surface continuous with the guide surface and bent from the guide surface so as to form a ridge line at a boundary portion with the guide surface.

Abstract: This fluid machine includes a motor housing, a rotating shaft which is inserted through the motor housing, an impeller which is mounted on a protruding portion of the rotating shaft, and a facing portion which faces the motor housing on a first end side in the axial direction. A first opening is provided on the first end side of the motor housing, a second opening is provided on a second end side of the motor housing, and an in-housing passage fluidly couples the first opening with the second opening. The fluid machine further includes an exhaust passage which is formed between the motor housing and the facing portion and which fluidly couples the first opening with external air, and a rotating blade which is disposed between the first opening and the exhaust passage, wherein the rotating blade is mounted on the rotating shaft and is rotatable with the rotating shaft.

Abstract: A characteristic of a semiconductor device having a back electrode including an Au—Sb alloy is improved. The semiconductor device has a semiconductor substrate and the back electrode including the Au—Sb alloy layer. The back electrode is formed on the semiconductor substrate. The Sb concentration in the Au—Sb alloy layer is equal to or greater than 15 wt %, and equal to or less than 37 wt %. The thickness of the Au—Sb alloy layer is equal to or larger than 20 nm, and equal to or less than 45 nm.

Abstract: To provide a semiconductor device capable of having improved adhesion between a plating film and a wiring layer. A method of manufacturing the semiconductor device includes a step of forming a wiring layer having a surface covered with an oxide film, a step of removing a portion of the oxide film by dry etching to form, in the oxide film, a first opening for exposing a portion of the wiring layer, a step of forming a passivation film covering the wiring layer, is provided with a second opening communicated with the first opening, and is made of an insulating resin material, and a step of growing a plating film on the wiring layer exposed from the first and second openings.

Abstract: To improve the reliability of a semiconductor device. The semiconductor device includes a plurality of wiring layers formed on a semiconductor substrate, a pad formed on an uppermost wiring layer of the plurality of wiring layers, a surface protection film which includes an opening on the pad and is made of an inorganic insulating film, a rewiring formed on the surface protection film; a pad electrode formed on the rewiring, and a wire connected to the pad electrode. The rewiring includes a pad electrode mounting portion on which the pad electrode is mounted, a connection portion which is connected to the pad, and an extended wiring portion which couples the pad electrode mounting portion and the connection portion, and the pad electrode mounting portion has a rectangular shape when seen in a plan view.

Abstract: Provided are a shredder assuring greater freedom in designing a feedstock supplier that supplies sheets, and a sheet manufacturing apparatus. The shredder has a feedstock supplier having a supply opening through which a sheet is supplied; and a shredding device configured to shred the sheet supplied from the feedstock supplier. The shredding device includes a rotary cutter that rotates on a first axis, and a circulating cutter that moves in an endless path and cuts the sheet in conjunction with the rotary cutter. The circulating cutter includes a conveyor configured to convey the sheet from the feedstock supplier to the rotary cutter.

Abstract: Disclosed herein are an evolved gas analyzer and a method for analyzing evolved gas, the apparatus cooling a sample holder in a short time without using excessive cooling performance and without providing the entire apparatus in an excessively large size, thereby enhancing analysis work efficiency. The apparatus 200 includes: a sample holder 20 holding a sample S; a heating unit 10 receiving the sample holder therein, and evolving a gas component G by heating the sample; a detecting means 110 detecting the gas component; a sample holder supporting unit 204L movably supporting the sample holder to move the sample holder to predetermined outer and inner positions of the heating unit; and a cooling unit 30 provided at an outside of the heating unit, and cooling the sample holder by being in direct or indirect contact with the sample holder, when the sample holder is moved to a discharging position.

Abstract: Technology improving the effect of cleaning a filter by a high pressure air current is provided. A first dust collector 27 has a housing into which a gas carrying capture material is carried; a filter 240 having a filter element 305 that captures the capture material, and an opening 305b from which air passing through the filter element 305 flows out; and an injector having a nozzle with an injection opening that injects a gas, moves the nozzle to a position in contact with the opening, and injects the gas from the injection opening 305b when the nozzle is in contact with the opening 305b.

Abstract: In a cover of a buckle device, an engagement hook of a side wall of an upper cover is fit together with an engagement groove of a side wall of a lower cover to assemble the upper cover to the lower cover. When the side wall of the upper cover receives an external force, a holder of a buckle switch is sandwiched between a side plate of a buckle body and a rib of the lower cover such that the side plate receives the external force. Accordingly, the rigidity at the engagement hook of the cover is able to be increased.

