Patents by Inventor Kentaro Yoshida

Kentaro Yoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12210317
    Abstract: A toner including: a toner particle containing a binder resin and a colorant; and a fine particle on a surface of the toner particle, wherein the fine particle is a solid and substantially hemispherical shape, and has a substantially flat surface and a curved surface, and wherein a number-average value of a longest diameter “w” of the substantially flat surface is 10 to 400 nm. An external additive for a toner that is a solid and substantially hemispherical shape, and has a substantially flat surface and a curved surface, wherein a number-average value of a longest diameter “w” of the substantially flat surface is 10 to 400 nm. A fine particle that is a solid and substantially hemispherical shape, and has a substantially flat surface and a curved surface, wherein a number-average value of a longest diameter “w” of the substantially flat surface is 10 to 400 nm.
    Type: Grant
    Filed: October 8, 2021
    Date of Patent: January 28, 2025
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Sara Yoshida, Yusuke Kosaki, Taiji Katsura, Hidekazu Fumita, Kentaro Yamawaki, Itaru Kondo
  • Patent number: 12212255
    Abstract: Provided are an electric motor control device and an electric motor control method with high reliability capable of performing noise reduction control (or sensorless control) by superimposing a radio-frequency voltage and capable of performing compensation of a dead time of an inverter with a minimum necessary configuration.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: January 28, 2025
    Assignee: HITACHI ASTEMO, LTD.
    Inventors: Shun Taniguchi, Kentaro Matsuo, Kenichi Yoshida, Toshiyuki Ajima
  • Publication number: 20250004673
    Abstract: According to one embodiment, an image forming apparatus includes a printer configured to print images on media, a tag reader-writer configured to communicate with wireless tags on the media, a communication interface to communicate with an external apparatus, and a processor. The processor is configured to receive print data via the communication interface from the external apparatus, extract a tag reader-writer command from the received print data, control the printer to print an image on a medium according to drawing data in the received print data, and control the tag reader-writer according to the extracted tag reader-writer command to perform an operation on a wireless tag on the medium.
    Type: Application
    Filed: March 1, 2024
    Publication date: January 2, 2025
    Inventor: Kentaro YOSHIDA
  • Publication number: 20240422914
    Abstract: Provided is a technique capable of reducing wiring inductance of a smoothing capacitor. A circuit pattern electrically connected to a semiconductor element is provided on an insulating substrate on a cooler. A smoothing capacitor is disposed not to be overlapped with the semiconductor element in a plan view to include an inner electrode forming capacitance, a capacitor case housing the inner electrode, and a terminal protruding from the capacitor case seamlessly. A first sealing portion covers at least a part of each of the terminal of the smoothing capacitor, the insulating substrate, and the circuit pattern. The terminal of the smoothing capacitor and the circuit pattern are directly connected to each other by bonding force of an interface between the terminal and the circuit pattern.
    Type: Application
    Filed: April 3, 2024
    Publication date: December 19, 2024
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yosuke NAKATA, Yuji SATO, Kentaro YOSHIDA, Kei HAYASHI
  • Publication number: 20240399721
    Abstract: Present disclosure provides a multilayer structure including a layer structure (X) and a layer structure (Y) which are laminated via a water-soluble layer (A).
    Type: Application
    Filed: September 22, 2022
    Publication date: December 5, 2024
    Applicant: Kuraray Co., Ltd.
    Inventors: Satoshi ISHIUCHI, Kentaro YOSHIDA
  • Patent number: 12151287
    Abstract: A method for manufacturing a sintered component is provided. The method includes a step of making a green compact having a relative density of at least 88%. The green compact is made by compression-molding a base powder containing a metal powder into a metallic die. The method includes a step of machining a groove part in the green compact. The groove part is processed in the green compact by a cutting tool and has a groove width of 1.0 mm or less. A step of sintering the green compact in which the groove part is machined occurs after the step of machining the groove part.
    Type: Grant
    Filed: September 2, 2022
    Date of Patent: November 26, 2024
    Assignee: SUMITOMO ELECTRIC SINTERED ALLOY, LTD.