Abstract: An energy storage apparatus includes: energy storage devices each including an external terminal, the energy storage devices being arranged in a first direction; a bus bar including a plate-like conductive portion; and a neighboring member disposed between the energy storage devices. The conductive portion includes: a fusible portion where a width size, which is a size in a second direction orthogonal to the first direction, is defined by a pair of edges, the width size being smaller than a width size of other portions of the conductive portion; and a pair of enlarged width portions contiguously formed with both sides of the fusible portion in the first direction, a width size of the pair of enlarged width portions increasing in a direction away from the fusible portion.

Abstract: To provide a semiconductor device capable of having improved adhesion between a plating film and a wiring layer. A method of manufacturing the semiconductor device includes a step of forming a wiring layer having a surface covered with an oxide film, a step of removing a portion of the oxide film by dry etching to form, in the oxide film, a first opening f exposing a portion of the wiring layer, a step of forming a passivation film covering the wiring layer, is provided with a second opening communicated with the first opening, and is made of an insulating resin material, and a step of growing a plating film on the wiring layer exposed from the first and second openings.

Abstract: Provided are a travel assist device capable of producing, in a preferred manner, warning vibrations notifying deviation of a vehicle with respect to a travel path, and a method of controlling the same. A travel assist device includes a travel assist control device that notifies a driver about an anti-deviation direction or a deviation direction by making a steering angular acceleration in the deviation direction and the steering angular acceleration in the anti-deviation direction different from each other when producing warning vibrations, wherein a time-derivative value of a steering angle of a steering wheel is defined as a steering angular velocity, and a time-derivative value of the steering angular velocity is defined as the steering angular acceleration.

Abstract: A buckle device includes a buckle into which a tongue of a seatbelt device is inserted and that engages with the tongue, a magnetic sensor that is provided to the buckle and that detects nearby changes in magnetism; and an antenna that is provided to the buckle, that is configured to be able to at least transmit an electrical signal to outside of the buckle or receive an electrical signal from outside of the buckle, that is disposed overlapping at least a portion of the magnetic sensor, and that is configured to be able to suppress electromagnetic waves or magnetism from the outside of the buckle from influencing the magnetic sensor.

Abstract: A thermal analyzer is provided with: a furnace tube; a pair of sample holders; a heating furnace; a measurement chamber; and a measurement unit arranged inside the measurement chamber. The sample holders are arranged inside the furnace tube and are provided with mounting faces on which a pair of sample containers are mounted respectively. The heating furnace has an opening through which a measurement sample is observable, the opening being located at a position above the center of a virtual segment which connects centers of gravity of the mounting faces of the sample holders. The opening is formed to have a size, as viewed in a direction perpendicular to the axial direction and the mounting faces, of 7 mm or more in the direction along the virtual segment and of 3 mm or more in the direction perpendicular to the virtual segment.

Abstract: A temperature detecting device is equipped with an insertion hole structure for guiding a case which is inserted from outside into a holder that covers an outer wall of a battery cell, to the outer wall of the battery cell. In this insertion structure, a plurality of load distribution portions, specifically a first structure and a second structure, are formed at the periphery of an opening of an insertion hole. The load is generated upon abutment on a foreign matter that is about to enter through the insertion hole toward the battery cell. The load distribution portions distribute and release a load to the periphery of the opening.

Abstract: To improve the reliability of a semiconductor device. The semiconductor device includes a plurality of wiring layers formed on a semiconductor substrate, a pad formed on an uppermost wiring layer of the plurality of wiring layers, a surface protection film which includes an opening on the pad and is made of an inorganic insulating film, a rewiring formed on the surface protection film; a pad electrode formed on the rewiring, and a wire connected to the pad electrode. The rewiring includes a pad electrode mounting portion on which the pad electrode is mounted, a connection portion which is connected to the pad, and an extended wiring portion which couples the pad electrode mounting portion and the connection portion, and the pad electrode mounting portion has a rectangular shape when seen in a plan view.

Abstract: A via hole is accurately formed in an interlayer insulating film over a metal wiring. Of emission spectra of plasma to be used for dry etching of the interlayer insulating film, the emission intensities of at least CO, CN, and AlF are monitored such that an end point of the dry etching of the interlayer insulating film is detected based on the emission intensities thereof.

Abstract: Disclosed herein is a method for analyzing evolved gas and an evolved gas analyzer, the method correcting detection sensitivity differences in analysis devices, day-to-day variations thereof, thereby quantifying a measurement target with high accuracy. The method for analyzing evolved gas of the apparatus including: a sample holder; a heating unit evolving a gas component; an ion source generating ions by ionizing the gas component; a mass spectrometer detecting the gas component; and a gas channel through which mixed gas flows, the method including: operating a discharged flow rate controlling process of controlling a flow rate of the mixed gas discharged to outside; operating a sample holder cooling process of cooling the sample holder by bringing the sample holder into contact with a cooling unit; and operating a correction process including: correcting a mass spectrum position; calculating a sensitivity correction factor; and calculating a heating correction factor.