    Inventors: Kentaro Yoshida, Shoichi Takada, Hirofumi Kiguchi
  • Patent number: 12142135
    Abstract: [Object] To provide a technology capable of presenting various haptic sensations to a user. [Solving Means] A haptic presentation apparatus according to the present technology includes: a first deformable layer; a second deformable layer; and a drive unit. The first deformable layer is positioned on a front surface side. The second deformable layer is positioned inward of the first deformable layer. The drive unit is driven to control outflow and inflow of fluid between a first space and a second space, the first space retaining the fluid between the first deformable layer and the second deformable layer, the second space retaining the fluid inward of the second deformable layer.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: November 12, 2024
    Assignee: SONY GROUP CORPORATION
    Inventors: Kentaro Yoshida, Hironobu Abe, Masaki Orihashi
  • Patent number: 12135022
    Abstract: [Object] To provide a fluid control apparatus having a diaphragm structure and small flow path resistance. [Solving Means] A fluid control apparatus according to the present technology includes a first space, two flat plate members, a drive mechanism, a second space, a first check valve, and a second check valve. The first space has an inlet and an outlet. The two flat plate members face each other via the first space, and at least one of the flat plate members is an elastic body having flexibility. The drive mechanism bends the elastic body. The second space adjoins the first space, communicates with the first space via the inlet, and has a suction port. The first check valve allows fluid to flow from the suction port to the first space via the inlet. The third space adjoins the first space, communicates with the first space via the outlet, and has a discharge port. The second check valve allows the fluid to flow from the first space to the discharge port via the outlet.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: November 5, 2024
    Assignee: Sony Group Corporation
    Inventors: Hiroshi Suzuki, Masahiro Sato, Koji Fukumoto, Yuya Horiuchi, Hironobu Abe, Hiroto Kawaguchi, Kazuhiro Hongo, Takuma Matsushita, Daisuke Mizuta, Kentaro Yoshida
  • Patent number: 12091532
    Abstract: Provided is an ethylene-vinyl alcohol copolymer with an ethylene unit content of 15 to 60 mol % and a saponification degree of 85 mol % or more.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: September 17, 2024
    Assignee: KURARAY CO., LTD.
    Inventors: Kentaro Yoshida, Masako Katayama
  • Publication number: 20240249097
    Abstract: A medium processing device includes a conveying mechanism, an RFID device, and a processor. The processor controls the RFID device to perform a write process on first and second RFID tags of at least one medium conveyed by the conveying mechanism when the first and second RFID tags are moved to a write position along a conveyance path of the at least one medium, and a read process on the first and second RFID tags after the at least one medium is further conveyed along the conveyance path of the at least one medium by the conveying mechanism. The RFID device includes an antenna by which the RFID device communicates with the RFID tags and is configured to set a communication range of the antenna to a first communication range during the write process and to a second communication range wider than the first communication range during the read process.
    Type: Application
    Filed: January 18, 2024
    Publication date: July 25, 2024
    Inventor: Kentaro YOSHIDA
  • Publication number: 20240053828
    Abstract: In order to provide a tactile presentation apparatus and a tactile presentation system that are capable of presenting a high-quality tactile sense with shape and pressure distribution controlled with respect to a contact object, a tactile presentation apparatus according to the present technology includes a contact portion, a peripheral portion, a retaining portion, a first driving portion, and a second driving portion. The contact portion includes a central portion having a first contact surface and a connection portion having a second contact surface, the second contact surface being flexible and continuous with the first contact surface. The peripheral portion is connected to the central portion through the connection portion. The retaining portion that supports the contact portion and the peripheral portion.
    Type: Application
    Filed: December 21, 2021
    Publication date: February 15, 2024
    Inventor: KENTARO YOSHIDA
  • Publication number: 20240026872
    Abstract: A fluid control apparatus includes a flow-path space forming portion, an inflow opening, an outflow opening, and a drive mechanism. The flow-path space forming portion includes a flexible portion that have flexibility, and a facing portion that faces the flexible portion, the flow-path space forming portion forming a flow path space between the flexible portion and the facing portion, the flow path space being a flow path of fluid. The inflow opening is provided to an outer peripheral portion of the flow path space, as viewed from a facing direction in which the flexible portion and the facing portion face each other, the inflow opening being an opening through which the fluid flows into the flow path space.
    Type: Application
    Filed: November 9, 2021
    Publication date: January 25, 2024
    Inventors: HIROTO KAWAGUCHI, HIROSHI SUZUKI, KENTARO YOSHIDA
  • Patent number: 11868532
    Abstract: A shape changeable apparatus according to an embodiment of the present technology includes a space forming section, a fluid controller, a signal emitter, a detector, and a generator. The space forming section forms a space, and includes a deformable member that is arranged in contact with the space. The fluid controller is capable of deforming the member by controlling a flow of fluid with respect to the space. The signal emitter emits a signal into the space. The detector is arranged out of contact with the member within the space, and detects the emitted signal. The generator generates information regarding the deformation of the member on the basis of a result of the detection performed by the detector.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: January 9, 2024
    Assignee: SONY GROUP CORPORATION
    Inventors: Kentaro Yoshida, Masahiro Sato
  • Publication number: 20240003960
    Abstract: The object is to provide a technology for enabling reduction in the size of a semiconductor device. The semiconductor device includes a first semiconductor element and a second semiconductor element. An output of the first semiconductor element is connected to an output of the second semiconductor element through wiring. A main current flows through the first semiconductor element, and a sensing current flows through the second semiconductor element. The sensing current has a correlation with the main current. The semiconductor device further includes a current sensor. The current sensor senses the sensing current flowing through the second semiconductor element in a contactless manner.
    Type: Application
    Filed: February 2, 2021
    Publication date: January 4, 2024
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kentaro YOSHIDA, Kei HAYASHI, Fumio WADA
  • Patent number: 11813823
    Abstract: The present invention relates to a multilayer structure at least an outer layer and an inner layer which contain a polypropylene resin as a main component, a barrier resin layer containing an ethylene-vinyl alcohol copolymer as a main component, and a metal deposited layer containing aluminum as a main component; a packaging material for a retort therewith; a method for recovering the multilayer structure; and a recovered composition comprising a recovered material of the multilayer structure. There is provided a multilayer structure exhibiting excellent recyclability and excellent appearance, gas barrier ability and shading performance both before and after retorting treatment, and a packaging material for a retort therewith.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: November 14, 2023
    Assignee: KURARAY CO., LTD.
    Inventors: Kentaro Yoshida, Makoto Suzuki
  • Publication number: 20230347631
    Abstract: The present disclosure provides a multilayer structure in which a layer (A) made of a polyolefin resin composition (a), an oxygen barrier layer (B) and a sealant layer (C) are laminated in this sequence.
    Type: Application
    Filed: September 9, 2021
    Publication date: November 2, 2023
    Applicant: KURARAY CO., LTD.
    Inventors: Takeshi Sakano, Kentaro Yoshida, Satoshi Ishiuchi, Tatsuya Oshita
  • Publication number: 20230294380
    Abstract: There is provided a multilayer film having a structure in which a layer (X) is an outermost layer and at least the layer (X), a layer (Y), and a layer (Z) are adjacently laminated in sequence, wherein the layer (X) is made of a resin composition (A) comprising a vinyl alcohol polymer (a) having a melting point of lower than 150° C. as a main component; the layer (Y) comprises an adhesive resin (B) having a melting point of lower than 150° C. as a main component; the layer (Z) comprises a polyolefin resin (C) having a melting point of lower than 150° C. as a main component; and the resin composition (A) comprises alkali metal ions (b) in 25 to 1500 ppm. Such a multilayer film is suitably used as a gas barrier film because it has excellent appearance and interlayer adhesiveness even while having a vinyl alcohol polymer as an outermost layer.
    Type: Application
    Filed: June 24, 2021
    Publication date: September 21, 2023
    Applicant: KURARAY CO., LTD.
    Inventors: Masahiro Kitamura, Kentaro Yoshida, Wout Luyten
  • Publication number: 20230155012
    Abstract: The semiconductor device according to the present disclosure has features (1) to (3) below. The feature (1) is that “a lower surface of an on-chip bonding material has a shape matching a surface shape of a main current wiring connection region in plan view”. The feature (2) is that “an emitter sense wiring is directly connected to a side surface of the main current wiring connection region”. The feature (3) is that “an IGBT chip has an ineffective region in which the IGBT does not function in a region below an emitter sense pad and the emitter sense wiring”.
    Type: Application
    Filed: May 21, 2020
    Publication date: May 18, 2023
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kentaro YOSHIDA, Koichiro KISU
  • Publication number: 20230154808
    Abstract: A semiconductor apparatus includes: a base plate; an insulating circuit board including a ceramic substrate, a circuit pattern formed on an upper surface of the ceramic substrate, a metal layer formed on a lower surface of the ceramic substrate and fixed on an upper surface of the base plate with a first joint material; a semiconductor device having a first surface fixed on the circuit pattern with a second joint material and a second surface which is an opposite surface of the first surface; a lead frame fixed on the second surface with a third joint material; and a case fixed to an outer edge portion of the base plate and enclosing the semiconductor device, wherein restoring force acts on the insulating circuit board in a direction of warpage that is convex upward, and restoring force acts on the base plate in a direction of warpage that is convex downward.
    Type: Application
    Filed: October 23, 2020
    Publication date: May 18, 2023
    Applicant: Mitsubishi Electric Corporation
    Inventors: Masaki KURACHI, Tatsuya KAWASE, Kentaro YOSHIDA
  • Publication number: 20230150236
    Abstract: There is provided a multilayer structure comprising at least a barrier resin layer (X) and an inorganic barrier layer (Y) with a thickness of 500 nm or less which is adjacent to the barrier resin layer (X), wherein the layer (X) is made of a resin composition (x) comprising an ethylene-vinyl alcohol copolymer (A) and a polyamide (B) in a mass ratio (A/B) of 55/45 to 98/2, and the ethylene-vinyl alcohol copolymer (A) has an ethylene content of 20 to 46 mol % and a saponification degree of 90 mol % or more. Thus, there can be provided a multilayer structure having excellent gas barrier properties and appearance even after being subjected to stretching process or retorting process followed by bending process, and a packaging material for retort therewith.
    Type: Application
    Filed: April 22, 2021
    Publication date: May 18, 2023
    Applicant: KURARAY CO., LTD.
    Inventor: Kentaro Yoshida